Formation of microstructures using a preformed photoresist sheet

• US 5,378,583 A
• Filed: 05/24/1993
• Issued: 01/03/1995
• Est. Priority Date: 12/22/1992
• Status: Expired due to Term

• Current Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Original Assignee: Wisconsin Alumni Research Foundation (University of Wisconsin System)
• Inventors: Skrobis, Kenneth, Christenson, Todd R., Guckel, Henry
• Primary Examiner(s): BRAMMER, JACK
• Application Number:
  US08/066,988
• Time in Patent Office: 589 Days
• Field of Search: 430/269, 430/270, 430/271, 430/325, 430/326, 430/252, 430/967
• US Class Current: 430/325
• CPC Class Codes: B81C 1/0038 Processes for creating layers of materials not provided for in groups B81C1/00357 - B81C1/00373
• CPC Class Codes: B81C 2201/0128 Processes for removing material
• CPC Class Codes: B81C 2201/0159 Lithographic techniques not provided for in B81C2201/0157
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: G03F 7/0035 Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: Y10S 430/168 X-ray exposure process
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]

Abstract

In the formation of microstructures, a preformed sheet of photoresist, such as polymethylmethacrylate (PMMA), which is strain free, may be milled down before or after adherence to a substrate to a desired thickness. The photoresist is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the photoresist material which has been rendered susceptible to the developer. Micrometal structures may be formed by electroplating metal into the areas from which the photoresist has been removed. The photoresist itself may form useful microstructures, and can be removed from the substrate by utilizing a release layer between the substrate and the preformed sheet which can be removed by a remover which does not affect the photoresist. Multiple layers of patterned photoresist can be built up to allow complex three dimensional microstructures to be formed.

Claims

1. A method of forming microstructures comprising the steps of:

(a) providing a preformed sheet of photoresist material which can be exposed to radiation to affect its susceptibility to a developer;

(b) exposing the photoresist sheet in a pattern to radiation which will change its susceptibility to a developer;

(c) mechanically removing the material of the photoresist sheet to reduce the thickness of the sheet to a desired thickness; and

(d) applying a developer to the exposed photoresist to remove photoresist which is susceptible to the developer.

2. The method of claim 1 including the initial steps of applying a thin layer of metal to a subtrate as a plating base, adhering the preformed sheet of photoresist to the plating base, then after all of the steps of claim 1, the additional steps of electroplating metal in the areas in which the photoresist has been removed, and then removing the remaining photoresist to leave the electroplated metal structures on the substrate.

3. The method of claim 1 wherein the photoresist sheet is PMMA.

4. The method of claim 3 wherein the PMMA of the photoresist sheet is very high molecular weight linear PMMA.

5. The method of claim 2 wherein the material of the photoresist sheet is very high molecular weight linear PMMA, and wherein the step of removing the remaining photoresist is carried out by exposing the photoresist to a bath of a solvent which dissolves the PMMA.

6. The method of claim 5 wherein the solvent which is used to dissolve the PMMA is methylene chloride.

7. The method of claim 3 wherein the step of exposing the photoresist in a pattern is carried out by exposing the photoresist to X-rays from a synchrotron.

8. The method of claim 4 including the steps of spinning on a thin initial layer of non-crosslinked PMMA onto the surface of a substrate, solidifying the initial layer of PMMA, applying the preformed sheet of PMMA to the initial layer, and applying a liquid methylmethacrylate monomer to the interface between the preformed sheet and the initial layer to provide adhesion between the preformed sheet and the initial layer at the interface between the two.

9. The method of claim 1 including the initial steps of applying a sacrificial layer to a substrate and adhering the preformed sheet to the sacrificial layer, then after all of the steps of claim 1, the additional step of removing the sacrificial layer with a remover which does not affect the photoresist material to free the remaining photoresist from the substrate.

10. The method of claim 9 wherein the material of the photoresist is PMMA.

11. The method of claim 10 wherein the sacrificial layer is a material selected from the group consisting of titanium and partially imidized polyimide.

12. The method of claim 10 wherein the PMMA of the photoresist is a very high molecular weight linear PMMA.

13. The method of claim 10 wherein the PMMA of the photoresist is crosslinked PMMA.

14. The method of claim 1 wherein the preformed sheet of photoresist is at least 1 mm thick, and in the step of mechanically removing the material of the photoresist sheet the thickness of the sheet is reduced to less than 1 mm.

