Method and apparatus for non-contact plasma polishing and smoothing of uniformly thinned substrates

• US 5,376,224 A
• Filed: 02/27/1992
• Issued: 12/27/1994
• Est. Priority Date: 02/27/1992
• Status: Expired due to Fees

• Current Assignee: Integrated Process Equipment Corp. (Speedfam Co., Ltd)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Zarowin, Charles B.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/842,936
• Time in Patent Office: 1,034 Days
• Field of Search: 156/643, 156/646, 156/657, 156/662, 156/345, 156/903, 156/636, 156/637, 156/639, 427/38, 427/39, 118/720, 118/723, 118/729, 118/50.1, 118/620, 134/1, 134/31, 134/32, 204/192.32, 204/192.37, 204/298.31, 204/298.33, 204/298.35
• US Class Current: 216/66
• CPC Class Codes: H01J 2237/3341 Reactive etching
• CPC Class Codes: H01J 2237/3344 isotropy
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence

Abstract

A plasma is used in conjunction with a plasma assisted chemical etching material removal tool 10 to rapidly and precisely polish and smooth a substrate without mechanically contacting the surface. The pressure of a process gas, which disassociates into reactive plasma species in the presence of an applied radio frequency field, is controlled so as to allow the selection of a primarily unidirectional or a primarily omnidirectional polishing and smoothing mechanism.

Claims

1. A material removal tool for performing unidirectional plasma assisted chemical etching reactions on the surface of a substrate so as to smooth and polish said surface, said tool comprising a reactor having:

means for generating a local plasma etching reaction at a localized region of the substrate, said means including, means for defining a plasma chamber cavity as well as means for supplying a process gas at a pressure to the plasma chamber cavity so as to cause an ionic collision mean free path of ions within a resulting plasma to be smaller than a plasma sheath thickness, and for supplying rf power to said process gas within the plasma chamber cavity so as to cause said gas to disassociate into a reactive plasma;

means for surrounding the outer periphery of the plasma chamber cavity, for suppressing plasma generation outside of said plasma chamber cavity; and

means for adjusting the position of said plasma chamber cavity with respect to said substrate so as to adjust the position of the local plasma etching reaction to a different localized region of the substrate.

2. The material removal tool of claim 1, wherein the means for supplying rf power includes a first electrode positioned within the plasma chamber cavity, and a second electrode positioned outside the plasma chamber cavity so that the substrate is positioned between the first and second electrodes so as to complete an electrical circuit for supplying rf power to the reactive gas within the plasma chamber cavity.

3. The material removal tool of claim 1, wherein the means for defining a plasma chamber cavity include a first dielectric insulator.

4. The material removal tool of claim 3, wherein the first dielectric insulator is preferably fabricated from a non-contaminating dielectric material.

5. The material removal tool of claim 1, wherein the means for supplying a reactive gas to the plasma chamber cavity includes an electrically conductive and porous gas diffuser.

6. The material removal tool of claim 1, wherein the means for surrounding the outer periphery of the plasma chamber cavity is a second dielectric insulator extending outward from the first dielectric insulator so as to insulate conductive and proximate surfaces, and thereby facilitate extinction of any plasma outside the plasma chamber cavity.

7. The material removal tool of claim 1, wherein the means for adjusting the position of said plasma chamber cavity with respect to said substrate is an X-Y positioning table.

8. A material removal tool for performing omnidirectional plasma assisted chemical etching reactions on the surface of a substrate so as to smooth and polish said surface, said tool comprising a reactor having:

means for generating a local plasma etching reaction at a localized region of the substrate, said means including, means for defining a plasma chamber cavity as well as means for supplying a process gas at a pressure to the plasma chamber cavity so as to cause the ionic collision mean free path of ions of a resulting plasma to be greater than a plasma sheath thickness, and for supplying rf power to said process gas within the plasma chamber cavity so as to cause said gas to disassociate into a reactive plasma;

means for surrounding the outer periphery of the plasma chamber cavity, for suppressing plasma generation outside of said plasma chamber cavity; and

means for adjusting the position of said plasma chamber cavity with respect to said substram so as to adjust the position of the local plasma etching reaction to a different localized region of the substrate;

9. The material removal tool of claim 8, wherein the means for supplying rf power includes a first electrotie positioned within the plasma chamber cavity, and a second electrode positioned outside the plasma chamber cavity so that the substrate is positioned between the first and second electrodes so as to complete an electrical circuit for supplying rf power to the reactive gas within the plasma chamber cavity.

