Method for mounting component chips and apparatus therefor
First Claim
1. A method for mounting a component on a substrate, said component having a pick up surface on one side and a mounting surface on another side, said mounting surface being configured so that a mounting force must be applied to a specific area of said pick up surface to insure effective mounting of said substrate, said specific area being smaller than the area of said pick up surface, using an apparatus comprising a component handling device having a pick up portion for picking up a component and mounting that component on a substrate, said pick up portion having a smaller effective area than said specific area of said pick up surface comprising the steps of detecting the position on said mounting surface where the component is held by the component handling device, and rejecting the mounting of the component of the substrate if the component is not held by said component handling device within said specific area of said pick up surface.
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Accused Products
Abstract
A method and apparatus for mounting components on a substrate that insures that if the component, because of its shape can only be mounted if picked up in a specific area will not attempt mounting unless the component is picked up in that specific area. Various methods for setting and determining desirable pick up locations are disclosed.
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Citations
14 Claims
- 1. A method for mounting a component on a substrate, said component having a pick up surface on one side and a mounting surface on another side, said mounting surface being configured so that a mounting force must be applied to a specific area of said pick up surface to insure effective mounting of said substrate, said specific area being smaller than the area of said pick up surface, using an apparatus comprising a component handling device having a pick up portion for picking up a component and mounting that component on a substrate, said pick up portion having a smaller effective area than said specific area of said pick up surface comprising the steps of detecting the position on said mounting surface where the component is held by the component handling device, and rejecting the mounting of the component of the substrate if the component is not held by said component handling device within said specific area of said pick up surface.
- 8. A component mounting apparatus for mounting a component on a substrate, said component having a pick up surface on one side and a mounting surface on another side, said mounting surface being configured so that a mounting force must be applied to a specific area of said pick up surface to insure effective mounting on said substrate, said specific area being smaller than the area of said pick up surface, said apparatus comprising a component handling device having a pick up portion for picking up a component and mounting that component on a substrate, said pick up portion having a smaller effective area than said specific area of said pick up surface, means for detecting the position on said mounting surface where said component is held by the component handling device, and means are provided for rejecting the mounting of the component of the substrate if the component is not held by said component handling device within said specific area of said pick up.
Specification