Surface mount assembly of devices using AdCon interconnections
First Claim
1. A process for mounting at least one electronic device having electrical contacts onto an interconnection substrate having electrical conductors so as to establish an electrical interconnection between said contacts and said conductors, which comprises:
- applying an adhesive over a region on the interconnection substrate, said region including conductors to be electrically connected to contacts of said at least one device,forming an assembly of said at least one device and said interconnection substrate by placing said at least one device on the interconnection substrate such that the contacts of said at least one device are in alignment with the conductors in said region of the substrate,enclosing the assembly within a cavity provided with a resiliently stretchable membrane positioned above the assembly,applying fluid pressure to said membrane so as to stretch the membrane and force portions of the membrane into a conformable engagement with said at least one device and areas of the substrate at least adjacent to said at least one device, the membrane forcing the contacts of said at least one device toward the conductors of the substrate, andapplying heat to said assembly such that said adhesive forms an electrical and mechanical interconnection between the contacts of the device and conductors of the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A process of batch assembly of sundry leaded or padded devices, encapsulated and non-encapsulated, onto a printed wiring board (PWB), which exhibit significant improvements in both manufacturability and reliability. A pressure frame assembly apparatus permits an application of uniformly distributed pressures to a variety of leaded packages and padded semiconductor chips during cure of conductive adhesives (AdCons), and leads to the reduction of variations in initial interconnection resistance, and thereby to the enhancement of the reliability of AdCon interconnections. The pressures are applied to the devices by an external application of a fluid under pressure to a flexible, resiliently stretchable membrane which conformably envelops outlines of the devices and adjacent areas of the PWB. Application of vacuum suction to within the cavity, formed by the pressure frame and the membrane, prior to the external application of the fluid pressure to the membrane, further improving the reliability of surface mounted assembly of packages on the interconnection board. The external application of pressure enhances thermal conductivity needed for curing the AdCon, increases the range of processing parameters usable for this technique and reduces assembly times. Assembly yields approaching 100% were observed for a variety of surface mounted packages indicating that the system will be highly reliable.
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Citations
29 Claims
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1. A process for mounting at least one electronic device having electrical contacts onto an interconnection substrate having electrical conductors so as to establish an electrical interconnection between said contacts and said conductors, which comprises:
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applying an adhesive over a region on the interconnection substrate, said region including conductors to be electrically connected to contacts of said at least one device, forming an assembly of said at least one device and said interconnection substrate by placing said at least one device on the interconnection substrate such that the contacts of said at least one device are in alignment with the conductors in said region of the substrate, enclosing the assembly within a cavity provided with a resiliently stretchable membrane positioned above the assembly, applying fluid pressure to said membrane so as to stretch the membrane and force portions of the membrane into a conformable engagement with said at least one device and areas of the substrate at least adjacent to said at least one device, the membrane forcing the contacts of said at least one device toward the conductors of the substrate, and applying heat to said assembly such that said adhesive forms an electrical and mechanical interconnection between the contacts of the device and conductors of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A process for mounting at least one electronic device having electrical contacts onto an interconnection substrate having electrical conductors so as to establish an electrical interconnection between said contacts and said conductors, which comprises:
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forming an assembly of said at least one device and said interconnection substrate by applying an adhesive over a region on the interconnection substrate, said region including conductors to be electrically connected to contacts of said at least one device, placing said at least one device on the interconnection substrate such that the contacts of said device are in alignment with the conductors in said region of the substrate, enclosing the assembly within a cavity provided with a membrane positioned above the assembly, said membrane being resiliently stretchable so that, upon application of a vacuum within the cavity or a fluid pressure to the membrane, portions of the membrane engage said at least one device forcing the contacts of the device toward the conductors of the substrate, applying vacuum suction to a space within the cavity so as to draw the membrane toward and into an engaging contact with said at least one device, and applying heat and pressure to said at least one device such that said adhesive forms an electrical and mechanical interconnection between the contacts of the device and conductors of the substrate. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification