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Method of making a multi-layer circuit assembly

  • US 5,367,764 A
  • Filed: 12/31/1991
  • Issued: 11/29/1994
  • Est. Priority Date: 12/31/1991
  • Status: Expired due to Term
First Claim
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1. A method of making a multi-layer circuit assembly comprising the steps of:

  • (a) stacking elements including a plurality of circuit panels having electrical conductors thereon and at least one generally lamellar interposer so that one said interposer is disposed between each pair of adjacent circuit panels and so that major surfaces of said interposers confront major surfaces of said circuit panels, so that preselected interconnect locations on the major surfaces of each said interposer are aligned with interconnect locations on the confronting major surfaces of adjacent circuit panels, and so that electrically conductive material carried on said circuit panels abuts electrically conductive material on said interposer at each set of aligned interconnect locations, at least some of the conductive material at each set of aligned interconnect locations being flowable;

    (b) causing said flowable conductive material to flow and join said conductive material on said circuit panels and said interposer into continuous electrical conductors extending between adjacent circuit panels at said aligned interconnect locations; and

    (c) capturing flowable electrically conductive material at each set of aligned interconnect locations in at least one reservoir within at least one of said elements, at least one said element including a flowable dielectric material extending over at least one major surface, the method further comprising the step of causing said flowable dielectric material to flow into intimate contact with an immediately adjacent major surface of one of said elements concomitantly with the step of causing said conductive material to flow, so that said flowable dielectric materials fills irregularities on such surface of said element, at least some of said flowable dielectric material being captured in said reservoirs along with said flowable conductive material.

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