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Method of and apparatus for inspecting pattern on printed board

  • US 5,384,711 A
  • Filed: 11/12/1991
  • Issued: 01/24/1995
  • Est. Priority Date: 11/27/1990
  • Status: Expired due to Fees
First Claim
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1. A method of inspecting a wiring pattern formed on a printed board, comprising the steps of:

  • (a) obtaining an image of said wiring pattern;

    (b) applying an image operator to said image to obtain a first data array, wherein said image operator has a plurality of operator arms each of which is formed of a plurality of pixel trains, and said first data array has a first plurality of data arms each of which is formed of a plurality of trains of data values, said step of applying an image operator including the steps of;

    (b-1) defining said image operator so that said plurality of pixel trains form a close bundle of parallel pixel trains;

    (b-2) serially selecting each pixel on said image; and

    (b-3) applying said image operator to said image while adjusting a center of said image operator to said each pixel of said image; and

    (c) converting said first data array into a second data array having a second plurality of data arms each of which is formed of a single train of data values, said converting step including the step of applying a logical operation on said plurality of trains of data values to obtain said single train of data values by;

    (c-1) determining a first type of logical operation and a second type of logical operation;

    (c-2) obtaining a data value of said image data at a center of said first data array which corresponds to said center of said image operator;

    (c-3) selecting one of said first and second types of logical operation as a function of said data value at said center of said first data array; and

    (c-4) applying said one of said first and second types of logical operation to said plurality of trains of data values to obtain said single train of data values; and

    (d) inspecting said wiring pattern as a function of said second data array.

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