Rapidly curing adhesive and method

• US 5,371,178 A
• Filed: 12/03/1993
• Issued: 12/06/1994
• Est. Priority Date: 10/24/1990
• Status: Expired due to Term

• Current Assignee: National Starch and Chemical Investment Holding Corporation
• Original Assignee: Johnson Matthey Incorporated (Johnson Matthey PLC)
• Inventors: Nguyen, My N.
• Primary Examiner(s): Kight, III, John
• Assistant Examiner(s): COONEY, JOHN M
• Application Number:
  US08/162,390
• Time in Patent Office: 368 Days
• Field of Search: 528/362, 528/92, 528/363, 528/422, 252/512, 252/514, 428/208
• US Class Current: 528/362
• CPC Class Codes: C08G 73/0661 characterised by the catalyst used
• CPC Class Codes: C09J 179/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29355 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/4828 Conductive organic material or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: Y10T 428/24909 : Free metal or mineral containing

Abstract

Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.

Claims

1. A rapidly curing adhesive for bonding a semiconductor device to a substrate capable of being cured in less than five minutes at 200°

C. consisting essentially of a cyanate ester vehicle, an active hydrogen compound from the group of aromatic amines and alkylphenols, a metal-containing curing catalyst and a small but effective amount of silver to act as a co-catalyst to facilitate the rapid curability of said adhesive, said silver being present in an amount of not greater than about 20 wt. % and selected from the group consisting of uncoated flake and powder particles and flake and powder particles coated with a surfactant, and mixtures thereof, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

7. A rapidly curing adhesive according to claim 1 wherein silver is present in an amount of 4 to 20 wt. %.

8. A rapidly curing adhesive according to claim 1 wherein silver is present in an amount of 10 to 20 wt. %.

9. A rapidly curing adhesive according to claim 1 wherein said active hydrogen compound is present in an amount of 0.5 to 6 parts per hundred of cyanate ester.

14. A rapidly curing adhesive according to claim 1 wherein the tap density of the silver particles is 2 to 5 g/cc.

2. A method of reducing the curing time at a temperature less than its glass transition temperature of cyanate ester-containing adhesives used for bonding a semiconductor device to a substrate to less than five minutes at 200°

C., said adhesive consisting essentially of 10 to 40 wt. % cyanate ester vehicle, 0.1 to 2 wt. % alkylphenol, and 0.01 to 0.1 wt. % of a metal-containing curing catalyst, said method comprising adding to said adhesive a small but effective amount of a co-curing catalyst comprising commercially pure silver in an amount not greater than about 20 wt. %, said silver selected from the group consisting of uncoated flake and powder particles and flake and powder particles coated with a surfactant, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

10. A method according to claim 2 wherein the commercially pure silver is added to said adhesive in an amount of 4 to 20 wt. %.

11. A method according to claim 2 wherein commercially pure silver is added to said adhesive in an amount of 10 to 20 wt. %.

3. A rapidly curing adhesive for bonding a semiconductor device to a substrate capable of being cured in less than five minutes at a temperature of 200°

C. consisting essentially of a cyanate ester vehicle and an amount of silver to act as a co-catalyst to facilitate the rapid curability of said adhesive, said silver being present in an amount of 60 to 90 wt. % and selected from the group consisting of uncoated flake and powder particles and flake and powder particles coated with a surfactant, and mixtures thereof, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

4. A method of reducing the curing time at a temperature less than its glass transition temperature of cyanate ester-containing adhesives used for bonding a semiconductor device to a substrate to less than five minutes at a temperature of 200°

C., said method comprising adding to said adhesive 60 to 90 wt. % commercially pure silver, said silver selected from the group of uncoated flake and powder particles and flake and powder particles coated with a surfactant, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

5. A rapidly curing adhesive for bonding a semiconductor device to a substrate capable of being cured in less than five minutes at 200°

C. consisting essentially of 10 to 40 wt. % cyanate ester vehicle and an amount of silver which is effective to facilitate the rapid curability of said adhesive, said silver being present as particles in an amount of not greater than about 90 wt. % and selected from the group consisting of uncoated flake and powder and flake and powder coated with a surfactant, and mixtures thereof, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

12. A rapidly curing adhesive according to claim 5 wherein silver is present in an amount of 20 to 90 wt. %.

6. A method of reducing the curing time at a temperature less than its glass transition temperature of cyanate ester-containing adhesives used for bonding a semiconductor device to a substrate to less than five minutes at 200°

C., said method comprising adding to said adhesive up to 90 wt. % commercially pure silver, said silver selected from the group of uncoated flake and powder particles and flake and powder particles coated with a surfactant, said particles having a particle size within the range of 0.1 to 50 μ

m and a surface area of 0.1 to 2 m² /g.

13. A method according to claim 6 wherein silver is added in amount of up to 20 wt. %.