×

Method and apparatus for protection of conductive surfaces in a plasma processing reactor

  • US 5,366,585 A
  • Filed: 01/28/1993
  • Issued: 11/22/1994
  • Est. Priority Date: 01/28/1993
  • Status: Expired due to Term
First Claim
Patent Images

1. In a process chamber in which a processing plasma is generated adjacent to a substrate held on a substrate holder, the improvement comprising a free-standing, electrically insulative liner disposed adjacent to metallic walls of said process chamber facing said processing plasma.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×