Conductive polymer composition

• US 5,382,384 A
• Filed: 06/29/1993
• Issued: 01/17/1995
• Est. Priority Date: 11/06/1991
• Status: Expired due to Fees

• Current Assignee: Raychem Corporation (TE Connectivity Limited)
• Original Assignee: Raychem Corporation (TE Connectivity Limited)
• Inventors: Reddy, Vijay N., Baigrie, Stephen, Saltman, Robert P., Rinde, James A., Chu, Edward F., Park, George B.
• Primary Examiner(s): Lieberman, Paul
• Assistant Examiner(s): KOPEC, MARK T
• Application Number:
  US08/085,698
• Time in Patent Office: 567 Days
• Field of Search: 252/511, 252/512, 252/513, 252/514, 252/518, 219/541, 219/546, 219/547, 219/548, 219/553, 264/104, 264/105, 264/234, 264/347, 524/779
• US Class Current: 252/511
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H01C 7/027 consisting of conducting or semi-conducting material dispersed in a non-conductive organic material

Abstract

A conductive polymer composition in which a particulate conductive filler is dispsered in a polymeric component which is a mixture of an essentially amorphous thermoplastic resin and a thermosetting resin. In preferred compositions, the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble. In order to improve the thermal stability of the composition on exposure to successive thermal cycles, it is preferred that the composition be cured by heating the uncured mixture of amorphous thermoplastic resin, thermosetting resin, and particulate conductive filler at a rate of at least 15° C./minute to the cure temperature.

Claims

1. A process for preparing a conductive polymer composition, said process comprising

(1) mixing together to form a mixture

(A) a polymeric component which comprises (i) 10 to 75 parts by weight of the total polymer component of an essentially amorphous thermoplastic resin, and (ii) 90 to 25 parts by weight of the total polymeric component of a thermosetting resin,

(B) a curing agent which has a curing temperature T_cure, and

(C) a particulate conductive filler dispersed in the polymeric component which is 5 to 65% by volume of the polymeric component;

(2) shaping the mixture at a temperature less than T_cure to form a shaped mixture; and

(3) heating the shaped mixture at a rate of at least 15°

C./minute to a temperature of at least T_cure and maintaining the shaped mixture at the temperature of at least T_cure for a time sufficient to cure the mixture.

2. A process according to claim 1 wherein the heating rate is at least 30°

C./minute.

3. A process according to claim 1 wherein the heating step is conducted while the shaped mixture is under pressure.

4. A process according to claim 2 wherein the heating rate is at least 40°

C./minute.

5. A process according to claim 1 wherein the mixture is shaped by compression molding.

6. A process according to claim 1 wherein the amorphous thermoplastic resin and the thermosetting resin are substantially mutually soluble.

7. A process according to claim 1 wherein the conductive polymer composition exhibits PTC behavior.

8. A process according to claim 1 wherein the particulate conductive filler comprises carbon black.

9. A process according to claim 1 wherein the particulate conductive filler comprises a metal.

10. A process for preparing an electrical device which comprises a conductive polymer composition, said process comprising

(A) preparing a resistive element which comprises a conductive polymer by

(1) mixing together to form a mixture of the conductive polymer composition

(a) a polymeric component which comprises (i) 10 to 75 parts by weight of the total polymeric component of an essentially amorphous thermoplastic resin, and (ii) 90 to 25 parts by weight of the total polymeric component of a thermosetting resin,

(b) a curing agent which has a curing temperature T_cure, and

(c) a particulate conductive filler dispersed in the polymeric component which is 5 to 65% by volume of the polymeric component;

(2) shaping the mixture at a temperature less than T_cure to form a shaped mixture; and

(3) heating the shaped mixture at a rate of at least 15°

C./minute to a temperature of at least T_cure and maintaining the shaped mixture at the temperature of at least T_cure for a time sufficient to cure the mixture and form the resistive element, and

(B) attaching two electrodes to the resistive element.

11. A process according to claim 10 wherein the heating rate is at least 30°

C./minute.

12. A process according to claim 11 wherein the heating rate is at least 40°

C./minute.

13. A process according to claim 10 wherein the heating step is conducted while the shaped mixture is under pressure.

14. A process according to claim 10 wherein the electrical device is a circuit protection device.

15. A process according to claim 10 wherein the electrical device is a heater.