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Surface mount assembly of devices using AdCon interconnections

  • US 5,365,656 A
  • Filed: 05/14/1993
  • Issued: 11/22/1994
  • Est. Priority Date: 09/06/1991
  • Status: Expired due to Term
First Claim
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1. A process for mounting at least one electronic device having electrical contacts onto an interconnection substrate having electrical conductors so as to establish an electrical interconnection between said contacts and said conductors, which comprises:

  • applying an adhesive over a region on the interconnection substrate, said region including conductors to be electrically connected to contacts of said at least one device,forming an assembly of said at least one device and said interconnection substrate by placing said at least one device on the interconnection substrate such that the contacts of said at least one device are in alignment with the conductors in said region of the substrate,enclosing the assembly within a cavity provided with a resiliently stretchable membrane positioned above the assembly,applying fluid pressure to said membrane so as to stretch the membrane and force portions of the membrane into a conformable engagement with said at least one device and areas of the substrate at least adjacent to said at least one device, the membrane forcing the contacts of said at least one device toward the conductors of the substrate, andapplying heat to said assembly such that said adhesive forms an electrical and mechanical interconnection between the contacts of the device and conductors of the substrate.

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