Apparatus and method for deep thermoelectric refrigeration

• US 5,385,022 A
• Filed: 09/09/1993
• Issued: 01/31/1995
• Est. Priority Date: 09/09/1993
• Status: Expired due to Fees

• Current Assignee: Levy Kornblit
• Original Assignee: Levy Kornblit
• Inventors: Kornblit, Levy
• Primary Examiner(s): Sollecito, John M.
• Application Number:
  US08/119,363
• Time in Patent Office: 509 Days
• Field of Search: 62/3.2, 62/3.3, 62/3.7, 62/335
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H01L 23/38 Cooling arrangements using the Peltier effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 19/101 Multiple thermocouples connected in a cascade arrangement

Abstract

A method which removes the limitations existing on the cooling capability of ordinary TE coolers provides for thermally connecting in parallel a hierarchy of central and auxiliary thermoelectric couples to provide deep cooling of the central thermoelectric couple to temperatures below 100 degrees Kelvin, and as low as 70 degrees Kelvin or lower. These basic deep TE cooling units may serve as constituent components for the construction of one-stage deep TE modules which are capable of relatively high pumping capacity at very low temperatures. The present invention makes deep TE cooling possible with existing thermoelectric materials, and existing high volume semiconductor manufacturing techniques can be adapted for production of the present invention, so that solid state deep TE cooling becomes available for a wide variety of applications, including deep cooling of solid state electronics.

Claims

1. A compensated thermoelectric cooling unit comprising a plurality of thermally parallel cooling hierarchies each including at least one thermoelectric couple, said unit having a primary cooling hierarchy and at least one auxiliary cooling hierarchy thermally connected in parallel therewith;

each said thermoelectric couple including a p-leg and an n-leg connected at respective first ends to form respective cold junctions, and electrically connected at respective second ends to produce Peltier cooling at the cold junctions and to produce Joule heating between the first and second ends;

each said auxiliary cooling hierarchy having at least one thermal connector thermally connecting at least one respective cold junction of an auxiliary cooling hierarchy to at least one leg of at least one thermoelectric couple of the immediately preceding cooling hierarchy, said thermal connector thermally connecting to said at least one leg at a discrete position intermediate between the first and second ends thereof, and located where Joule heat traveling towards said first end may be substantially removed through said thermal connector only;

at least one said auxiliary cooling hierarchy having p-legs and n-legs sized to substantially remove Joule heat which is traveling towards said first ends of the immediately preceding cooling hierarchy;

whereby the auxiliary cooling hierarchies are thermally connected in parallel and remove a portion of at least the Joule heat from said primary thermoelectric couple for thermoelectric cooling thereof.

2. The cooling unit of claim 1 wherein at least one of said plurality of thermoelectric couples is a single hierarchy thermoelectric couple.

3. The cooling unit of claim 1 wherein said position at which said thermal connector thermally connects to said at least one leg is between the cold junction and generally midway between the first and second ends of said at least one leg thereof.

4. The cooling unit of claim 3 wherein said position is spaced from the cold junction approximately four-tenths of the distance between the first and second ends.

5. The cooling unit of claim 1 wherein said position at which said thermal connector thermally connects to said at least one leg is between the cold junction and an area between the first and second ends of said at least one leg where Joule heat flux is substantially zero during operation of said cooling unit.

6. The cooling unit of claim 1 wherein at least one said cooling hierarchy includes a plurality of thermoelectric couples thermally interconnected at their respective cold junctions by a common thermal connector.

7. The cooling unit of claim 1 wherein said thermal connector comprises a thermally conductive part extending from said at least one cold junction to intersect said at least one leg of a thermoelectric couple of an immediately preceding cooling hierarchy, said thermal connector electrically isolating said at least one leg of a thermoelectric couple from said at least one cold junction.

8. The cooling unit of claim 1 wherein the thermoelectric couples in the primary cooling hierarchy and succeeding auxiliary cooling hierarchies decrease in leg length from longer legs in the primary cooling hierarchy to shorter legs in the succeeding auxiliary cooling hierarchies.

