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Method of making an electronic assembly having a flexible circuit wrapped around a substrate

  • US 5,362,656 A
  • Filed: 04/15/1994
  • Issued: 11/08/1994
  • Est. Priority Date: 12/02/1992
  • Status: Expired due to Fees
First Claim
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1. A method of constructing an electronic assembly, comprising the steps of:

  • a) providing a substrate that has a top surface and a bottom surface;

    b) mounting an electrical device to said top surface of said substrate;

    c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a metal pad;

    d) wrapping said flexible circuit around said substrate such that said metal pad is adjacent to said bottom surface of said substrate; and

    ,e) bonding said flexible circuit to said substrate.

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