Electrodynamic pump for dispensing molten solder

• US 5,377,961 A
• Filed: 04/16/1993
• Issued: 01/03/1995
• Est. Priority Date: 04/16/1993
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Smith, Ted M., Winstead, Russell E.
• Primary Examiner(s): KASTLER, SCOTT R
• Application Number:
  US08/048,446
• Time in Patent Office: 627 Days
• Field of Search: 222/590, 222/594, 222/593, 266/236, 266/237
• US Class Current: 266/237
• CPC Class Codes: B23K 3/06 Solder feeding devices; Solder melting pans
• CPC Class Codes: H05K 2203/104 Using magnetic force, e.g. to align particles or for a temporary connection during processing
• CPC Class Codes: H05K 2203/105 Using an electrical field; Special methods of applying an electric potential electroplating H05K2203/0723
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

A system is provided for depositing an extremely small amount of solder on a printed circuit board by varying the direction of an electric current applied to a solder stream. The force exerted on the solder can be substantially instantaneously reversed without the necessity of changing the form of the energy applied to the solder from electrical to vibratory, ultrasonic, magnetic, or the like. The direction and magnitude of the force is related to the cross product of an electric current vector and a magnetic field vector (F=I×B). A programmable current source is used to place an electric current through the liquid solder as it is flowing through a conduit. A magnetic coil is disposed adjacent the conduit in order to provide a magnetic field in the same plane as the electric current. The conduit supplies liquid solder to a nozzle which then deposits a droplet of solder onto a printed circuit board. Therefore, as the current is applied, in a first direction through the solder, an outward force is exerted on the solder. When the direction of the current is reversed, then the direction of the force exerted on the solder is also reversed, and an extremely small droplet of solder is "snapped off" of the solder stream.

Claims

1. A system for depositing a specific quantity of electrically conductive liquid on a component, comprising:

means for supplying said conductive liquid;

means for applying a magnetic field in a direction perpendicular to said means for supplying;

means for transmitting electric current directly through said conductive liquid to exert a force on said conductive liquid in a first direction; and

means for reversing a direction of said electric current to correspondingly reverse the direction of said force exerted on said conductive liquid to a second direction opposite said first direction to form a droplet of said conductive liquid.

2. A system according to claim 1 wherein said electric current is in a direction perpendicular to said means for supplying and coplanar with said magnetic field such that a force is exerted on said conductive liquid.

3. A system according to claim 2 wherein said means for transmitting comprises:

a programmable electric current source capable of outputting alternating electric current of a predetermined duration; and

electrode means, in contact with said conductive liquid, for passing said electric current through said liquid.

4. A system according to claim 3 wherein said means for applying comprises:

a magnet; and

a magnet core for providing a path for magnetic flux from said magnet to said means for supplying, such that said magnetic flux is concentrated through said conductive liquid.

5. A system according to claim 4 wherein said means for supplying comprises:

reservoir means for storing a quantity of said conductive liquid;

nozzle means for dispensing said conductive liquid onto said component; and

conduit means for supplying said conductive liquid from said reservoir means for said nozzle means.

6. A system according to claim 5 wherein said conduit means is electrically insulated and receives said electrode means such that the electric current is passed through said conductive liquid.

7. A system according to claim 6, further comprising means for contacting said conductive liquid in said nozzle means with an inert fluid such that oxidization of said conductive liquid is prevented.

8. A system according to claim 7, further comprising:

means for heating said inert fluid;

means for heating said nozzle means; and

means for directing said heated inert fluid outwardly to maintain a temperature of a droplet of said conductive fluid while the droplet is deposited on a component.

9. A system according to claim 1 further comprising means for varying a size of said droplet by varying a duration of said electric current in said first direction.