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Environmentally safe methods and apparatus for depositing and/or reclaiming a metal or semi-conductor material using sublimation

  • US 5,366,764 A
  • Filed: 06/15/1992
  • Issued: 11/22/1994
  • Est. Priority Date: 06/15/1992
  • Status: Expired due to Fees
First Claim
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1. A method for depositing a material onto at least one substrate within a chamber comprising the steps of:

  • a. providing at least one substrate within said chamber;

    b. providing at least one source material within said chamberc. providing a secondary emission surface within said chamber;

    d. heating said source material;

    e. vaporizing said source material to create a vaporized source material;

    f. depositing a portion of said vaporized source material on said secondary emission surface;

    g. heating said secondary emission surface to a temperature at which re-vaporization of said originally vaporized source material occurs;

    h. re-emitting said deposited source material from said secondary emission surface; and

    i. depositing said re-emitted source material onto said substrate.

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