10. The material removal tool of claim 8, wherein the means for defining a plasma chamber cavity include a first dielectric insulator.

11. The material removal tool of claim 10, wherein the first dielectric insulator is preferably fabricated from a non-contaminating dielectric material.

12. The material removal tool of claim 8, wherein the means for supplying a reactive gas to the plasma chamber cavity includes an electrically conductive and porous gas diffuser.

13. The material removal tool of claim 8, wherein the means for surrounding the outer periphery of the plasma chamber cavity is a second dielectric insulator extending outward from the first dielectric insulator so as to insulate conductive and proximate surfaces, and thereby facilitate extinction of any plasma outside the plasma chamber cavity.

14. The material removal tool of claim 8, wherein the means for adjusting the position of said plasma chamber cavity with respect to said substrate is an X-Y positioning table.

15. A material removal tool for performing confined plasma assisted chemical etching reactions on the surface of a substrate so as to smooth and polish said surface, comprising a reactor having:

a housing means for carrying out a local plasma etching reaction including means for controlling the temperature and pressure of the environment within the housing;

a first dielectric insulator positioned within the housing for defining a plasma chamber having a cavity for performing a local plasma etching reaction about a localized region of a substrate;

means for supplying the plasma chamber with a flow of reactive gas including a gas diffuser;

means for providing the reactive gas at pressure greater than 0.1 Torr within the plasma chamber with ff power so as to generate a plasma therein and includes a first electrode positioned within the plasma chamber cavity, an electrically conductive rf gas diffuser, and a second elect;

rode positioned outside the plasma chamber cavity so that the substrate is positioned between the first and second electrodes so as to complete an electrical circuit for supplying rf power to the reactive gas within the plasma chamber cavity;

a second dielectric insulator positioned within the housing and around the first dielectric insulator, said second dielectric insulator extending outward from the first dielectric insulator so as to insulate conductive and proximate surfaces, and thereby facilitating extinction of any plasma outside the plasma chamber cavity, and extending downward toward the substrate surface a distance shorter than the first dielectric insulator so as to allow the first dielectric insulator to create a region of high plasma and reactive flow impedance circumferentially adjacent to a site where plasma etching is occurring so that plasma outside the region is extinguished;

means for supporting the substrate; and

an X-Y positioning table means for adjusting the position of said substrate surface with respect to the plasma chamber in an orthogonal direction.

16. A method for removing material from the surface of a substrate so as to smooth and polish said surface by a unidirectional mechanism comprising the steps of:

mounting an etchable substrate surface to an electrode;

positioning a plasma etching chamber over the surface of the substrate, the precise position of the chamber dictated by the damage removal desired;

feeding a process gas stream into a feed inlet of an rf driven diffuser in said plasma etching chamber at a pressure so as to cause an ionic mean free path of the ions of a plasma formed from the disassociation of said process gas to be smaller than a plasma sheath thickness;

applying rf power to an electrode within the plasma chamber to create an rf electric field within the plasma chamber for disassociating the process gas into a reactive plasma; and

controlling the area of smoothing and polishing by relative movement between the substrate and plasma chamber.

17. The method of claim 27, wherein the pressure of the process gas is greater than 0.1 Torr.

18. A method for removing material from the surface of a substrate so as to smooth and polish said surface by an omnidirectional mechanism comprising the steps of:

mounting an etchable substrate surface to an electrode;

positioning a plasma etching chamber over the surface of the substrate, the precise position of the chamber dictated by the damage removal desired;

feeding a process gas stream into a feed inlet of an rf driven diffuser in said plasma etching chamber at a pressure so as to cause the ionic collision mean free path of ions of a resulting plasma to be greater than a plasma sheath thickness;

applying rf power to an electrode within the plasma chamber to create an rf electric field within the plasma chamber for disassociating the process gas into a reactive plasma; and

controlling the area of smoothing and polishing by relative movement between the substrate and plasma chamber.