Sputtering apparatus

• US 5,382,344 A
• Filed: 07/13/1994
• Issued: 01/17/1995
• Est. Priority Date: 08/02/1991
• Status: Expired due to Term

• Current Assignee: Anelva Corporation (Canon Inc.)
• Original Assignee: Anelva Corporation (Canon Inc.)
• Inventors: Hosokawa, Naokichi, Kim, Kyungshik
• Primary Examiner(s): Weisstuch, Aaron
• Application Number:
  US08/274,377
• Time in Patent Office: 188 Days
• Field of Search: 204/298.19, 204/298.2, 204/298.23
• US Class Current: 204/298.2
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: H01J 37/3408 Planar magnetron sputtering
• CPC Class Codes: H01J 37/3455 Movable magnets

Abstract

At least one magnetron cathode provided in a sputtering apparatus comprises a magnet assembly in which first and second types of magnet units whose N and S poles are oppositely disposed are alternately disposed adjacent to each other. Two types of loop loci in which drift electron motions are directed in the opposite directions are alternately formed adjacent to each other by said first and second magnet units on a surface of the target. Consequently, a hybrid orbit is formed, and an ion current generation region is enlarged. Furthermore, a moving mechanism for reciprocating the magnet assembly is provided in the magnetron cathode. The above configuration solves the problem involving generation of non-uniform ion bombardment of the target, and achieves a magnetron sputtering electrode capable of depositing a thin film on a relatively large rectangular substrate in a stationary state without moving the substrate. Thus, reduction in the size of the apparatus, waste of the rectangular target due to non-uniform erosion, heterogeneity of the thin film on the substrate, and reduction of generation of dust particles can be obtained.

Claims

1. A sputtering apparatus comprising a vacuum vessel having an evacuation system for evacuating said vacuum vessel, a substrate holding member disposed within said vacuum vessel for mounting a substrate on which a film is to be deposited, at least one magnetron cathode disposed in opposed relation to the substrate and having a rectangular planar target used to deposit the film on a surface of the substrate, a gas control system for supplying a gas in the interior of said vacuum vessel and thereby maintaining the inner pressure thereof at a predetermined value, and a power source system for supplying electrical power to said magnetron cathode, the improvement comprising;

a magnet assembly having a first magnet unit having at least a looped peripheral magnet with N and S poles arranged to form a first closed loop locus for drift electron motion in a first direction, said drift electron motion producing a first ion current generation region on a surface of said target when said drift electrons collide with said supplied gas in said first closed loop locus,

a second magnet unit having at least a looped peripheral magnet with S and N poles arranged to form a second closed loop locus for drift electron motion in a second direction opposite said first direction, said drift electron motion producing a second ion current generation region on a surface of said target when said drift electrons collide with said supplied gas in said second closed loop locus,

wherein said first magnet unit is disposed adjacent said second magnet unit with poles of opposite polarity adjacent each other such that said oppositely directed drift electron motions hybridize along said adjacent poles of opposite polarity, said adjacent poles of opposite polarity spaced such that any line of magnetic force formed between them does not interfere with said hybridization.

2. The sputtering apparatus of claim 1, wherein said adjacent poles of opposite polarity are spaced by a shunt spacer having a large magnetic permeability.

3. The sputtering apparatus of claim 1, wherein said adjacent poles of opposite polarity are directly adjacent each other with essentially no space between them.

4. The sputtering apparatus of claim 1, wherein a plurality of said first and second magnet units are positioned alternately in series to form plural hybridized ion current generation regions.

5. The sputtering apparatus of claim 1, wherein said first and second closed loop loci defining said first and second ion current generation regions have, individually, a width "b" defining the width of an erosion region on said target surface where said loci are not hybridized, and, wherein said first and second closed loop loci defining said first and second ion current generation regions have a combined width "a" greater than "2b" where said first and second ion current generation regions are hybridized.

6. The sputtering apparatus of claim 1, wherein said magnetron cathode has a moving mechanism for reciprocating said magnet assembly and wherein the ion current generation regions reciprocate as a consequence of the reciprocating motion of said magnet assembly by said moving mechanism.

7. The sputtering apparatus of claim 6, wherein said magnet assembly is disposed in a recessed space formed in an electrode housing of said magnetron cathode, said recessed space dimensioned such that said magnet assembly can move, said magnet assembly moving within said recessed space.

8. The sputtering apparatus of claim 1, wherein each of said first and second magnet units comprises a rectangular yoke, a central magnet disposed on said yoke, and a rectangular looped peripheral magnet on said yoke around said central magnet, each of said central magnet and said looped peripheral magnet having magnetic pole surfaces parallel to said target surface, the S pole of one of said first or second magnet units facing its yoke with the N pole facing said target, the N pole of the other of said first or second magnet units facing its yoke with its S pole facing said target.

9. The sputtering apparatus of claim 8, wherein said first and second magnet units are disposed close to each other, a spacer being provided between adjoining portions thereof.

10. The sputtering apparatus of claim 1, wherein each of said first and second magnet units comprises a yoke and a loop magnet disposed on said yoke, each said loop magnet having magnetic pole surfaces perpendicular to said target surface on an inner and outer peripheral surface thereof, one of said first or second magnet units having its S pole on its outer peripheral surface with its N pole on its inner peripheral surface, the other of said first or second magnet units having its N pole on its outer peripheral surface with its S pole on its inner peripheral surface.

11. The sputtering apparatus of claim 10, wherein opposite poles of said loop magnets of said first and second magnet units are in contact with each other.

12. The sputtering apparatus of claim 1, wherein said magnet assembly is disposed in a fixed state in a recessed space formed in an electrode housing of said magnetron cathode.

13. The sputtering apparatus of claim 1, wherein said substrate holding member is movable for conveying said substrate, said substrate holding member remaining at rest at a position where said substrate opposes the target surface of said magnetron cathode when a thin film is deposited on said substrate within said vacuum vessel.

14. The sputtering apparatus of claim 1, wherein said moving mechanism comprises a rotary driving device, a converting mechanism for converting a rotational motion of said rotary driving device into a reciprocating motion of said magnet assembly, and a guide member for guiding the reciprocating motion of said magnet assembly.

15. The sputtering apparatus of claim 1, wherein said drift electron motions of adjacent portions of said adjacent loci are directed in the same direction and parallel to each other.