Apparatus for degolding or tinning conductive portions of a microelectronic device
First Claim
1. An apparatus for processing a microelectronic device having a face with electrically conductive elements arranged thereon, comprising a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl, wherein the bowl has an upper rim which extends in a horizontal plane, said upper rim being formed by an upwardly directed edge extending therealong, said upwardly directed edge forming an acute angle of from 15°
- to 60°
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Accused Products
Abstract
The apparatus is used for processing a microelectronic device having a face with electrically conductive elements arranged thereon. The apparatus comprises a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl. The bowl has an upper rim with an upwardly directed acute angled edge extending therealong.
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Citations
19 Claims
- 1. An apparatus for processing a microelectronic device having a face with electrically conductive elements arranged thereon, comprising a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl, wherein the bowl has an upper rim which extends in a horizontal plane, said upper rim being formed by an upwardly directed edge extending therealong, said upwardly directed edge forming an acute angle of from 15°
- 9. An apparatus for processing a microelectronic device having a face with electrically conductive elements arranged thereon, comprising a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, and drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl, wherein the bowl has an upper rim which extends in a horizontal plane, said upper rim being formed by an upwardly directed edge extending therealong, said upwardly directed edge comprising a surface tapering downwardly from said edge to a surface of said bowl.
- 16. An apparatus for processing a microelectronic device having a face with electrically conductive elements arranged thereon, comprising a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device holder for holding the microelectronic device with said face directed downwardly, drive means for moving the bowl and the device holder vertically with respect to each other, thereby allowing said conductive elements to be immersed in molten solder drawn by the bowl, and means for causing the device holder to spin about a substantially vertical axis with a first phase of submitting the device holder to a selected angular acceleration, a second phase, having a selected duration, of spinning the device holder at a selected maximum rotational velocity, and a third phase of submitting the device holder to a selected angular deceleration, wherein the bowl has an upper rim which extends in a horizontal plane, said upper rim being formed by an upwardly directed edge extending therealong.
Specification