Electroplating process and composition

• US 5,374,346 A
• Filed: 08/09/1993
• Issued: 12/20/1994
• Est. Priority Date: 08/09/1993
• Status: Expired due to Fees

• Current Assignee: Rohm and Haas Company (Dow, Inc.)
• Original Assignee: Rohm and Haas Company (Dow, Inc.)
• Inventors: Robinson, John, Colangelo, Carl, Rousseau, Michael, Bladon, John J.
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Wong, Edna
• Application Number:
  US08/104,801
• Time in Patent Office: 498 Days
• Field of Search: 205/123, 205/124, 205/125, 205/210, 205/920, 205/159, 427/421, 427/424, 427/427, 427/96, 427/97, 427/307, 156/666
• US Class Current: 205/125
• CPC Class Codes: H05K 2203/0353 Making conductive layer thin, e.g. by etching selective thinning for providing different thickness H05K2203/0369
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/424 by direct electroplating
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates

Abstract

A process of electroplating comprising formation of a semiconductive coating over an article having both metallic and non-metallic portions, dissolving the metal surface underlying the semiconductive coating and removing the semiconductive coating by a high pressure water spray. The process is useful for the formation of printed circuit boards.

Claims

1. A process for preparing an article for electroplating, said process comprising the steps of providing an article having metallic surfaces and surfaces that are electrically nonconductive;

coating surfaces of said article with a non-metallic, semiconductive, liquid permeable layer;

contacting said article with an etchant capable of dissolving said metallic surfaces without removing said semiconductive layer for a time sufficient to dissolve at least the top layer of said metallic surfaces; and

contacting said article with an aqueous spray at a spray pressure of at least 100 pounds per square inch.

2. The process of claim 1 where the spray pressure is at least 180 pounds per square inch.

3. The process of claim 1 where the spray impinges on the article at an angle of about 90°

.

4. The process of claim 1 where the article is a flat panel.

5. The process of claim 4 where the article passes through the spray on a horizontal plane.

6. The process of claim 5 where the article is sprayed above and below the panel.

7. The process of claim 4 where the flat panel has holes passing through the panel from one surface to the other and said holes are coated with said semiconductive coating.

8. The process of claim 4 where the article is sprayed from spray bars having multiple spray nozzles disposed above and below the panel.

9. The process of claim 8 where the spray nozzle is a fan or conical spray nozzle.

10. The process of claim 9 where the spray nozzle is a fan nozzle with a fan angle not exceeding 30°

.

11. A process for formation of a primed circuit board, said process comprising the steps of providing a copper clad printed circuit board base material having an array of holes therein;

coating surfaces of said circuit board base material with a non-metallic, semiconductive, liquid permeable layer;

contacting said circuit board base material with an etchant capable of dissolving copper without dissolving said semiconductive layer for a time sufficient to dissolve at least the top layer of said copper surface;

contacting said circuit board base material with an aqueous spray at a spray pressure of at least 100 pounds per square inch to remove said semiconductive layer from all copper surfaces; and

electroplating said circuit board base material.

12. The process of claim 11 where said circuit board base material is conveyed through the etchant and the liquid spray on a horizontal plane.

13. The process of claim 11 where said semiconductive layer is a sulfide.

14. The process of claim 13 where the sulfide is a metallic sulfide.

15. The process of claim 14 where the sulfide is palladium sulfide.

16. The process of claim 11 where the minimum pressure is at least 180 pounds per square inch at the surface of the board.

17. The process of claim 16 where the minimum spray pressure is defined by the following equation:

##EQU3## where X is spray pressure in psi, T is the thickness of the circuit board substrate in mils, D is the diameter of the smallest through-holes in the board in mils and Y is 50.

18. The process of claim 17 where Y is 100.

19. The process of claim 11 where the spray impinges on the circuit board base material at an angle of 90°

.

20. The process of claim 11 where the circuit board base material is sprayed above and below the panel from fan or conical spray nozzles having a fan angle not exceeding 30°

.

21. The process of claim 20 where the angle does not exceed 20°

.

22. The process of claim 18 where the circuit board base material is sprayed from spray bars having multiple spray heads disposed above and below the panel.

23. The process of claim 22 where the spray bars above and below the panel are staggered whereby the through-holes within the circuit board base material are not simultaneously contacted by the spray from above and below the panel.

24. The process of claim 22 where the spray bar above the circuit board base material is separated from the spray bar beneath the circuit board base material by a distance of at least two inches in a horizontal path in which the circuit board base material is moving.

25. The process of claim 21 where the spray nozzles are no greater than two inches from the circuit board base material.