Method for manufacturing integrated semiconductor devices

• US 5,385,632 A
• Filed: 06/25/1993
• Issued: 01/31/1995
• Est. Priority Date: 06/25/1993
• Status: Expired due to Term

• Current Assignee: American Telephone & Telegraph Company (AT&T, Inc.)
• Original Assignee: AT&T Laboratories (AT&T, Inc.)
• Inventors: Goossen, Keith W.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US08/083,742
• Time in Patent Office: 585 Days
• Field of Search: 156/630, 156/631, 156/633, 156/634, 156/650-659.1, 156/662, 437/51, 437/228, 437/234, 437/245, 437/1-5, 437/180, 437/184, 437/185, 437/194, 437/209, 437/229, 437/238, 148/33.4, 148/33.5
• US Class Current: 438/25
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/125 Composite devices with photosensitive elements and electroluminescent elements within one single body
• CPC Class Codes: Y10S 438/933 Germanium or silicon or Ge-Si on III-V
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

An integrated semiconductor device is formed by bonding the conductors of one fabricated semiconductor device having a substrate to the conductors on another fabricated semiconductor device having a substrate, flowing an etch-resist in the form of a photoresist between the devices, allowing the etch-resist to dry, and removing the substrate from one of the semiconductor devices. Preferably the etch-resist is retained to impart mechanical strength to the device. More specifically, a hybrid semiconductor device is formed by bonding the conductors of one or more GaAs/AlGaAs multiple quantum well modulators to conductors on an IC chip, flowing a photoresist between the modulators and the chip, allowing the photoresist to dry, and removing the substrate from the modulator.

Claims

1. The method of forming an integrated semiconductor device, comprising the steps of:

bonding conductors of a first semiconductor device having a substrate to conductors on a second semiconductor device having a substrate;

flowing an etch-resist to fill a space between the first semiconductor device and the second semiconductor device;

allowing the etch-resist to dry; and

removing the substrate from the second semiconductor device.

2. The method as in claim 1, wherein the step of flowing includes flowing the etch-resist between and around said conductors and around said semiconductor devices.

3. The method as in claim 1, wherein the step of flowing includes flowing the etch-resist between the first and second semiconductor devices via capillary action.

4. The method as in claim 1, wherein the step of bonding includes forming surfaces of any one of a group comprising In, Au, and mixtures of In, Au, Sn, and Pb on the conductors.

5. The method as in claim 1, wherein the step of bonding includes forming surfaces of In on the conductors.

6. The method as in claim 1, wherein said conductors are metallic.

7. The method as in claim 1, wherein the step of flowing includes flowing sufficient etch-resist so that said etch-resist, when dried, forms a structural support from one of the semiconductor devices to the other.

8. The method as in claim 1, wherein the step of removing includes leaving enough etch-resist to enhance the structural support of one of the semiconductor devices to the other.

9. The method as in claim 1, wherein:

the step of flowing includes flowing the etch-resist between and around said semiconductor devices; and

the step of removing includes leaving enough etch-resist to enhance the structural support of one of the semiconductor devices to the other.

10. The method as in claim 1, wherein the second semiconductor device includes a GaAs/AlGaAs composite material system, and the first semiconductor device includes a Si material.

11. The method as in claim 1, wherein the second semiconductor device is a photonic device and the first semiconductor device is a Si device, and said removing step includes removing the substrate from the photonic device.

12. The method as in claim 1, wherein the second semiconductor device includes a modulator having a GaAs/AlGaAs multiple quantum well modulator unit and said first semiconductor device includes a Si integrated circuit chip.

13. The method as in claim 1, wherein the second semiconductor device includes a modulator having a GaAs/AlGaAs 850 nm λ

multiple quantum well modulator unit and said first semiconductor device includes a Si integrated circuit chip.

14. The method as in claim 1, wherein the step of removing includes removing said substrate chemically.

15. The method as in claim 1, wherein the step of removing includes removing oxides of said second semiconductor with a solution before removing the substrate.

16. The method as in claim 15, wherein the step of removing includes removing oxides of said second semiconductor with a KOH solution before removing the substrate.

17. The method as in claim 1, wherein the step of removing includes removing with a 100:

1 H₂ O₂ ;

NH₄ OH compound.

18. The method as in claim 1, wherein said second semiconductor device includes:

a GaAs portion forming said substrate of said second semiconductor device;

an n-doped AlGaAs layer;

a multiple quantum well modulator unit including GaAs wells and AlGaAs barriers;

a p-doped AlGaAs layer; and

a plurality of gold contacts, one contacting said n-doped AlGaAs layer and one contacting said p-doped AlGaAs layer.

19. A method as in claim 1, wherein said flowing step includes flowing said etch-resist in the form of a photoresist.

20. A method as in claim 1, wherein the removing step includes removing the etch-resist after removing the substrate from said second semiconductor device.

21. A method as in claim 1, wherein the etch resist is a photoresist, and the step of removing includes selectively removing a portion of the photoresist.