Tungsten-plug process

• US 5,364,817 A
• Filed: 05/05/1994
• Issued: 11/15/1994
• Est. Priority Date: 05/05/1994
• Status: Expired due to Fees

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Lin, Liang-Chih, Lur, Water, Huang, Cheng-Han, Chang, Shih-Chanh
• Primary Examiner(s): QUACH, TUAN N
• Application Number:
  US08/238,664
• Time in Patent Office: 194 Days
• Field of Search: 437/190, 437/192, 437/195, 437/947, 437/982, 257/751, 257/753, 257/763
• US Class Current: 438/644
• CPC Class Codes: H01L 21/28512 on semiconductor bodies comprising elements of Group IV of the Periodic Table

Abstract

A method of metallization using a tungsten plug is described. A contact hole is opened to the semiconductor substrate through an insulating layer covering semiconductor structures in and on the semiconductor substrate. A glue layer is deposited conformally over the surface of the insulating layer and within the contact opening. A tungsten plug is formed within the contact opening. The glue layer is removed except for portions of the glue layer underneath the tungsten plug and on the lower sides of the tungsten plug. Ditches are left on the upper sides of the tungsten plug where the glue layer has been removed. The ditches around the tungsten plug are filled with a dielectric material. A second metallization is deposited and patterned. The patterned second metallization does not extend over one side portion of the tungsten plug; that is, there is no dog-bone formation. There is no junction damage through the side portion of the tungsten plug not covered by the second metallization because the dielectric material filling the ditches protects the glue layer from being etched away. In a second embodiment of the invention, after the contact hole is opened, the insulating layer is reflowed forming an overhang around the contact hole. A glue layer is deposited conformally over the surface of the insulating layer and within the contact opening. A tungsten plug is formed within the contact opening.

Claims

1. A method of forming tungsten plug metallization without dog-bone and without junction damage in the fabrication of integrated circuits comprising:

providing semiconductor structures in and on a semiconductor substrate;

providing an insulating layer covering said semiconductor structures wherein a contact hole has been opened through said insulating layer to said semiconductor substrate;

depositing a glue layer conformally over the surface of said insulating layer and within said contact opening;

forming a tungsten plug within said contact opening;

removing said glue layer except for portions of said glue layer underneath said tungsten plug and portions of said glue layer on the lower sides of said tungsten plug wherein ditches are left on the upper sides of said tungsten plug where said glue layer has been removed;

filling said ditches around said tungsten plug with a dielectric material;

depositing a second metallization over said insulating layer and said tungsten plug;

patterning said second metallization wherein said patterned second metallization does not extend over one side portion of said tungsten plug;

that is, there is no dog-bone formation; and

wherein there is no junction damage through said side portion of said tungsten plug not covered by said second metallization because said dielectric material filling said ditches protects said glue layer from being etched away completing fabrication of said integrated circuit.

2. The method of claim 1 wherein said glue layer is composed of titanium nitride and has a thickness of between about 300 to 2000 Angstroms.

3. The method of claim 1 wherein said glue layer is composed of titanium tungsten and has a thickness of between about 300 to 2000 Angstroms.

4. The method of claim 1 wherein portions of said glue layer are removed by wet etching in a solution of NH4OH:

H2O2;

H2O for between about 3 to 10 minutes.

5. The method of claim 1 wherein portions of said glue layer are removed by dry etching with chemicals in a group comprising HBr, Cl2, and 02.

6. The method of claim 1 wherein said filling ditches around said tungsten plug comprises the steps of:

depositing a dielectric material by chemical vapor deposition over the surface of said substrate; and

etching back said dielectric material wherein said dielectric material fills said ditches and is removed from all other surfaces of said substrate.

7. The method of claim 1 wherein said dielectric material is silicon dioxide.

8. The method of claim 1 wherein said dielectric material is silicon nitride.

9. The method of claim 1 wherein said dielectric material is silicon oxynitride (SiNxOy).

10. The method of claim 1 wherein said second metallization is aluminum.

11. The method of claim 1 wherein said second metallization is aluminum alloy.

12. A method of forming tungsten plug metallization without dog-bone and without junction damage in the fabrication of integrated circuits comprising:

providing semiconductor structures in and on a semiconductor substrate;

providing an insulating layer covering said semiconductor structures wherein a contact hole has been opened through said insulating layer to said semiconductor substrate;

reflowing said insulating layer wherein an overhang forms on either side of said contact hole;

depositing a glue layer conformally over the surface of said insulating layer and within said contact opening;

forming a tungsten plug within said contact opening wherein a keyhole void is formed within said tungsten plug;

depositing a second metallization over said insulating layer and said tungsten plug;

patterning said second metallization wherein said patterned second metallization does not extend over one side portion of said tungsten plug;

that is, there is no dog-bone formation; and

wherein there is no junction damage through said side portion of said tungsten plug not covered by said second metallization because said overhang of said insulating material protects said glue layer from being etched away;

completing fabrication of said integrated circuit.

13. The method of claim 12 wherein said insulating layer is composed of borophosphosilicate glass.

14. The method of claim 12 wherein said insulating layer is composed of borosilicate glass.

15. The method of claim 12 wherein said insulating layer is composed of phosphosilicate glass.

16. The method of claim 12 wherein said insulating layer is reflowed in a furnace at a temperature of between about 850°

to 950°

C. for between about 10 to 60 minutes in a nitrogen ambient.

17. The method of claim 12 wherein said insulating layer is reflowed by rapid thermal annealing at a temperature of between about 95°

to 1050°

C. for between about 10 to 60 seconds.

18. The method of claim 12 wherein said glue layer is composed of titanium nitride and has a thickness of between about 300 to 2000 Angstroms.

19. The method of claim 12 wherein said glue layer is composed of titanium tungsten and has a thickness of between about 300 to 2000 Angstroms.

20. The method of claim 12 wherein said keyhole void within said tungsten plug is formed by the conformal chemical vapor deposition of tungsten within said contact hole with said overhanging insulating layer and wherein said keyhole void causes the release of stress within said tungsten plug.