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Micro soldering system for electronic components

  • US 5,364,011 A
  • Filed: 04/06/1994
  • Issued: 11/15/1994
  • Est. Priority Date: 04/05/1993
  • Status: Expired due to Fees
First Claim
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1. An micro soldering system for attaching an electronic component to a substrate, comprising:

  • a soldering tool including a dispensing orifice assembly for dispensing a controlled quantity of molten solder at one or more sites on the component or the substrate or both so that the component is attached to the substrate mechanically and electrically upon solidification of the molten solder without physical contact between the dispensing orifice assembly and the one or more sites; and

    means for controlling the soldering tool in response to process control parameters so that the controlled quantity of molten solder is dispensed by a pressure pulse through a non-oxidizing atmosphere.

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