Solid state chemical micro-reservoirs

• US 5,385,709 A
• Filed: 06/24/1993
• Issued: 01/31/1995
• Est. Priority Date: 02/12/1992
• Status: Expired due to Fees

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Gland, John L., Wise, Kensall D., Schwank, Johannes W.
• Primary Examiner(s): Warden, Robert J.
• Assistant Examiner(s): TRAN, HIEN THI
• Application Number:
  US08/080,526
• Time in Patent Office: 586 Days
• Field of Search: 422/98, 422/88, 422/90, 422/124, 204/416, 204/418, 204/419, 252/181.1, 252/181.2, 252/188.26, 252/188.27, 502/526, 420/900, 423/658.2
• US Class Current: 422/98
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: G01N 2035/00237 Handling microquantities of analyte, e.g. microvalves, capillary networks
• CPC Class Codes: G01N 27/12 of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid , for detecting components in the fluid
• CPC Class Codes: G01N 35/00 Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
• CPC Class Codes: G01N 35/1002 Reagent dispensers

Abstract

The present invention relates to a method for storing chemical reagents in micro-reservoirs, a chemical sensor system and a chemical micro-reactor.

Claims

1. A method for storing a chemical in a chemical micro-reservoir comprising:

i) absorbing up to 10^-3 mmol of a predetermined chemical onto an active film of a chemical micro-reservoir;

ii) storing said predetermined chemical on said active film; and

iii) heating said film to release said predetermined chemical, wherein said chemical micro-reservoir comprises;

i) a substrate comprising

a) two opposed major surfaces including a dielectric window region;

b) heater means situated on said dielectric window region on one side of side opposed surfaces; and

c) a conductivity cell electrode means situated on said dielectric window on the opposite surface from said heater means; and

ii) an active film deposited on said surface containing said conductivity cell electrode means.

2. The method of claim 1, wherein said active film has a thickness of from 0.5 nm to 25 nm.