15. A method of forming microstructures comprising the steps of:

(a) providing a first preformed sheet of photoresist material which can be exposed to radiation to affect its susceptibility to a developer;

(b) exposing the photoresist sheet to radiation in a pattern to which will change its susceptibility to a developer;

(c) mechanically removing the material of the photoresist sheet to reduce the thickness of the sheet to a desired thickness constituting a first layer of photoresist;

(d) providing a second preformed sheet of photoresist material which may be exposed to radiation to affect its susceptibility to a developer;

(e) adhering the second photoresist sheet to the first layer of photoresist to form a laminate;

(f) mechanically removing the material of the second photoresist sheet to reduce the thickness of the sheet to a desired thickness constituting a second layer of photoresist;

(g) exposing the first and second layers of the photoresist to a pattern of radiation which will change the susceptibility of the photoresist of the second layer to a developer; and

(h) removing the photoresist in the first and second layers which is susceptible to a developer using a developer for the photoresist.

16. The method of claim 15 including the step of adhering the first preformed sheet of photoresist material to a substrate before the steps of exposing the first photoresist sheet to a pattern of radiation and mechanically removing the material of the first photoresist sheet.

17. The method of claim 16 wherein the step of adhering the first sheet of photoresist to the substrate includes the step of applying a thin layer of metal to the substrate as a plating base and adhering the preformed sheet of the photoresist to the plating base, then after all of the steps of claim 16, the additional steps of electroplating metal in the areas in which the photoresist has been removed, and then removing the remaining photoresist to leave the electroplated metal structures on the substrate.

18. The method of claim 15 wherein the first and second photoresist sheets are formed of PMMA.

19. The method of claim 18 wherein the PMMA of the photoresist sheets is very high molecular weight linear PMMA.

20. The method of claim 17 wherein the material of the photoresist sheets is very high molecular weight linear PMMA, and wherein the step of removing the remaining photoresist is carried out by exposing the photoresist to a bath of a solvent which dissolves the PMMA.

21. The method of claim 15 wherein the steps of exposing the photoresist sheets in a pattern is carried out by exposing each photoresist sheet to X-rays from a synchrotron.

22. The method of claim 15 including the additional steps of providing a third preformed sheet of photoresist material which can be exposed to radiation to change its susceptibility to a developer;

adhering the third photoresist sheet to the second layer of the laminate;

mechanically removing the material of the third photoresist sheet adhered to the second layer to reduce the thickness of the sheet to a desired thickness comprising a third layer of the laminate;

exposing the third layer of photoresist in a pattern to radiation which will change the susceptibility of the photoresist to a developer, and then carrying out the step of removing the photoresist susceptible to a developer in each of the first, second and third layers utilizing a developer for the photoresist.

23. The method of claim 15 wherein the step of removing the photoresist susceptible to a developer in the first and second layers is carried out before the second photoresist sheet constituting the second layer is adhered to the first layer of photoresist.

24. A method of forming microstructures comprising the steps of:

(a) providing a first preformed sheet of photoresist material which can be exposed to radiation to affect it susceptibility to a developer;

(b) exposing the first photoresist sheet to radiation in a pattern which will result in susceptibility of the photoresist to a developer partially but not entirely through the thickness of the photoresist sheet;

(c) adhering the first photoresist sheet on the side which has photoresist which is susceptible to a developer to a layer of photoresist which has a pattern of areas therein which are susceptible to the developer, to form a laminate;

(d) mechanically removing the material of the first preformed photoresist sheet to reduce the thickness of the sheet to expose the areas of the first preformed sheet which are susceptible to removal by the developer; and

(e) applying a developer to the laminate to remove photoresist which is susceptible to the developer to leave a pattern of voids in the first photoresist sheet and the underlying photoresist layer.

25. The method of claim 24 including, before the step of adhering the first photoresist sheet to the photoresist layer, the additional steps of providing the photoresist layer from a preformed sheet of photoresist material which can be exposed to radiation to affect its susceptibility to a developer partially but not entirely through the thickness of the photoresist sheet, mechanically removing the material of the photoresist sheet from the side opposite the exposed side of the sheet to reduce the thickness of the sheet to fully expose the areas of the sheet which are susceptible to the developer to provide the photoresist layer, and thereafter adhering the first preformed photoresist sheet to the photoresist layer.

26. The method of claim 25 including before the step of mechanically removing the material of the preformed photoresist sheet from which the photoresist layer is formed, the step of adhering the exposed side of that preformed photoresist sheet to a substrate, and then carrying out the step of mechanically removing the material of the preformed photoresist sheet.

27. The method of claim 24 wherein the photoresist layer and the preformed photoresist sheet are formed of PMMA.

28. The method of claim 26 wherein the step of adhering the photoresist layer to the substrate includes the step of applying a thin layer of metal to the substrate as a plating base and adhering the photoresist layer to the plating base, and then after all of the steps of claim 26 wherein the areas susceptible to developer in the photoresist have been removed to leave voids, the additional steps of electroplating metal in the voids in which the photoresist has been removed, and then removing the remaining photoresist to leave the electroplated metal structures on the substrate.

