Capacitive micro-sensor with a low stray capacity and manufacturing method
First Claim
1. A capacitive micro-sensor including a sandwich of three silicon wafers (1,2,3), a peripheral stripe of each surface of the central plate being assembled to a corresponding stripe of an opposing external plate through an insulating layer (5,6), at least one of said external plates forming a first electrode (22,23), the central plate forming a second electrode (21) and at least one portion of said central plate forming a variable capacity with at least one of said external plates, wherein at least one of said insulating layers is formed by a sandwich of a first insulating layer (5-1,6-1), a conductive layer (5-2,6-2) and a second insulating layer (5-3,6-3), said conductive layer being associated with connection means (25,26).
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Abstract
A capacitive micro-sensor includes a sandwich of three silicon wafers, a peripheral stripe of each surface of the central plate being assembled to a corresponding stripe of an opposing external plate through an insulating layer. At least one of the external plates forms a first electrode, the central plate forms a second electrode and at least one portion of the central plate forms a variable capacity with at least one of the external layers. At least one of the insulating layers is formed by a sandwich of a first insulating layer, a conductive layer and a second insulating layer, the conductive layer being associated with connection means.
34 Citations
6 Claims
- 1. A capacitive micro-sensor including a sandwich of three silicon wafers (1,2,3), a peripheral stripe of each surface of the central plate being assembled to a corresponding stripe of an opposing external plate through an insulating layer (5,6), at least one of said external plates forming a first electrode (22,23), the central plate forming a second electrode (21) and at least one portion of said central plate forming a variable capacity with at least one of said external plates, wherein at least one of said insulating layers is formed by a sandwich of a first insulating layer (5-1,6-1), a conductive layer (5-2,6-2) and a second insulating layer (5-3,6-3), said conductive layer being associated with connection means (25,26).
Specification