Method and apparatus for inspecting a solderless terminal by image processing

• US 5,377,278 A
• Filed: 03/19/1993
• Issued: 12/27/1994
• Est. Priority Date: 03/26/1992
• Status: Expired due to Term

• Current Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Ichikawa, Yoshihide
• Primary Examiner(s): Mancuso, Joseph
• Assistant Examiner(s): DEL ROSSO, GERARD DOMNICK
• Application Number:
  US08/034,771
• Time in Patent Office: 648 Days
• Field of Search: 358/106, 358/101, 358/107, 356/376, 356/394, 250/562, 382/1, 382/8, 382/18, 348/92, 348/131
• US Class Current: 382/145
• CPC Class Codes: G01N 21/8806 Specially adapted optical and illumination features
• CPC Class Codes: G01R 31/308 using non-ionising electromagnetic radiation, e.g. optical radiation investigating or analysing materials by the use of optical means G01N21/00; image analysis G06T7/00
• CPC Class Codes: H01R 43/048 Crimping apparatus or processes H01R43/042 takes precedence

Abstract

A solderless terminal inspecting method and apparatus for determining if a solderless terminal has been satisfactorily crimped against an electric conductor has a main illuminating device for illuminating a solderless terminal having illuminating elements extending in substantially the same direction as a length of a solderless terminal. The inspecting apparatus also includes an auxiliary illuminating device for illuminating a solderless terminal in a direction opposite to the illuminating direction of the main illuminating device. The apparatus also includes an illuminated image receiving device for receiving the illuminated image of the solderless terminal. The image of the solderless terminal received by the image receiving device is binary-coded by using at least one binary level determined according to an area histogram which has been obtained in advance, and an image processing device determines from the image whether the solderless terminal is correctly crimped to the electric conductor.

Claims

1. An apparatus for inspecting a solderless terminal by image processing, the solderless terminal including a resin barrel adapted to hold an end portion of an electric conductor comprised of a plurality of core wires enclosed in a resin cover, the end portion of the electric conductor having the resin cover partially removed therefrom to expose the core wires at the end portion, a core barrel and the resin barrel adapted to hold the exposed core wires of the electric conductor to electrically connect the conductor to the solderless terminal, said apparatus for inspecting a solderless terminal comprising:

main illuminating means disposed substantially parallel to a longitudinal axis of the resin barrel for illuminating the solderless terminal from a first direction, the main illuminating means having at least one illuminating element extending substantially in the same direction as a length of the solderless terminal;

auxiliary illuminating means for illuminating a background area of the solderless terminal from a second direction substantially opposite to said first direction;

image receiving means for receiving an image of the solderless terminal produced by said main illuminating means and said auxiliary illuminating means; and

image processing means for processing the image received by said image receiving means, the image processing means including means for determining whether the solderless terminal is correctly crimped to the electric conductor.

2. The apparatus of claim 1 for inspecting a solderless terminal, wherein said image is received from a direction substantially perpendicular to a longitudinal axis of the resin barrel.

3. The apparatus of claim 1 for inspecting a solderless terminal, wherein said main illuminating means comprises at least one fluorescent lamp.

4. The apparatus of claim 1 for inspecting a solderless terminal, wherein said main illuminating means comprises a plurality of light emitting diodes.

5. The apparatus of claim 1 for inspecting a solderless terminal, wherein said auxiliary illuminating means comprises a reflective board.

6. The apparatus of claim 1 for inspecting a solderless terminal, wherein said image processing means converts the image received by said image receiving means to luminance data, and said image processing means evaluates the luminance data in relation to predetermined luminance data stored in said image processing means to determine if the solderless terminal is crimped correctly.

7. The apparatus of claim 6 for inspecting a solderless terminal, wherein said image processing means comprises storing means for storing said predetermined luminance data, wherein said predetermined luminance data comprises a plurality of area histograms of optical intensities corresponding to a plurality of different color resin covers, said area histograms each containing a specular reflection region, a background region and a non-specular region, said area histograms also containing intermediate regions between the specular reflection regions and the background regions and between the background regions and the non-specular regions.

8. The apparatus of claim 7 for inspecting a solderless terminal, wherein said image processing means assigns a binary code corresponding to at least one of the intermediate regions of at least one of the area histograms stored in said storing means to the image received by said image receiving means.

9. The apparatus of claim 6 for inspecting a solderless terminal, wherein said image processing means determines if a core wire extends to the side or on top of the core wire barrel.

10. The apparatus of claim 9 for inspecting a solderless terminal, wherein said image processing means determines if a resin cover is present at the crimped end of the electric conductor.

11. The apparatus of claim 3 for inspecting a solderless terminal, wherein said fluorescent lamp is bar-shaped.

12. The apparatus of claim 3 for inspecting a solderless terminal, wherein said fluorescent lamp is arcuate-shaped.

13. The apparatus of claim 4 for inspecting a solderless terminal, wherein said main illuminating means is arcuate-shaped

14. A method for inspecting a solderless terminal by image processing, the solderless terminal including a resin barrel adapted to hold an end portion of an electric conductor comprised of a plurality of core wires enclosed in a resin cover, the end portion of the electric conductor having the resin cover partially removed therefrom to expose the core wires at the end portion, a core barrel and the resin barrel adapted to hold the exposed core wires of the electric conductor to electrically connect the conductor to the solderless terminal, said method for inspecting a solderless terminal comprising the steps of:

illuminating the solderless terminal from a first direction with a main illuminating means disposed substantially parallel to a longitudinal axis of the resin barrel and illuminating a background area of the solderless terminal from a second direction substantially opposite to said first direction;

receiving an image of the solderless terminal formed by light reflected from the illuminated solderless terminal; and

processing the image received into luminance data to determine whether the solderless terminal is correctly crimped to the electric conductor.

15. The method of claim 14 for inspecting a solderless terminal, wherein the image is received from a direction substantially perpendicular to a longitudinal axis of the resin barrel.

16. The method of claim 14 for inspecting a solderless terminal, wherein said image processing step includes storing a plurality of predetermined area histograms of optical intensities corresponding to luminance data of a plurality of different color resin covers, said area histograms each containing a specular reflection region, a background region and a non-specular region, said area histograms also containing intermediate regions between the specular reflection regions and the background regions and between the background regions and the non-specular regions.

17. The method of claim 16 for inspecting a solderless terminal, wherein the image processing step further comprises selecting at least one of the plurality of predetermined area histograms and assigning a binary code corresponding to at least one of the intermediate regions of the selected at least one of the area histograms to the image received by said image receiving step.

18. The method of claim 17 for inspecting a solderless terminal, wherein said image processing step further comprises determining if a core wire extends to the side or on top of the core wire barrel.

19. The method of claim 17 for inspecting a solderless terminal, wherein said image processing step includes determining if a resin cover is not removed from the crimped end of the electric conductor.