9. The cooling unit of claim 1 wherein said unit includes said primary cooling hierarchy and at least first, second, and third auxiliary cooling hierarchies connected in hierarchical order one to the next in thermally parallel relationship.

10. The cooling unit of claim 9 wherein:

said thermoelectric couples are all single hierarchy couples;

said at least one thermal connector thermally connects both legs of the at least one thermoelectric couple of the immediately preceding cooling hierarchy; and

said position at which said thermal connector thermally connects to said legs is between the cold junction and generally midway between the first and second ends of said at least one leg thereof.

11. The cooling unit of claim 1 wherein said auxiliary cooling hierarchies are positioned in generally concentric relationship around said primary cooling hierarchy.

12. The cooling unit of claim 1 wherein said unit is comprised of layers of material deposited on a substrate.

13. The cooling unit of claim 12 Wherein at least a portion of a plurality of said layers are deposited in stacked relationship.

14. The cooling unit of claim 1 wherein said primary cooling hierarchy is cooled at its cold junction to a temperature less than 130 degrees Kelvin.

15. The cooling unit of claim 1 wherein said primary cooling hierarchy is cooled at its cold junction to a temperature less than 100 degrees Kelvin.

16. The cooling unit of claim 1 wherein said primary cooling hierarchy is cooled at its cold junction to a temperature less than 70 degrees Kelvin.

17. The cooling unit of claim 1 wherein said primary cooling hierarchy is cooled at its cold junction to a temperature of approximately 56 degrees Kelvin.

18. A compensated thermoelectric module comprising:

a plurality of compensated thermoelectric cooling units, each said unit comprising;

a plurality of thermally parallel cooling hierarchies each having at least one thermoelectric couple, wherein said plurality of cooling hierarchies includes a primary cooling hierarchy and at least one auxiliary cooling hierarchy thermally connected in parallel therewith;

each said thermoelectric couple including a p-leg and an n-leg connected at respective first ends to form respective cold junctions, and electrically connected at respective second ends to produce Peltier cooling at the cold junctions and to produce Joule heating between the first and second ends;

each said auxiliary cooling hierarchy having at least one thermal connector thermally connecting at least one respective cold junction of an auxiliary cooling hierarchy to at least one leg of at least one thermoelectric couple of the immediately preceding cooling hierarchy, said thermal connector thermally connecting to said at least one leg at a discrete position intermediate between the first and second ends thereof, and located where Joule heat traveling towards said first end may be substantially removed through said thermal connector only;

at least one said auxiliary cooling hierarchy having p-legs and n-legs sized to substantially remove Joule heat which is traveling towards said first ends of the immediately preceding cooling hierarchy; and

said plurality of compensated thermoelectric cooling units arranged such that the cold junctions of their respective primary cooling hierarchies cool a common element.

19. A method for cooling a thermoelectric unit comprising the steps of:

providing a plurality of thermoelectric couples each including a p-leg and an n-leg connected at their respective first ends to form respective cold junctions, and electrically connected at their respective second ends to produce Peltier cooling at the cold junctions and Joule heating between the first and second ends;

arranging groups of one or more of said thermoelectric couples into a primary cooling hierarchy and at least one auxiliary cooling hierarchy, said step of arranging including;

sizing said thermoelectric couples in said at least one auxiliary cooling hierarchy to substantially remove Joule heat which travels toward said first ends; and

thermally connecting at least one auxiliary cooling hierarchy generally at its cold junction in parallel with said primary cooling hierarchy at a discrete position between said first and second ends of said primary cooling hierarchy for substantial removal of Joule heat traveling towards said first ends; and

operating said thermoelectric couples to produce Peltier cooling at their respective cold junctions and substantially removing with at least one auxiliary cooling hierarchy that portion of Joule heat from the primary hierarchy which otherwise travels toward the cold junction thereof, thereby increasing cooling at the cold junction of the primary cooling hierarchy.

