Method of making a multi-layer circuit assembly
First Claim
Patent Images
1. A method of making a multi-layer circuit assembly comprising the steps of:
- (a) stacking elements including a plurality of circuit panels having electrical conductors thereon and at least one generally lamellar interposer so that one said interposer is disposed between each pair of adjacent circuit panels and so that major surfaces of said interposers confront major surfaces of said circuit panels, so that preselected interconnect locations on the major surfaces of each said interposer are aligned with interconnect locations on the confronting major surfaces of adjacent circuit panels, and so that electrically conductive material carried on said circuit panels abuts electrically conductive material on said interposer at each set of aligned interconnect locations, at least some of the conductive material at each set of aligned interconnect locations being flowable;
(b) causing said flowable conductive material to flow and join said conductive material on said circuit panels and said interposer into continuous electrical conductors extending between adjacent circuit panels at said aligned interconnect locations; and
(c) capturing flowable electrically conductive material at each set of aligned interconnect locations in at least one reservoir within at least one of said elements, at least one said element including a flowable dielectric material extending over at least one major surface, the method further comprising the step of causing said flowable dielectric material to flow into intimate contact with an immediately adjacent major surface of one of said elements concomitantly with the step of causing said conductive material to flow, so that said flowable dielectric materials fills irregularities on such surface of said element, at least some of said flowable dielectric material being captured in said reservoirs along with said flowable conductive material.
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Abstract
A multi-layer circuit panel assembly is formed by laminating circuit panels with interposers incorporating flowable conductive material at interconnect locations and a flowable dielectric materials at locations other than the interconnect locations. Excess materials are captured in reservoirs such as within vias in the circuit panels and apertures in interior elements within the interposers. The flowable materials of the interposers, together with the reservoirs, allow the interposers to compress and take up tolerances in the components. The flowable dielectric material encapsulates conductors on the surfaces of the circuit panels.
145 Citations
16 Claims
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1. A method of making a multi-layer circuit assembly comprising the steps of:
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(a) stacking elements including a plurality of circuit panels having electrical conductors thereon and at least one generally lamellar interposer so that one said interposer is disposed between each pair of adjacent circuit panels and so that major surfaces of said interposers confront major surfaces of said circuit panels, so that preselected interconnect locations on the major surfaces of each said interposer are aligned with interconnect locations on the confronting major surfaces of adjacent circuit panels, and so that electrically conductive material carried on said circuit panels abuts electrically conductive material on said interposer at each set of aligned interconnect locations, at least some of the conductive material at each set of aligned interconnect locations being flowable; (b) causing said flowable conductive material to flow and join said conductive material on said circuit panels and said interposer into continuous electrical conductors extending between adjacent circuit panels at said aligned interconnect locations; and (c) capturing flowable electrically conductive material at each set of aligned interconnect locations in at least one reservoir within at least one of said elements, at least one said element including a flowable dielectric material extending over at least one major surface, the method further comprising the step of causing said flowable dielectric material to flow into intimate contact with an immediately adjacent major surface of one of said elements concomitantly with the step of causing said conductive material to flow, so that said flowable dielectric materials fills irregularities on such surface of said element, at least some of said flowable dielectric material being captured in said reservoirs along with said flowable conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of making a multi-layer circuit assembly comprising the steps of:
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(a) stacking a plurality of circuit panels and at least one generally lamellar interposer so that each said interposer is disposed between two adjacent circuit panels and so that major surfaces of two adjacent circuit panels, so that preselected interconnect locations on each said interposer are aligned with interconnect locations on the confronting circuit panel surfaces, so that flowable dielectric material on the major surfaces of each said interposer abuts the confronting circuit panel surfaces except at said interconnect locations, and so that electrically conductive material carried on said circuit panels abuts electrically conductive material on said interposer at said aligned interconnect locations, at least some of said electrically conductive material being flowable; (b) causing said flowable dielectric material to flow and conform to the major surfaces of said circuit panels so that said flowable dielectric material substantially fills irregularities on the major surfaces of said circuit panels; and (c) causing said flowable conductive material to flow and join said conductive material on said circuit panels and said interposer into continuous electrical conductors extending between said circuit panels; each said interposer including a generally sheet-like interior element and said flowable dielectric material on opposite surfaces of such interior element, each said interior element having apertures, flowable dielectric material of each said interposer penetrating into such apertures during said step of causing said dielectric material to flow. - View Dependent Claims (13, 14)
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15. A method of making a multi-layer circuit assembly comprising the steps of:
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(a) stacking a plurality of circuit panels and at least one generally lamellar interposer so that each said interposer is disposed between two adjacent circuit panels and so that major surfaces of each said interposer confront major surfaces of two adjacent circuit panels so that preselected interconnect locations on each said interposer are aligned with interconnect locations on the confronting circuit panel surfaces, so that flowable dielectric material on the major surfaces of each said interposer abuts the confronting circuit panel surfaces except at said interconnect locations, and so that electrically conductive material carried on said circuit panels abuts electrically conductive material on said interposer at said aligned interconnect locations, at least some of said electrically conductive material being flowable; (b) causing said flowable dielectric material to flow and conform to the major surfaces of said circuit panels so that said flowable dielectric material substantially fills irregularities on the major surfaces of said circuit panels; and (c) concomitantly with step (b) causing said flowable conductive material to flow and join said conductive material on said circuit panels and said interposer into continuous electrical conductors extending between said circuit panels, at least one of said circuit panels having raised electrical conductors extending along at least one of its major surfaces and depressions between said raised conductors, said flowable dielectric material substantially filling said depressions. - View Dependent Claims (16)
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Specification