Hermetic semiconductor device having jumper leads
First Claim
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1. A hermetic semiconductor device comprising:
- a ceramic base having a first array of conductive pads on a surface and a second array of conductive pads around a periphery of the first array, wherein the first and second arrays of conductive pads are electrically interconnected by means for routing in the ceramic base;
a leadframe having a plurality of conductors in a quadrilateral configuration, wherein the plurality of conductors is attached to a periphery of the ceramic base with a glass material, the plurality of conductors having a surface mountable external portion that is curved;
a semiconductor die electrically connected to the first array of conductive pads by way of flip-chip bonding with a plurality of conductive interconnect bumps;
a plurality of wire bonds connecting the plurality of conductors to the second array of conductive pads to electrically connect the semiconductor die to the leadframe;
a cap overlying the semiconductor die and substantially aligning with the ceramic base; and
a seal which adhesively couples the ceramic base to the cap to provide a hermetic seal around the semiconductor die.
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Abstract
A fine-pitch hermetic device (10) can be manufactured wherein two sets of wire bonds (18 & 20) are used to electrically connect a semiconductor die (12) to a leadframe (16). Jumper leads or conductive pads (28) are placed on an inner surface of a ceramic base (14) to electrically interconnect the two sets of wire bonds. The jumper leads enables shorter wire lengths to be used. The leadframe is attached to the ceramic base with glass embed technology. A cap (22) is affixed to the base with a hermetic seal (24). The invention is also compatible with flip-chip dice and multichip modules.
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Citations
16 Claims
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1. A hermetic semiconductor device comprising:
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a ceramic base having a first array of conductive pads on a surface and a second array of conductive pads around a periphery of the first array, wherein the first and second arrays of conductive pads are electrically interconnected by means for routing in the ceramic base; a leadframe having a plurality of conductors in a quadrilateral configuration, wherein the plurality of conductors is attached to a periphery of the ceramic base with a glass material, the plurality of conductors having a surface mountable external portion that is curved; a semiconductor die electrically connected to the first array of conductive pads by way of flip-chip bonding with a plurality of conductive interconnect bumps; a plurality of wire bonds connecting the plurality of conductors to the second array of conductive pads to electrically connect the semiconductor die to the leadframe; a cap overlying the semiconductor die and substantially aligning with the ceramic base; and a seal which adhesively couples the ceramic base to the cap to provide a hermetic seal around the semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A hermetic semiconductor device comprising:
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a multilayer ceramic base having a first array of conductive pads on a surface and a second array of conductive pads around a periphery of the first array, wherein the first and second arrays of conductive pads are electrically interconnected by means for routing in the multilayer ceramic base; a leadframe having a plurality of conductors in a quadrilateral configuration, wherein an inner portion of the plurality of conductors is attached to a periphery of the multilayer ceramic base with a glass material and an outer portion of the plurality of conductors is shaped to a surface mountable configuration; a semiconductor die electrically connected to the first array of conductive pads by way of flip-chip bonding with a plurality of conductive interconnect bumps; a plurality of wire bonds connecting the plurality of conductors to the second array of conductive pads to electrically connect the semiconductor die to the leadframe; a cap overlying the semiconductor die and substantially aligning with the multilayer ceramic base; and a glass seal which adhesively couples the multilayer ceramic base to the cap to provide a hermetic seal around the semiconductor die. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification