Optical apparatus and method for measuring temperature of a substrate material with a temperature dependent band gap

• US 5,388,909 A
• Filed: 09/16/1993
• Issued: 02/14/1995
• Est. Priority Date: 09/16/1993
• Status: Expired due to Fees

• Current Assignee: Christian Lavoie, Johnson, Shane R., Mark K. Nissen, Tiedje J. Thomas
• Original Assignee: Christian Lavoie, Johnson, Shane R., Mark K. Nissen, Tiedje J. Thomas
• Inventors: Lavoie, Christian, Johnson, Shane R., Tiedje, J. Thomas, Nissen, Mark K.
• Primary Examiner(s): GUTIERREZ, DIEGO F
• Application Number:
  US08/121,521
• Time in Patent Office: 516 Days
• Field of Search: 374/120, 374/161, 374/131, 356/44
• US Class Current: 374/161
• CPC Class Codes: G01K 11/14 of inorganic materials

Abstract

An optical method and apparatus for measuring the temperature of a substrate material with a temperature dependent bandgap. The substrate is illuminated with a broad spectrum lamp and the bandgap is determined from the spectrum of the diffusely scattered light. The spectrum of the light from the lamp is sufficiently broad that it covers the spectral range above and below the bandgap of the substrate. Wavelengths corresponding to photon energies less than the bandgap of the substrate are transmitted through the substrate and are reflected from the back surface of the substrate as well as from the front surface while the wavelengths corresponding to photon energies larger than the bandgap are reflected only from the front surface. If the front surface is polished the front surface reflection will be specular while if the back surface is rough the reflection from the back surface will be non-specular. The back surface reflection is detected with a detector in a non-specular location. From the wavelength of the onset of the non-specular reflection the bandgap can be determined which gives the temperature. The temperature is determined from the knee in the diffuse reflectance spectrum near the bandgap.

Claims

1. An apparatus for measuring the temperature of a substrate material by inference from its band gap measured by diffuse reflectivity comprising:

(a) white light lamp means for emitting broad spectrum white light;

(b) focusing means for focusing the white light emitted from the lamp means upon a front surface of a substrate material which is polished on the front surface and is polished or textured on a back surface, said white light being specularly reflected from the front surface of the substrate material and non-specularly reflected from the back surface of the substrate material;

(c) a diffuser means located adjacent the back surface of the substrate material for non-specularly reflecting the white light emitted from the lamp means;

(d) detector means positioned at a non-specular position on the front side of the substrate material for detecting non-specularly reflected white light from the back surface of the substrate material;

(e) optical fibre bundle means for collecting non-specularly reflected light detected by the detector means; and

(f) computing means for determining a temperature dependent band gap from onset wavelength of non-specular reflection from the back surface of the substrate material transmitted through the optical fibre bundle means.

2. An apparatus as claimed in claim 1 wherein the optical fibre bundle means has a circular cross-section at its entrance and a rectangular cross-section at its exit.

3. An apparatus as claimed in claim 2 wherein light chopping means are positioned between the white lamp means and the focusing means.

4. An apparatus as claimed in claim 3 wherein the focusing means is a mirror.

5. An apparatus as claimed in claim 4 including filter means for filtering white light emitted from the white light lamp means before the light is transmitted to the mirror.

6. An apparatus as claimed in claim 5 wherein the filtering means eliminates short wavelength light not close to the band gap of the substrate material.

7. An apparatus as claimed in claim 6 including light chopping means positioned between the white light lamp means and the focusing means.

8. An apparatus as claimed in claim 7 wherein the detector means includes a first collective lens which collects non-specularly reflected light and focuses the light into the optical fibre bundle means.

9. An apparatus as claimed in claim 8 wherein the light focused through the optical fibre bundle means is passed through a second collecting lens before being transmitted into the detector means.

10. An apparatus as claimed in claim 9 wherein the detector means is sensitive to wavelengths of non-specular light spanning an optical band gap at the temperature of the substrate material.

11. An apparatus as claimed in claim 10 including a monochromating means positioned between the optical fibre bundle means and the computing means.

12. An apparatus as claimed in claim 11 including adjustable aperture means positioned between the first collecting means and the optical fibre bundle means, the first collecting means projecting an image of non-specular reflected light onto the adjustable aperture means.

13. An apparatus as claimed in claim 12 wherein the aperture means and optical fibre bundle means are connected to a micrometer driven stage.

14. An apparatus as claimed in claim 12 wherein the diffuser means comprises a pyrolytic boron nitride diffuser plate located behind the substrate material, said plate being attached to a holding means upon which the substrate material is held.

15. An apparatus as claimed in claim 3 wherein the computing means includes a monochromating means which transmits process data to the computing means, and a cooled InGaAs detector means connected to the monochromating means, the data from the computer means and the cooled InGaAs detector means being transmitted to a lock-in amplifying means, which is connected to the chopping means.

16. An apparatus as claimed in claim 15 wherein the substrate material is silicon.

17. An apparatus as claimed in claim 16 wherein the diffuser means comprises a pyrolytic boron nitride diffuser plate attached to a holding means upon which the substrate material is held.