Low temperature flexible die attach adhesive and articles using same
First Claim
1. A flexible adhesive formulation having a ROC value of about 1 meter or above comprising the reaction product of a cyanate ester-containing material and at least one flexibilizer miscible with cyanate ester in the uncured state selected from the group consisting of elastomeric and thermoplastic modifiers selected from the group consisting of hydroxyl, amine, and epoxide reactive functional group containing compounds and mixtures thereof, said cyanate ester comprising a least 15 wt. % of the mixture to be reacted and said flexibilizer having a glass transition temperature less than about 25°
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Accused Products
Abstract
Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
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Citations
9 Claims
- 1. A flexible adhesive formulation having a ROC value of about 1 meter or above comprising the reaction product of a cyanate ester-containing material and at least one flexibilizer miscible with cyanate ester in the uncured state selected from the group consisting of elastomeric and thermoplastic modifiers selected from the group consisting of hydroxyl, amine, and epoxide reactive functional group containing compounds and mixtures thereof, said cyanate ester comprising a least 15 wt. % of the mixture to be reacted and said flexibilizer having a glass transition temperature less than about 25°
Specification