Video endoscope with solid-state imaging device

• US 5,376,960 A
• Filed: 09/10/1992
• Issued: 12/27/1994
• Est. Priority Date: 09/10/1991
• Status: Expired due to Fees

• Current Assignee: Richard Wolf GmbH (Richard & Annemarie Wolf- Stiftung)
• Original Assignee: Richard Wolf GmbH (Richard & Annemarie Wolf- Stiftung)
• Inventors: Wurster, Helmut
• Primary Examiner(s): Chin, Tommy P.
• Assistant Examiner(s): LEE, RICHARD J
• Application Number:
  US07/943,347
• Time in Patent Office: 838 Days
• Field of Search: 358/98, 358/229, 128/6, 348/65, 348/76
• US Class Current: 348/76
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes

Abstract

A video endoscope has in its distal end region an objective lens, a semi-conductor imager assigned to it and further electronic components provided for wiring it. In order to further reduce the required diameter of the endoscope shaft compared to the known designs, the electronic components are arranged on an integral ceramic substrate, on which the conductors for joining and for connecting these parts are directly placed.

Claims

1. A video endoscope comprising an objective lens, a semiconductor imager assigned to the objective lens, electronic components, conductors for joining and connecting the electronic components to the semiconductor imager, and a ceramic substrate arranged inside and directly supported by a distal end region of an endoscope shaft of the video endoscope, said ceramic substrate being constructed as a common carrier for the objective lens, the imager and the electronic components, said ceramic substrate comprising a generally cuboid-shaped support part having a width smaller than an internal diameter of the endoscope shaft, the ceramic substrate also comprising a generally disc-shaped centering part having an end-face side connected to the support part, the centering part extending essentially vertically to a longitudinal extension of the support part and having an external contour essentially corresponding to and fixed to an internal contour of the endoscope shaft.

2. A video endoscope according to claim 1 wherein said centering part has bores for at least one of the following:

receiving light guides, introducing an auxiliary instrument, supplying rinsing liquid, and attaching electrical connections in the video endoscope.

3. A video endoscope according to claim 1 wherein the objective lens is mounted on a ceramic platelet, the ceramic platelet being attached to the support part and having bores for receiving light guides.

4. A video endoscope comprising an objective lens, a semiconductor imager assigned to the objective lens, electronic components, conductors for joining and connecting the electronic components to the semiconductor imager, and a ceramic substrate arranged inside and directly supported by a distal end region of an endoscope shaft of the video endoscope, said ceramic substrate being constructed as a common carrier for the objective lens, the imager and the electronic components, the ceramic substrate comprising a centering part having bores for at least one of the following:

receiving light guide, introducing an auxiliary instrument, supplying rinsing liquid, and attaching electrical connections in the video endoscope.

5. A video endoscope according to claim 4 wherein the ceramic substrate also comprises a support part coupled with the centering part, and wherein the objective lens is mounted on a ceramic platelet, the ceramic platelet being attached to the support part and having bores aligned with the centering part bores for receiving light guides.

6. A video endoscope comprising an objective lens, a semiconductor imager assigned to the objective lens, electronic components, conductors for joining and connecting the electronic components to the semiconductor imager, and a ceramic substrate arranged inside and directly supported by a distal end region of an endoscope shaft of the video endoscope, said ceramic substrate being constructed as a common carrier for the objective lens, the imager and the electronic components, and the objective lens being mounted on a ceramic platelet, the ceramic platelet being attached to the substrate and having bores for receiving light guides.