20. The method of claim 19 wherein:

said step of providing comprises providing at least three thermoelectric couples;

said step of arranging includes arranging said thermoelectric couples into a primary cooling hierarchy and a plurality of auxiliary cooling hierarchies; and

said step of thermally connecting includes thermally connecting subsequent ones of said auxiliary cooling hierarchies, generally at their cold junctions, in parallel with the immediately preceding auxiliary cooling hierarchy at a point of connection between respective first and second ends of the immediately preceding auxiliary cooling hierarchy, for substantial removal of Joule heat travelling towards the first end of the immediately preceding auxiliary cooling hierarchy.

21. The method of claim 19 wherein said step of thermally connecting in parallel comprises the steps of:

providing a thermally conductive part;

thermally connecting one portion of said thermally conductive part to at least one cold junction of an auxiliary cooling hierarchy, and

further connecting another portion of said thermally conductive part to at least one leg of a thermoelectric couple of the immediately preceding cooling hierarchy,

whereby the step of thermally connecting connects cooling hierarchies in parallel and removes a portion of at least the Joule heat from said primary thermoelectric couple for deep thermoelectric cooling thereof.

22. The method of claim 21 wherein:

said step of thermally connecting to at least one cold junction includes the step of electrically isolating said thermally conductive part from said at least one cold junction; and

said step of further connecting includes penetrating at least a portion of said at least one leg of a thermoelectric couple of the immediately preceding cooling hierarchy with said thermally conductive part.

23. The method of claim 21 wherein said step of further connecting to at least one leg includes thermally connecting both legs of the thermoelectric couple to at least one cold junction of an auxiliary cooling hierarchy.

24. The method of claim 21 wherein said step of further connecting to at least one leg includes positioning said further connection between the first and second ends of said at least one leg.

25. The method of claim 24 wherein the step of positioning comprises positioning said further connection generally at a single position between approximately midway between the first and second ends of said at least one leg, and the cold junction.

26. The method of claim 24 wherein the step of positioning comprises positioning said further connection generally at a single position between the cold junction and an area between the first and second ends of said at least one leg where Joule heat flux is substantially zero during operation of said cooling unit.

27. The method of claim 24 wherein said step of thermally connecting comprises positioning said further connection generally at a single position spaced from the cold junction of said at least one leg at which, when so connected, has a temperature equal to or greater than the temperature of the auxiliary cooling hierarchy cold junction connected thereto.

28. The method claim 19 wherein the steps of providing, arranging, and thermally connecting are performed with layers of materials on a substrate.

29. The method claim 19 wherein the steps of providing, arranging, and thermally connecting further include:

providing an additional one or more of said thermoelectric couples;

arranging groups of one or more of said additional thermoelectric couples into at least one additional cooling hierarchy; and

thermally connecting said at least one additional cooling hierarchy in parallel to at least one thermoelectric couple in said primary cooling hierarchy, said step of thermally connecting including the steps of;

positioning said additional cooling hierarchy to intercept heat conducted down one or more of said legs from respective second ends towards said cold junction; and

removing thereby at least a portion of the heat conducted from at least one second end towards said cold junction.

30. The method of claim 19 wherein:

the step of providing includes providing at least four thermoelectric couples;

the step of arranging includes arranging said at least four thermoelectric couples into a primary cooling hierarchy and at least first, second and third auxiliary cooling hierarchies; and

said step of thermally connecting includes thermally connecting the cooling hierarchies in hierarchical order, one to the next; and

said step of operating produces cooling at the cold junction of the primary cooling hierarchy to temperatures below 100 degrees Kelvin.

31. The method of claim 19 wherein the step of operating includes the step of producing cooling down to at least 130 degrees Kelvin.

32. The method of claim 19 wherein the step of operating includes the step of producing cooling down to at least 100 degrees Kelvin.

33. The method of claim 19 wherein the step of operating includes the step of producing cooling down to at least 70 degrees Kelvin.

34. The method of claim 19 wherein the step of operating includes the step of producing cooling down to a temperature of approximately 56 degrees Kelvin.

35. The method of claim 19 further comprising the steps of;

repeating the steps of providing, arranging, thermally connecting, and operating for a plurality of cooling thermoelectric units; and

combining said plurality of thermoelectric units into a compensated thermoelectric module.

36. The method of claim 19 wherein said step of thermally connecting includes penetrating at least one leg of a thermoelectric couple in said primary cooling hierarchy.