Tamperproof arrangement for an integrated circuit device

• US 5,389,738 A
• Filed: 05/04/1992
• Issued: 02/14/1995
• Est. Priority Date: 05/04/1992
• Status: Expired due to Term

• Current Assignee: General Dynamics C4 Systems Incorporated (General Dynamics Corporation)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Chandos, Ronald V., Harrison, David M., Piosenka, Gerald V.
• Primary Examiner(s): LEDYNH, BOT L
• Application Number:
  US07/878,271
• Time in Patent Office: 1,016 Days
• Field of Search: 174/52.4, 174/52.2, 340/584, 340/598, 340/600, 340/521, 340/653, 340/651, 340/652, 380/3, 380/4, 380/52, 380/59, 361/728-730, 361/733-734, 257/678, 257/687, 257/782-784, 257/787
• US Class Current: 174/528
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence
• CPC Class Codes: G08B 13/128 the housing being an electronic circuit unit, e.g. memory or CPU chip protecting computer components in secure or tamper resistant housings G06F21/86; protecting computer input devices, e.g. keyboards G06F21/83
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49112 the connectors connecting a common bonding area on the semiconductor or solid-state body to different bonding areas outside the body, e.g. diverging wires
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/576 using active circuits
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 27/02 including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/163 : Connection portion, e.g. seal
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A tamperproof arrangement for an integrated circuit device. The arrangement includes a package and lid fabricated of heavy metals to prevent X-radiation or infrared detection of circuit operation. Sensors and control circuitry are located on the integrated circuit die itself which detect increased temperature and radiation and clear or zeroize any sensitive information included within the integrated circuit device. Electrode finger grids above and below the integrated circuit die detect physical attempts to penetrate the integrated circuit die. Critical circuit functions are segregated from non-critical functions. Power applied to the integrated circuit device is monitored and separated for critical and non-critical circuit functions.

Claims

1. A tamperproof arrangement for an integrated circuit device comprising:

an integrated circuit package including a lid for sealing said integrated circuit package;

an integrated circuit die including an integrated circuit for providing electronic circuitry;

die attach material for bonding said integrated circuit die to said integrated circuit package;

means for detecting a physical attack of said integrated circuit;

means responsive to said means for detecting for clearing critical information from said integrated circuit;

said means for detecting including;

at least two metal conductor grids located only underneath said integrated circuit, said conductor grids for detecting damage to said integrated circuit and providing an indication to said means responsive for clearing said critical information; and

a dielectric layer interposed between electrode fingers of said two metal conductor grids, in response to damage of said dielectric layer, said dielectric layer indicating a change in capacitance, said means responsive operating to clear said critical information in response to said change in capacitance.

2. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, wherein there is further included a conformal epoxy coating disposed over said integrated die to render said integrated circuit die impervious to said physical attack.

3. A tamperproof arrangement for an integrated circuit device as claimed in claim 2, wherein there is further included:

a three-dimensional insulated conductor bundle embedded in said epoxy compound, said insulated conductor bundle coupled to said means responsive for indicating to said means responsive whether said insulated conductor bundle has been damaged indicating an attack upon the integrated circuit; and

said means responsive to said damage of said insulated conductor bundle to clear said critical information of said integrated circuit die.

4. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, wherein there is further included a three-dimensional insulated conductor bundle disposed over said integrated circuit die, said insulated conductor bundle being coupled to said means responsive and for indicating to said means responsive whether said insulated conductor bundle has been damaged indicating an attack upon the integrated circuit die.

5. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, wherein said electrode fingers of said at least two conductor grids include electrode fingers having a pitch of approximately 4 microns.

6. A tamperproof arrangement for an integrated circuit device as claimed in claim 5, wherein said two metal conductor grids are positioned so that said electrode fingers of said two metal conductor grids are substantially parallel.

7. A tamperproof arrangement for an integrated circuit device as claimed in claim 5, wherein said two metal conductor grids are positioned so that said electrode fingers are substantially orthogonal.

8. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, wherein said integrated circuit package and said lid comprise a heavy metal.

9. A tamperproof arrangement for an integrated circuit device as claimed in claim 8, wherein said heavy metal comprises silver.

10. A tamperproof arrangement for an integrated circuit device as claimed in claim 8, wherein said heavy metal comprises titanium.

11. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, wherein said means for detecting further includes contact points affixed to said integrated circuit package and said lid, said contact points being normally placed in contact with one another to form a continuous electric circuit, said contact points providing an indication of a removal of said lid from said integrated circuit package, said means responsive to said indication of removal of said lid from said integrated circuit package to clear said critical information of said integrated circuit die.

12. A tamperproof arrangement for an integrated circuit device as claimed in claim 1, said means for detecting further including:

sensor means located on said integrated circuit die, said sensor means detecting changes in temperature of said integrated circuit die and providing an indication proportional to said changes;

reference means for providing a threshold temperature indication;

comparing means coupled to said sensor means and to said reference means, said sensor means operating to determine whether said indication proportional to said changes in said temperature exceeds said threshold temperature indication and producing a first signal in response; and

indicating means coupled to said comparing means, said indicating means responsive to said first signal to produce an alarm signal indicating that said integrated circuit is being attacked.

13. A tamperproof arrangement for an integrated circuit device as claimed in claim 12, wherein said sensor means includes temperature sensor means for providing an output voltage proportional to a temperature of said integrated circuit die;

and said reference means providing a threshold voltage.

14. A tamperproof arrangement for an integrated circuit device as claimed in claim 12, wherein said sensor means further includes radiation sensor means located on said integrated circuit die, said radiation means providing an electrical current proportional to the level of radiation of said integrated circuit die;

and said reference means providing a threshold current.

15. A tamperproof arrangement for an integrated circuit device as claimed in claim 12, wherein said means responsive includes:

control circuit means located on said integrated circuit, said control means coupled to said indicating means and responsive to said alarm signal to produce a control signal;

at least one memory element including said critical information; and

power means located on said integrated circuit and coupled to said control circuit means and to said at least one memory element, said power means operating in response to said control signal to clear said at least one memory element.

16. A tamperproof arrangement for an integrated circuit device as claimed in claim 15, wherein there is further included:

bonding pads located on said integrated circuit die for coupling inputs and outputs to and from said integrated circuit, to and from external connections;

said means for detecting further including voltage detection means coupled to said bonding pads, said voltage detection means for detecting an over or under voltage application from said external connections to said bonding pads;

generation means coupled to said voltage detection means, said generation means providing a second alarm signal in response to said voltage detection means detecting an over or under voltage condition; and

said control circuit means operating in response to said second alarm signal to clear said critical information of said at least one memory element.