Heat sink apparatus

• US 5,375,655 A
• Filed: 03/31/1993
• Issued: 12/27/1994
• Est. Priority Date: 03/31/1993
• Status: Expired due to Fees

• Current Assignee: Yong N. Lee
• Original Assignee: Yong N. Lee
• Inventors: Lee, Yong N.
• Primary Examiner(s): Flanigan, Allen J.
• Application Number:
  US08/040,864
• Time in Patent Office: 636 Days
• Field of Search: 165/80.3, 165/185, 174/16.3, 361/697, 361/709, 361/710, 361/690
• US Class Current: 165/185
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/027 with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An improved heat sink apparatus that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to a different or higher temperature stage or condition of energy. The apparatus includes a thermally conductive base plate, a plurality of thick corrugated finned assembly components constructed and arranged in abutting relationship and offset from each other so as to cause a circuitous path of fluid flow therethrough. The apparatus also may include the base plate and a plurality of thick, sawtooth shaped, or segmented fins mounted thereon. The length of fluid travel from one finned component to an abutting finned component along the heat transfer surface is controlled in order to prevent development of thermal boundary layer on the inner surface of the finned assembly components.

Claims

1. A heat sink apparatus comprising

base plate means for thermal conduction therethrough,

a plurality of elongate fin assembly means mounted on said base plate means for thermal conduction therethrough,

each of said fin assembly means formed from a strip of thermally conductive material having a given thickness shaped into a plurality of corrugations having a given height and width wherein each of said corrugations has channel means for receiving fluid flow therethrough, and

said channel means of each said corrugation having a longitudinal dimension corresponding to the width of said corrugation greater than the thickness of said strip of thermally conductive material,

whereby when fluid flows through each of said channel means, thermal boundary layers are prevented from full development therewithin.

2. Heat sink apparatus as claimed in claim 1 comprising

cover plate means secured to said fin assembly means on a side opposite from said base plate means,

side member means secured to opposite sides of said fin assembly means so as to provide in combination with said base plate means and said cover plate means an enclosure having an inlet and outlet for fluid flow therebetween,

said enclosure being effective to direct fluid flow into said inlet, through each channel means of said corrugations of said assembly means and out said outlet of said enclosure.

3. Heat sink apparatus as claimed in claim 1 comprising

cover plate means secured to said fin assembly means on a side opposite from said base plate means,

side member means secured to opposite sides of said fin assembly means so as to provide in combination with said base plate means and said cover plate means an enclosure having an inlet and outlet for fluid flow therebetween,

said enclosure being effective to direct fluid flow into said inlet, against the width of said corrugations of said fin assembly means and out said outlet of said enclosure.

4. Heat sink apparatus as claimed in claim 1 wherein said longitudinal dimension of said channel means is of an order at least equal to the thickness of said thick strip.

5. Heat sink apparatus as claimed in claim 1 wherein said longitudinal dimension of said channel means ranges between a minimum of 0.10 inch and more than 0.50 inch.

6. Heat sink apparatus as claimed in claim 1 wherein said thickness of said strip ranges between a minimum of 0.010 inch and more than 0.10 inch.

7. Heat sink apparatus as claimed in claim 1 comprising

cover plate means secured to said fin assembly means on a side opposite from said base plate means, said cover plate means having an opening formed therein,

side member means secured to opposite sides of said fin assembly means so as to provide in combination with said base plate means and said cover plate means an enclosure having an inlet and two outlets for fluid flow therebetween,

said enclosure being effective to direct fluid flow into said inlet, through each channel means of said corrugations of said assembly means and out said outlets of said enclosure.

8. Heat sink apparatus as claimed in claim 1 comprising

cover plate means secured to said fin assembly means on a side opposite from said base plate means, said cover plate means having an opening formed therein,

side member means secured to opposite sides of said fin assembly means so as to provide in combination with said base plate means and said cover plate means an enclosure having an inlet and two outlets for fluid flow therebetween,

said enclosure being effective to direct fluid flow into said inlet against the width of said corrugations of said fin assembly means and out said outlets of said enclosure.

9. Heat sink apparatus as claimed in claim 1 comprising

cover plate means secured to said fin assembly means on a side opposite from said base plate means forming a partial enclosure about said fin assembly means, said cover plate means having an opening formed therein for receiving and discharging fluid flow therethrough,

said enclosure being effective to receive fluid flow into said opening of said cover plate means, for passage through each channel means of said corrugations of said fin assembly, against the width of said corrugations of said fin assembly means and out four sides of said partial enclosure.

10. A fin assembly component comprising

thermally conductive thick strip means for mounting on a base plate,

each of said strip means formed to provide an undulating shape having in alternating sequence a closed end portion and an open end portion forming side by side channel means for receiving flow of fluid therethrough each said undulating shape having a given width, and each said channel means having a longitudinal dimension substantially corresponding to said width, and

a plurality of said strip means arranged side-by-side in abutting relationship to each other and offset by a predetermined distance so as to prevent straight-through flow of fluid between each abutting strip means.

11. A fin assembly component as claimed in claim 10 wherein said longitudinal dimension of said channel means ranges between a minimum of 0.10 inch and more than 0.50 inch.

12. Heat sink apparatus comprising

thermally conductive base plate means,

a plurality of elongate fin assembly component means mounted side-by-side on said base plate means for thermal conductivity therebetween,

each of said fin assembly component means including a thick strip of heat conductive material formed into a plurality of heat conducting elements wherein each of said heat conducting elements has heat element pitch means and a fluid flow channel,

said plurality of said fin assembly component means arranged in abutting contact with each other and offset by a distance equal to said heat element pitch means of each said plurality of heat conducting elements, and

each said fluid flow channel of each said heat conducting element operable to receive fluid flow therethrough and having a linear dimension at least equal to the thickness of said strip of heat conductive material,

whereby when fluid flows through each said fluid flow channel thermal boundary layer is prevented from development on the inner peripheral surface of each said heat conducting element.