Resin compositions and a method of curing the same

• US 5,389,727 A
• Filed: 08/27/1993
• Issued: 02/14/1995
• Est. Priority Date: 09/09/1988
• Status: Expired due to Term

• Current Assignee: Kansai Paint Company Limited
• Original Assignee: Kansai Paint Company Limited
• Inventors: Isozaki, Osamu, Iwasawa, Naozumi, Nakai, Noboru
• Primary Examiner(s): Marquis, Melvyn I.
• Assistant Examiner(s): AYLWARD, DAVID E
• Application Number:
  US08/112,311
• Time in Patent Office: 536 Days
• Field of Search: 525/116, 525/118, 525/101, 525/195, 526/279
• US Class Current: 525/101
• CPC Class Codes: C07F 7/0836 Compounds with one or more Si-OH or Si-O-metal linkage
• CPC Class Codes: C07F 7/0838 Compounds with one or more Si-O-Si sequences compounds with a ring containing only alternating Si and O atoms, i.e. cyclosilanes C07F7/21
• CPC Class Codes: C07F 7/1804 Compounds having Si-O-C linkages Si-O-acyl linkages C07F7/1896
• CPC Class Codes: C07F 7/1896 Compounds having one or more Si-O-acyl linkages
• CPC Class Codes: C08G 59/02 Polycondensates containing more than one epoxy group per molecule
• CPC Class Codes: C08G 59/04 of polyhydroxy compounds with epihalohydrins or precursors thereof
• CPC Class Codes: C08G 59/306 containing silicon
• CPC Class Codes: C08G 59/3254 containing atoms other than carbon, hydrogen, oxygen or nitrogen
• CPC Class Codes: C08G 59/70 Chelates
• CPC Class Codes: C08K 5/00 Use of organic ingredients
• CPC Class Codes: C08K 5/0091 Complexes with metal-heteroatom-bonds
• CPC Class Codes: C08K 5/07 Aldehydes; Ketones
• CPC Class Codes: C08K 5/1515 Three-membered rings
• CPC Class Codes: C08K 5/5415 containing at least one Si—O bond
• CPC Class Codes: C08L 101/06 containing oxygen atoms C08L101/025 takes precedence
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 2666/28 Non-macromolecular organic substances
• CPC Class Codes: C08L 33/068 containing glycidyl groups
• CPC Class Codes: C08L 43/04 : Homopolymers or copolymers of monomers containing silicon
• CPC Class Codes: C08L 63/00 : Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 75/04 : Polyurethanes
• CPC Class Codes: C08L 83/04 : Polysiloxanes
• CPC Class Codes: C09D 133/064 : containing anhydride, COOH or COOM groups, with M being metal or onium-cation
• CPC Class Codes: C09D 133/068 : containing glycidyl groups
• CPC Class Codes: C09D 143/04 : Homopolymers or copolymers of monomers containing silicon
• CPC Class Codes: C09D 163/00 : Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Abstract

A resin composition comprising a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more functional groups selected from the class consisting of alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000; a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000; and, as a curing catalyst, a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.

Claims

1. A resin composition comprising (F) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more functional groups selected from the class consisting of alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000, (G) a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000, and (D) at least one metal chelate compound selected from the class consisting of aluminum chelate compounds, titanium chelate compounds and zirconium chelate compounds.

2. A resin composition according to claim 1 wherein said high molecular weight compound (F) contains an average of 2 to 400 hydroxyl groups and an average of 1 to 2,500 said functional groups per molecule and said low molecular weight compound (G) contains an average of 2 to 500 epoxy groups per molecule.

3. A resin composition according to claim 1 which contains 5 to 95 weight percent of said high molecular weight compound containing both hydroxyl and said functional groups (F), 95 to 5 weight percent of said low molecular weight compound containing epoxy groups (G), both based on the combined weight of (F) and (G), and 0.01 to 10 parts by weight of said metal chelate compound (D) per 100 parts by weight of (F) and (G) combined.