Opto-electronic component with narrow aperture angle

• US 5,384,471 A
• Filed: 09/30/1993
• Issued: 01/24/1995
• Est. Priority Date: 10/02/1992
• Status: Expired due to Term

• Current Assignee: Temic Telefunken Microelectronic GmbH (Continental AG)
• Original Assignee: Temic Telefunken Microelectronic GmbH (Continental AG)
• Inventors: Mistele, Thomas, Giebler, Siegfried, Schairer, Werner, Riedel, Jurgen, Angerstein, Jorg
• Primary Examiner(s): Jackson, Jerome
• Assistant Examiner(s): Kelley, Nathan K.
• Application Number:
  US08/128,659
• Time in Patent Office: 481 Days
• Field of Search: 257/98, 257/80, 257/81, 257/99, 257/100, 257/79, 257/676
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The invention relates to an opto-electronic component having a narrow aperture angle. The conventional design of components transmitting radiation or reacting to radiation and concentrating that radiation with the aid of lenses results, on account of the increasing distance between the lens and the semiconductor chip, in increasing component dimensions in the radiating or detecting direction with an increasingly narrow aperture angle. In accordance with the invention, a parabolic or approximately parabolic reflector is provided that is connected to a support strip supporting the semiconductor chip such that the latter is as close as possible to the focal point of the parabolic or approximately parabolic surface of the reflector. The reflector is preferably connected to the support strip by engaging elements and surrounded by a housing.

Claims

1. An opto-electronic component having a narrow aperture angle, comprising:

a semiconductor chip for either emitting radiation or reacting to radiation mounted on a first side of a metal support strip which includes a plurality of part-strips, a parabolic reflector disposed adjacent said first side of said support strip, said reflector being provided with engaging elements, onto which said support strip is latched, to connect said reflector to said support strip such that said semiconductor chip mounted on said support strip is substantially at the focal point of the parabolic surface of said reflector.

2. An opto-electronic component according to claim 1 wherein said reflector consists of a plastic having at least one surface coated with a highly reflecting metal.

3. An opto-electronic component according to claim 1, wherein said reflector, said semiconductor chip and parts of said support strip are completely surrounded by a translucent housing, and wherein only ends of said part-strips of said support strip acting as connection pins project out of said housing.

4. An opto-electronic component according to claim 2, wherein only one of said part-strips is in contact with said metal coating of said reflector.

5. Use of the opto-electronic component according to one of claims 1 and 2 to 4 for manufacture of an opto-coupler made up of an opto-emitter and an opto-detector where said reflectors 2'"'"') of both said opto-emitter and said opto-detector have metal coatings and where said metal coatings of each reflector are connected in an electrically conducting manner to one of two part-strips, respectively, of the appropriate support strip carrying the emitter chip or detector chip, respectively.

6. An opto-coupler comprising an opto-emitter and an opto-detector, each including a respective opto-electronic component as defined in claim 3 but with the opto-emitter and the opto-detector having respective semiconductor chips which emit radiation and detect radiation, respectively, and wherein:

said opto-emitter and said opto-detector are disposed such that the respective said chips and reflectors face one another;

said reflectors of both said opto-emitter and said opto-detector have metal coatings on the respective said reflecting surfaces; and

the respective said metal coating of each reflector is connected in an electrically conducting manner to a respective one of said part-strips of the respective associated one of said support strips on which the respective chip of said opto-emitter and of said opto-detector is mounted.

7. An opto-electronic component according to claim 1 wherein at least said reflecting surface of said reflector is formed of a highly reflecting metal.

8. An opto-electronic component according to claim 7 wherein only one of said part-strips is in electrical contact with said metal of said reflector.

9. An opto-electronic component according to claim 7, further comprising a housing formed of a translucent material completely surrounding said reflector, said semiconductor chip and parts of said support strip, and wherein only ends of said part-strips of said support strip project out of said housing and act as connection pins.