Three dimensional high performance interconnection package

• US 5,371,654 A
• Filed: 10/19/1992
• Issued: 12/06/1994
• Est. Priority Date: 10/19/1992
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Lauro, Paul A., Fogel, Keith E., Shih, Da-Yuan, Shi, Leathen, Beaman, Brian S., Doany, Fuad E., Ritsko, John J., Norcott, Maurice H., Walker, George F., Hedrick, James L. Jr.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Whang, Young
• Application Number:
  US07/963,346
• Time in Patent Office: 778 Days
• Field of Search: 361/386, 361/387, 361/388, 361/396, 361/397, 361/401, 361/412, 361/414, 361/417, 361/420, 361/709, 361/713, 361/736, 361/744, 361/748, 361/761, 361/792, 361/810, 361/807, 174/16.3, 174/52.4, 174/255, 174/256, 174/261, 439/68, 428/901, 165/185
• US Class Current: 361/744
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45155 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/45164 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/78301 : Capillary
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/85214 : using a laser
• CPC Class Codes: H01L 23/49827 : Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5384 : Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/20756 : larger or equal to 60 microns less than 70 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/20758 : larger or equal to 80 microns less than 90 microns
• CPC Class Codes: H01L 2924/20759 : larger or equal to 90 microns less than 100 microns
• CPC Class Codes: H01L 2924/2076 : equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10S 29/029 : Molding with other step
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49192 : with insulation removal
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

Claims

1. A three dimensional electronic package structure comprising:

a plurality of assemblies;

each of said plurality of assemblies comprises a substrate having a first and second opposing surface and a plurality of electronic devices disposed on at least one of said first and said second surfaces;

each of said plurality of assemblies is disposed adjacent another of said plurality of assemblies so that one of said first and said second opposing surfaces of one of said adjacent assemblies is adjacent one of said first and said second opposing surfaces of the other of said adjacent assemblies;

an electrical interconnection means is disposed between said adjacent assemblies;

said electrical interconnection means comprises a dielectric material having first and second opposing surfaces and a plurality of electrical conductors extending from said first to said second opposing surface of said electrical interconnection means;

said electrical interconnection means provides electrical interconnection between said adjacent assemblies.

2. The structure of claim 1, wherein a dielectric layer of said electrical interconnection means is formed from an elastomeric material.

3. The structure of claim 2, wherein said elastomeric material has regions containing foam and solid materials.

4. The structure of claim 3, wherein said regions are a blend of said foam and said solid material.

5. The structure of claim 1, further including a means for pressing said plurality of assemblies together so that said electrical interconnection means is compressed between said adjacent assemblies.

6. The structure of claim 1, further including a heat sink in thermal contact with said substrates of each of said plurality of assemblies.

7. The structure of claim 1, further including a heat dissipation means in thermal contact with said structure.

8. The structure of claim 1, wherein said substrate is selected from the group consisting of a ceramic substrate, a glass ceramic substrate, a diamond substrate, a polymeric substrate, a glass substrate and a metal substrate and a silicon substrate.

9. The structure of claim 1, wherein said substrate is thermally conductive.

10. The structure of claim 1, wherein said electrical interconnection means has a plurality of electrical contact locations on said first and said second opposing surfaces of said electrical interconnection means and wherein said conductors are in electrical communication with said plurality of electrical contact locations.

11. The structure of claim 10, wherein said plurality of electrical contact locations are in electrical communication with a plurality of electrical contact locations on said adjacent assemblies.

12. The structure of claim 1, wherein each of said plurality of electrical conductors has an enlarged end at said first and said second opposing surfaces of said electrical interconnection means.

13. The structure of claim 12, wherein said enlarged end at one of said first and second opposing surfaces of said electrical interconnection means is sphere and spheroid.

14. The structure of claim 13, wherein said enlarged end at the other of said first and second opposing surfaces of said electrical interconnection means is hemispherical and hemispheroidal having a flattened face with a projection on said flattened face.

15. The structure of claim 1, wherein said structure is a three dimensional electronic packaging structure.

16. The structure according to claim 1, wherein each of said plurality of electrical conductors has an enlarged end at least one of said first and second opposing surfaces of said electrical interconnection means, said enlarged end having a flattened surface.

17. The structure comprising:

a first and second assembly;

an electrical interconnection means;

said first assembly is disposed adjacent said second assembly so that a first surface of said first assembly is adjacent a second surface of said second assembly;

each of said first and second assemblies comprises;

a substrate having first and second opposing faces;

a substrate contains electrical conductors;

said first surface and said second surface have a plurality of electrical contact locations disposed thereon;

a plurality of electronic devices disposed on said first surface;

said electrical interconnection means comprises;

a layer of elastomeric material having first and second opposing surfaces;

said layer has a plurality of apertures extending from said first surface to said second surface of said layer;

a plurality of electrical contact locations on a first side and a second side of said layer electrically interconnected by a plurality of conductors extending from said first surface to said second surface of said layer;

said electrical interconnection means is disposed on said first side of said first substrate so that said electronic devices on said first surface of said first substrate are disposed in said apertures in said electrical interconnection means;

said electrical contact locations on said second side of said layer of said electrical interconnection means are electrically interconnected with electrical contact locations on said first side of said substrate of said first assembly;

said electrical contact locations on said first side of said layer of said electrical interconnection means are electrically interconnected with electrical contact locations on said second side of said substrate of said second assembly.

18. The structure of claim 17, wherein said substrate is formed from a material selected from the group consisting of diamond and diamond-like materials.

19. The structure of claim 18, further including a means for pressing said first and said second assembly together to press said electrical interconnection means therebetween.

20. The structure of claim 19, further including a heat dissipation means in thermal contact with said structure.

21. The structure of claim 20, wherein said heat dissipation means is in thermal contact with said substrate of said first and said second assembly.

22. A structure comprising:

a substrate having a plurality of contact locations thereon;

an electrical interconnection means;

said electrical interconnection means comprises a dielectric material having first and second opposing surfaces and a plurality of electrical conductors extending from said first to said second opposing surfaces of said electrical interconnection means;

each of said plurality of electrical conductors has a first end at said first surface;

each of said first ends of said plurality of conductors has a protuberance with a flattened surface;

said flattened surface is in electrical contact with at least one of said plurality of contact locations.

23. The structure according to claim 22, wherein said flattened surface has a projection thereon.

24. The structure according to claim 22, wherein said dielectric material is an elastomeric material.

25. The structure according to claim 22, wherein said second end has a protuberance thereat.