Method of making an electronic assembly having a flexible circuit wrapped around a substrate
First Claim
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1. A method of constructing an electronic assembly, comprising the steps of:
- a) providing a substrate that has a top surface and a bottom surface;
b) mounting an electrical device to said top surface of said substrate;
c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a metal pad;
d) wrapping said flexible circuit around said substrate such that said metal pad is adjacent to said bottom surface of said substrate; and
,e) bonding said flexible circuit to said substrate.
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Abstract
An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
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Citations
8 Claims
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1. A method of constructing an electronic assembly, comprising the steps of:
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a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a metal pad; d) wrapping said flexible circuit around said substrate such that said metal pad is adjacent to said bottom surface of said substrate; and
,e) bonding said flexible circuit to said substrate. - View Dependent Claims (2, 3, 4)
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5. A method of constructing an electronic assembly, comprising the steps of:
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a) providing a substrate that has a top surface and a bottom surface; b) mounting an electrical device to said top surface of said substrate; c) attaching leads of a flexible circuit to said electrical device, said flexible circuit having a hole that provides access to a conductive line that extends from said lead; d) wrapping said flexible circuit around said substrate such that said hole is adjacent to said bottom surface of said substrate; e) bonding said flexible circuit to said substrate; f) placing a solder preform into said hole of said flexible circuit; g) heating said solder preform until said solder attains a liquid form; and
,h) cooling said solder until said solder attains a solid form. - View Dependent Claims (6, 7, 8)
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Specification