29. The method of claim 26 wherein the first preformed photoresist sheet and the photoresist layer are formed of very high molecular weight linear PMMA.

30. A method of forming microstructures comprising the steps of:

(a) providing a first preformed sheet of PMMA photoresist material;

(b) exposing the first photoresist sheet in a pattern to X-rays to render exposed areas of the photoresist sheet susceptible to a developer;

(c) mechanically removing the material of the first photoresist sheet to reduce the thickness of the sheet to a desired thickness; and

(d) applying a developer to the first photoresist sheet to remove the exposed photoresist which is susceptible to the developer.

31. The method of claim 30 including the initial steps of applying a thin layer of metal to a substrate as a plating base, adhering the first preformed sheet of photoresist to the plating base, then after all of the steps of claim 30, the additional steps of electroplating metal in the areas in which the photoresist has been removed, and then removing the remaining photoresist to leave the electroplated metal structures on the substrate.

32. The method of claim 31 wherein the material of the first photoresist sheet is very high molecular weight linear PMMA, and wherein the step of removing the remaining photoresist is carried out by exposing the photoresist to a bath of a solvent which dissolves the PMMA.

33. The method of claim 32 wherein the solvent which is used to dissolve the PMMA is methylene chloride.

34. The method of claim 30 including the steps of spinning on a thin initial layer of non-crosslinked PMMA onto the surface of a substrate and solidifying the initial layer of PMMA, applying the first preformed sheet of PMMA to the initial layer, and applying a liquid methyl methacrylate monomer to the interface between the preformed sheet and the initial layer to provide adhesion between the preformed sheet and the initial layer at the interface between the two.

35. The method of claim 30 wherein the first preformed sheet of photoresist is at least 1 mm thick, and in the step of mechanically removing the material of the photoresist sheet the thickness of the sheet is reduced to less than 1 mm.

36. The method of claim 30 further comprising the steps of:

(a) providing a second preformed sheet of PMMA photoresist material;

(b) adhering the second photoresist sheet to the first photoresist sheet to form a laminate;

(c) mechanically removing the material of the second photoresist sheet to reduce the thickness of the sheet to a desired thickness;

(d) exposing the second photoresist sheet to a pattern of X-rays which will render the exposed areas of the second photoresist sheet susceptible to a developer; and

(e) removing the exposed photoresist in the second photoresist sheet using a developer for the photoresist.

37. The method of claim 36 including the step of adhering the first preformed photoresist sheet to a substrate before the steps of exposing the first photoresist sheet to a pattern of radiation and mechanically removing the material of the first photoresist sheet.

38. The method of claim 37 wherein the step of adhering the first sheet of photoresist to the substrate includes the step of applying a thin layer of metal to the substrate as a plating base and adhering the preformed sheet of the photoresist to the plating base, then after all of the steps of claim 37, the additional steps of electroplating metal in the areas in which the photoresist has been removed, and then removing the remaining photoresist to leave the electroplated metal structures on the substrate.

39. The method of claim 38 wherein the material of the photoresist sheets is very high molecular weight linear PMMA, and wherein the step of removing the remaining photoresist is carried out by exposing the photoresist to a bath of a solvent which dissolves the PMMA.

40. The method of claim 36 including the additional steps of providing a third preformed sheet of PMMA photoresist;

adhering the third photoresist sheet to the second photoresist sheet of the laminate;

mechanically removing the material of the third photoresist sheet adhered to the second photoresist sheet to reduce the thickness of the sheet to a desired thickness;

exposing the third sheet of photoresist in a pattern to X-rays which will render the exposed areas of the photoresist susceptible to a developer, and then carrying out the step of removing the exposed photoresist in each of the first, second and third photoresist sheets utilizing a developer for the photoresist.

41. The method of claim 36 wherein the step of removing the exposed photoresist with a developer in the first and second photoresist sheets is carried out before the second photoresist sheet is adhered to the first photoresist sheet.

42. The method of claim 36 wherein the step of adhering the second photoresist sheet to the first photoresist sheet is carried out after the steps of exposing the second photoresist sheet to a pattern of X-rays and of removing the exposed photoresist.

43. The method of claim 36 wherein the step of adhering the second photoresist sheet to the first photoresist sheet is carried out before the step of applying a developer to the first photoresist sheet.

44. The method of claim 36 wherein the second photoresist sheet is adhered to the first photoresist sheet by wetting the interface between the sheets with methyl methacrylate.