Method for mounting component chips and apparatus therefor

• US 5,383,270 A
• Filed: 05/28/1993
• Issued: 01/24/1995
• Est. Priority Date: 06/05/1992
• Status: Expired due to Fees

• Current Assignee: Yamaha Hatsudoki Kabushiki Kaisha (Yamaha Corporation)
• Original Assignee: Yamaha Hatsudoki Kabushiki Kaisha (Yamaha Corporation)
• Inventors: Iwatsuka, Yoshihisa, Tamiwa, Takeshi
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/069,975
• Time in Patent Office: 606 Days
• Field of Search: 29/832, 29/833, 29/740, 29/840, 29/741, 29/720, 29/721
• US Class Current: 29/840
• CPC Class Codes: H05K 13/0812 the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53091 for work-holder for assembly or disassembly
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A method and apparatus for mounting components on a substrate that insures that if the component, because of its shape can only be mounted if picked up in a specific area will not attempt mounting unless the component is picked up in that specific area. Various methods for setting and determining desirable pick up locations are disclosed.

Claims

1. A method for mounting a component on a substrate, said component having a pick up surface on one side and a mounting surface on another side, said mounting surface being configured so that a mounting force must be applied to a specific area of said pick up surface to insure effective mounting of said substrate, said specific area being smaller than the area of said pick up surface, using an apparatus comprising a component handling device having a pick up portion for picking up a component and mounting that component on a substrate, said pick up portion having a smaller effective area than said specific area of said pick up surface comprising the steps of detecting the position on said mounting surface where the component is held by the component handling device, and rejecting the mounting of the component of the substrate if the component is not held by said component handling device within said specific area of said pick up surface.

2. A method for mounting a component as set forth in claim 1 wherein the component handling device comprises a vacuum pick up.

3. A method for mounting a component as set forth in claim 1 wherein the position the component is held by the component handling device is determined by an electronic camera.

4. A method for mounting a component as set forth in claim 3 wherein the position the component is held by the component handling device is compared with a predetermined memorized acceptable pick-up area.

5. A method for mounting a component as set forth in claim 4 wherein the detection of the position of the component is determined relative to an identifying position on the component handling device.

6. A method for mounting a component as set forth in claim 4 wherein the detection of the position of the component is accomplished by positioning the component handling device at a predetermined location relative to the camera.

7. A method for mounting a component as set forth in claim 6 wherein the component handling device comprises a vacuum pick up.

8. A component mounting apparatus for mounting a component on a substrate, said component having a pick up surface on one side and a mounting surface on another side, said mounting surface being configured so that a mounting force must be applied to a specific area of said pick up surface to insure effective mounting on said substrate, said specific area being smaller than the area of said pick up surface, said apparatus comprising a component handling device having a pick up portion for picking up a component and mounting that component on a substrate, said pick up portion having a smaller effective area than said specific area of said pick up surface, means for detecting the position on said mounting surface where said component is held by the component handling device, and means are provided for rejecting the mounting of the component of the substrate if the component is not held by said component handling device within said specific area of said pick up.

9. A component mounting apparatus as set forth in claim 8 wherein the component handling device comprises a vacuum pick up.

10. A component mounting apparatus as set forth in claim 8 wherein the means for detecting the position the component is held by the component handling device comprises an electronic camera.

11. A component mounting apparatus as set forth in claim 10 wherein the means for detecting the position the component is held by the component handling device compares the location of the component with a predetermined memorized acceptable pick-up area.

12. A component mounting apparatus as set forth in claim 11 wherein the means for detecting the position of the component further includes an identifying position on the component handling device.

13. A component mounting apparatus as set forth in claim 11 wherein the means for detecting the position of the component further includes means for positioning the component handling device at a predetermined location relative to the camera.

14. A component mounting apparatus as set forth in claim 13 wherein the component handling device comprises a vacuum pick up.