Process for producing copper clad laminate

• US 5,382,333 A
• Filed: 09/24/1992
• Issued: 01/17/1995
• Est. Priority Date: 07/30/1990
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Gas Chemical Company Incorporated (Mitsubishi Electric Corporation)
• Inventors: Ando, Kazuhiro, Shouji, Yasuhiro, Kanaoka, Takeo, Kawakami, Takamasa, Tanaka, Yasuo, Sayama, Norio
• Primary Examiner(s): Gorgos, Kathryn
• Assistant Examiner(s): Mayekar, Kishor
• Application Number:
  US07/950,757
• Time in Patent Office: 845 Days
• Field of Search: 156/630, 205/194, 205/220, 204/130
• US Class Current: 156/81
• CPC Class Codes: C23C 22/63 Treatment of copper or alloys based thereon
• CPC Class Codes: C23C 22/83 Chemical after-treatment
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 3/385 by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.

Claims

1. A process for producing a copper-clad laminate which comprises placing a (i) copper foil on (ii) prepregs to form an assembly and lamination molding the resulting assembly, wherein the (i) copper foil is an electrodeposited copper foil or a rolled copper foil and is obtained by treating a surface of a (iii) starting copper foil with an oxidizing aqueous alkaline solution to thereby form, on the surface of the (iii) starting copper foil, a fine roughness constituted of a copper oxide of a brown to black color and then reducing the copper oxide which constitutes the fine roughness in an atmosphere in which hydrazine as a reducing gas is present, to thereby form a roughened surface for adhesion while the fine roughness is maintained substantially unchanged, wherein said reducing is conducted at a temperature of from 60°

to 160°

C. under a hydrazine gas pressure of from 0.1 to 15 mmHg.