Process and apparatus for optical near field microlithography
First Claim
1. Direct scanning microlithography process on a wafer-shaped substrate having a surface by at least one of an optical beam and an electronic beam for achieving photomechanical or electromechanical lithography of submicrometric structures on the surface of the substrate, the process comprising:
- holding a source of at least one of an optical beam and an electronic beam for lithography at a close distance to the substrate using a waveguide proximity probe comprising a fiber optic proximity probe having an end, with the source being aligned with the end of the waveguide;
aligning a point of impact of the at least one of an optical beam and an electronic beam with a point of impact of a coherent light wave which is injected into the waveguide, so that, in positioning the end above the surface of the substrate, a coupling coefficient between a propagation mode of the waveguide and a propagation mode of an electrical field of a light wave reflected by the surface and guided in return by the waveguide, is assimilated with a rapidly decreasing function that depends upon the distance.
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Abstract
Direct scanning microlithography process of a substrate such as a wafer, by means of an optical and/or electronic beam, for obtaining photomechanical or electromechanical lithography of submicrometric structures at the surface of the substrate, wherein the source of the optical and/or electronic beam used for lithography is kept at an appropriate distance from the substrate by means of a waveguide proximity probe, such as a fiber optic proximity probe capable of measuring rapid variation, depending on the distance, of the intensity of an electromagnetic wave reflected by the substrate within the near field area located at the end of the probe. The invention also concerns microlithography devices using this process.
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Citations
10 Claims
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1. Direct scanning microlithography process on a wafer-shaped substrate having a surface by at least one of an optical beam and an electronic beam for achieving photomechanical or electromechanical lithography of submicrometric structures on the surface of the substrate, the process comprising:
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holding a source of at least one of an optical beam and an electronic beam for lithography at a close distance to the substrate using a waveguide proximity probe comprising a fiber optic proximity probe having an end, with the source being aligned with the end of the waveguide; aligning a point of impact of the at least one of an optical beam and an electronic beam with a point of impact of a coherent light wave which is injected into the waveguide, so that, in positioning the end above the surface of the substrate, a coupling coefficient between a propagation mode of the waveguide and a propagation mode of an electrical field of a light wave reflected by the surface and guided in return by the waveguide, is assimilated with a rapidly decreasing function that depends upon the distance. - View Dependent Claims (2, 3, 4)
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5. Device for microlithography of a wafer-shaped substrate for producing submicrometric structures on a surface of the substrate, comprising:
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a first source of at least one of an optical beam and an electronic beam for lithography; a second source of light; a near field proximity probe comprising a fiber optic adapted to be positioned at a distance from the surface of the substrate; a transmission path connecting said first source and said second source to said field proximity probe; means for vertical positioning of the near field proximity probe; a feedback device associated with said means for vertical positioning for aligning a point of impact of the at least one of an optical beam and an electronic beam with a point of impact of a coherent light wave which is injected into the fiber optic by said second source, so that an end of the fiber optic is positionable above the surface of the substrate with a coupling coefficient between a propagation mode of the fiber optic and a propagation mode of an electrical field of a light wave reflected by the surface and guided in return by the fiber optic is assimilated with a rapidly decreasing function that depends upon a distance of said fiber optic from the surface. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification