Silicon-on-insulator capacitive surface micromachined absolute pressure sensor

• US 5,369,544 A
• Filed: 04/05/1993
• Issued: 11/29/1994
• Est. Priority Date: 04/05/1993
• Status: Expired due to Term

• Current Assignee: University of Michigan
• Original Assignee: Ford Motor Company
• Inventors: Mastrangelo, Carlos H.
• Primary Examiner(s): Reynolds, Bruce A.
• Assistant Examiner(s): Mills, Gregory L.
• Application Number:
  US08/043,044
• Time in Patent Office: 603 Days
• Field of Search: 361/283.1, 361/283.4, 361/328-330, 73/715, 73/724, 73/718, 73/716, 73/721, 29/25.42, 257/419, 257/415
• US Class Current: 361/283.4
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm

Abstract

A method and structure for forming a capacitive transducer having a deformable single crystal diaphragm. A first well region is formed within a semiconductor substrate in an SOI wafer having a sacrificial layer of known thickness and a top single-crystal silicon layer thereon. Next, a silicon epitaxial layer is deposited on the top silicon layer for forming a flexible single crystal membrane. The epitaxial layer and the sacrificial layer are masked and etched to define the flexible diaphragm. An electrical insulating conformal support layer is deposited on the substrate and attached to the diaphragm so as to seal the sacrificial layer therebetween. An access opening is etched through the diaphragm, and then a wet etchant is inserted through the access opening for removing the sacrificial layer, thereby defining a diaphragm cavity between the remaining epitaxial layer and the substrate. The thickness of the diaphragm cavity is substantially equal to the thickness of the sacrificial layer removed from the SOI wafer. Conductive ions are diffused into facing sections of the diaphragm and the first well of the substrate so as to define fixed and deformable electrodes of the sensing capacitor. Next, a plug is selectively deposited within and for sealing the access opening without substantially reducing the volume of the diaphragm cavity. In this manner, a deflection of the flexible diaphragm in response to variations between the ambient pressure and the pressure sealed within the diaphragm cavity causes a o corresponding change in the capacitance between the first well region and the conductive region in the diaphragm. A reference capacitive sensor of similar construction is also provided for ratiometric pressure measurements. A pressure transducer manufactured in accordance with this process is also described.

Claims

1. An absolute pressure capacitive sensor comprising:

a substrate base of semiconductor material including a first well and a diffused conductive area defined therein for functioning as a first electrode,

a flexible diaphragm comprising a single crystal silicon layer grown on a sacrificial layer of predetermined thickness over said base so as to be generally contiguous with said first electrode, said diaphragm including a flexible diffused conductive area therein for cooperating as a second electrode with said first electrode for forming therebetween a capacitor having a capacitance variable responsive to the relative displacement of said diaphragm,

an electrically insulative support, coupled to said base and said diaphragm, for positioning and sealing a peripheral section of said diaphragm above said base by said predetermined thickness after said sacrificial layer is removed for forming a sealed diaphragm cavity therebetween,

a bore communicating through said diaphragm and into said diaphragm cavity, and

a plug for being coupled within said bore so as to seal said diaphragm cavity such that a predetermined pressurized stress is induced on said diaphragm by the pressure within said diaphragm cavity, whereby a change in the ambient pressure will cause a deflection of said diaphragm and a corresponding change in the capacitance defined between said first and second electrodes.

2. The capacitive sensor as described in claim 1 wherein said plug further includes SiO₂, deposited by a PECVD process, as a sealant for said diaphragm cavity.

3. The capacitive sensor as described in claim 1 wherein said first conductive area and said first flexible conductive area comprise conductive dopant materials diffused into juxtaposed surfaces of said first well in said substrate and said flexible diaphragm which define said diaphragm cavity therein.

4. The capacitive sensor as described in claim 1 further including an electrically insulative layer deposited onto surfaces of said first and second electrodes, thereby preventing an electrical short in the event of a deflection of said diaphragm causing contact with said base.

5. The capacitive sensor as described in claim 3 wherein said sacrificial layer of predetermined thickness comprises an oxide of silicon in a Silicon On Insulator (SOI) wafer.

6. The capacitive sensor as described in claim 5 wherein said predetermined thickness ranges from between 0.5 and 1.0 micrometers.

7. The capacitive sensor as described in claim 1 further including a corresponding, paired reference capacitive sensor comprising:

a reference conductive area diffused within a second well in said substrate base for forming a reference electrode spaced from but generally adjacent to said first conductive area,

a second flexible diaphragm comprising a single crystal silicon layer grown on said sacrificial layer of predetermined thickness over said base so as to be generally contiguous with said reference conductive area, said second diaphragm including a second flexible diffused conductive area therein for cooperating with said reference electrode for forming therebetween a reference capacitor having a capacitance that does not change responsive to a change in the ambient pressure,

a second electrically insulative support, coupled to said base and said second diaphragm, for positioning and sealing a peripheral section of said second diaphragm above said base by said predetermined thickness after said sacrificial layer is removed for forming a second sealed diaphragm cavity therebetween,

a second bore communicating through said second diaphragm and into said second diaphragm cavity, and

a second plug for being coupled within said second bore so as to screen said second bore from the passage of solids therethrough while allowing said second diaphragm cavity to breathe, whereby the reference capacitor will provide a standard capacitance independent of ambient pressure changes.

8. The capacitive sensor as described in claim 7 wherein said reference conductive area and said second flexible conductive area comprise diffused electrodes including conductive dopant materials therein.

9. The capacitive sensor as described in claim 8 wherein said reference conductive area, said second flexible diaphragm, said second flexible conductive area, and said second diaphragm cavity have physical constructions that are generally identical with corresponding elements including said first conductive area, said first flexible diaphragm, said first flexible conductive area, and said first diaphragm cavity.

10. An absolute pressure capacitive sensor comprising:

a substrate base of semiconductor material including a first well and a diffused planar conductive area defined therein for functioning as a first electrode,

a flexible diaphragm comprising a single crystal silicon layer grown on a sacrificial layer of predetermined thickness over said base so as to be generally contiguous and juxtaposed with said first electrode, said diaphragm including a flexible diffused planar conductive area therein for cooperating as a second electrode with said first electrode for forming therebetween a capacitor having a capacitance that varies responsive to the relative displacement of said diaphragm,

an electrically insulative support, coupled between said base and said diaphragm, for supporting and sealing a peripheral section of said diaphragm above said base by a distance equal to said predetermined thickness after said sacrificial layer is removed for forming a sealed diaphragm cavity therebetween, and for maintaining said first electrode generally parallel to said second electrode,

a bore communicating through said diaphragm and into said diaphragm cavity, and

a plug coupled within said bore so as to seal said diaphragm cavity such that a predetermined pressurized stress is induced on said diaphragm by the pressure within said diaphragm cavity, whereby a change in the ambient pressure will cause a deflection of said diaphragm and a corresponding change in the capacitance defined between said first and second electrodes.

11. The capacitive sensor as described in claim 10 further including an electrically insulative layer deposited onto surfaces of said first and second electrodes, thereby preventing an electrical short in the event of a deflection of said diaphragm causing contact with said base.

12. The capacitive sensor as described in claim 10 further including a corresponding paired reference capacitive sensor comprising:

a second well in said substrate base having a reference conductive area diffused therein for forming a reference electrode spaced from but generally adjacent to said first conductive area,

a second flexible diaphragm comprising a single crystal silicon layer grown on said sacrificial layer of predetermined thickness over said base so as to be generally contiguous and juxtaposed with said reference conductive area, said second diaphragm including a second flexible diffused planar conductive area therein for cooperating with said reference electrode for forming therebetween a reference capacitor having a capacitance that does not vary responsive to a change in the ambient pressure,

a second electrically insulative support, coupled between said base and said second diaphragm, for supporting and sealing a peripheral section of said second diaphragm above said base by said predetermined thickness after said sacrificial layer is removed for forming a second sealed diaphragm cavity therebetween,

a second bore communicating through said second diaphragm and into said second diaphragm cavity, and

a second plug for being coupled within said second bore so as to screen said second bore from the passage of solids therethrough while allowing said second diaphragm cavity to breathe, whereby said reference capacitor will provide a standard capacitance independent of ambient pressure changes.

13. The capacitive sensor as described in claim 12 wherein said reference conductive area, said second flexible diaphragm, said second flexible conductive area, and said second diaphragm cavity are generally identical with corresponding elements including said first conductive area, said first flexible diaphragm, said first flexible conductive area, and said first diaphragm cavity.

14. Absolute pressure and reference capacitive sensors comprising:

a substrate base of semiconductor material including a first well and a diffused planar conductive area defined therein for functioning as a first electrode,

a flexible diaphragm comprising a single crystal silicon layer grown on a sacrificial layer of predetermined thickness over said base so as to be generally contiguous and juxtaposed with said first electrode, said diaphragm including a flexible diffused planar conductive area therein for cooperating as a second electrode with said first electrode for forming therebetween an absolute pressure capacitor having a capacitance that varies responsive to the relative displacement of said diaphragm,

an electrically insulative support, coupled between said base and said diaphragm, for supporting and sealing a peripheral section of said diaphragm above said base by a distance equal to said predetermined thickness after said sacrificial layer is removed for forming a sealed diaphragm cavity therebetween and for maintaining said first electrode generally parallel to such second electrode,

a bore communicating through said diaphragm and into said diaphragm cavity,

a plug deposited within said bore so as to seal said diaphragm cavity such that a predetermined pressurized stress is induced on said diaphragm by the pressure within said diaphragm cavity, whereby a change in the ambient pressure will cause a deflection of said diaphragm and a corresponding change in the capacitance of said absolute pressure capacitor,

a second well in said substrate base having a reference conductive area diffused therein for forming a reference electrode spaced from but generally adjacent to said first conductive area,

a second flexible diaphragm comprising a single crystal silicon layer grown on said sacrificial layer of predetermined thickness over said base so as to be generally contiguous and juxtaposed with said reference conductive area, said second diaphragm including a second flexible diffused planar conductive area therein for cooperating with said reference electrode for forming therebetween a reference capacitor having a capacitance that does not vary responsive to a change in the ambient pressure,

a second electrically insulative support, coupled between said base and said second diaphragm, for supporting and sealing a peripheral section of said second diaphragm above said base by said predetermined thickness after said sacrificial layer is removed for forming a second sealed diaphragm cavity therebetween,

a second bore communicating through said second diaphragm and into said second diaphragm cavity, and

a second plug for being coupled within said second bore so as to screen said second bore from the passage of solids therethrough while allowing said second diaphragm cavity to breathe, whereby said reference capacitor will provide a standard capacitance independent of the pressure changes causing a change in capacitance in said absolute pressure capacitor.

15. The capacitive sensor as described in claim 14 wherein said reference conductive area, said second flexible diaphragm, said second flexible conductive area, and said second diaphragm cavity are generally identical with corresponding elements including said first conductive area, said first flexible diaphragm, said first flexible conductive area, and said first diaphragm cavity.

16. The capacitor sensor as described in claim 14, wherein said flexible diaphragm and said second flexible diaphragm are coplanar after being etched from a common single crystal silicon layer on a silicon on insulator substrate.