Use of a saw frame with tape as a substrate carrier for wafer level backend processing
First Claim
1. A method of fabricating a microelectronic device comprising the steps of:
- providing a piece of dicing tape having an adhesive side;
mounting a wafer on the adhesive side of said dicing tape, said wafer containing partially fabricated devices;
subdividing said wafer to separate said partially fabricated devices, said separated devices remaining mounted to said dicing tape;
placing a protective cover over exposed portions of the adhesive side of said dicing tape;
continuing the fabrication of said separated devices while the protective cover remains over the exposed portions of the adhesive side of said dicing tape; and
removing said devices from said dicing tape.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for processing a wafer containing microelectronic mechanical devices that allows all fabrication and test steps to be performed in wafer form instead of device form. The water 20 is mounted in a saw frame 24 on dicing tape 22 and the individual devices 27 separated, typically by sawing, prior to completing device fabrication. The devices are left on the dicing tape during the remaining fabrication steps. Some fabrication steps may require covering the adhesive of the dicing tape with a protective cover 44. After all fabrication steps including the application of a protective overcoat and functional testing are completed, the devices are removed from the dicing tape and packaged.
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Citations
19 Claims
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1. A method of fabricating a microelectronic device comprising the steps of:
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providing a piece of dicing tape having an adhesive side; mounting a wafer on the adhesive side of said dicing tape, said wafer containing partially fabricated devices; subdividing said wafer to separate said partially fabricated devices, said separated devices remaining mounted to said dicing tape; placing a protective cover over exposed portions of the adhesive side of said dicing tape; continuing the fabrication of said separated devices while the protective cover remains over the exposed portions of the adhesive side of said dicing tape; and removing said devices from said dicing tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating a digital micromirror device comprising the steps of:
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providing a piece of dicing tape having an adhesive side; mounting a wafer on the adhesive side of said dicing tape, said wafer containing partially fabricated digital micromirror devices; subdividing said wafer to separate said partially fabricated digital micromirror devices, said separated digital micromirror devices remaining mounted to said dicing tape; placing a protective cover, selected from the group consisting of ceramic, metal, quartz and dicing tape, over exposed portions of the adhesive side of said dicing tape; continuing the fabrication of said separated digital micromirror devices while the protective cover remains over the exposed portions of the adhesive side of said dicing tape; and removing said digital micromirror devices from said dicing tape. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method of fabricating an accelerometer comprising the steps of:
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providing a piece of dicing tape having an adhesive side; mounting a wafer on the adhesive side of said dicing tape, said wafer containing partially fabricated accelerometers; subdividing said wafer to separate said partially fabricated accelerometers, said separated accelerometers remaining mounted to said dicing tape; placing a protective cover, selected from the group consisting of ceramic, metal, quartz and dicing tape, over exposed portions of the adhesive side of said dicing tape; continuing the fabrication of said separated accelerometers while the protective cover remains over the exposed portions of the adhesive side of said dicing tape; and removing said accelerometers from said dicing tape. - View Dependent Claims (17, 18, 19)
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Specification