Multilayer ceramic circuit board
First Claim
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1. A multilayer ceramic circuit board, comprising:
- a first substrate element containing a fired first ceramic material;
a second substrate element, being superposed on said first substrate element, containing a fired second ceramic material having electric characteristics different from those of said first ceramic material and being fired separately from said first ceramic material; and
conductive bonding means for electrically connecting and mechanically bonding said first and second substrate elements together for integrating the first and second substrate elements.
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Abstract
A dielectric substrate element of a multilayer structure provided with a capacitor in its interior and a magnetic substrate element of a multilayer structure provided with an inductor in its interior are prepared independently of each other. These substrate elements are respectively fired, then superposed with each other, and electrically connected and mechanically bonded by solder bumps to be integrated with each other. Thus, it is possible to obtain a multilayer ceramic circuit board with no integral firing, and the materials for the dielectric substrate element and the magnetic substrate element are not restricted in their capability of integral firing.
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17 Claims
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1. A multilayer ceramic circuit board, comprising:
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a first substrate element containing a fired first ceramic material; a second substrate element, being superposed on said first substrate element, containing a fired second ceramic material having electric characteristics different from those of said first ceramic material and being fired separately from said first ceramic material; and conductive bonding means for electrically connecting and mechanically bonding said first and second substrate elements together for integrating the first and second substrate elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification