Method for making printed circuit boards
First Claim
1. A method of making a three dimensional printed circuit board, comprising:
- forming a three dimensional female predecessor tool;
forming a three dimensional male mold tool using said three dimensional female predecessor tool;
coating said three dimensional male mold tool with a thin layer of a highly adhesive material;
pressing said three dimensional male mold tool into a deformable plastic material to deform the plastic material into a metallized substrate having a surface with a plurality of metallized grooves disposed therein;
admitting to said plurality of metallized grooves an etch resistant material; and
etching a desired electrical circuit pattern in the surface of said metallic material.
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Accused Products
Abstract
A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.
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Citations
18 Claims
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1. A method of making a three dimensional printed circuit board, comprising:
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forming a three dimensional female predecessor tool; forming a three dimensional male mold tool using said three dimensional female predecessor tool; coating said three dimensional male mold tool with a thin layer of a highly adhesive material; pressing said three dimensional male mold tool into a deformable plastic material to deform the plastic material into a metallized substrate having a surface with a plurality of metallized grooves disposed therein; admitting to said plurality of metallized grooves an etch resistant material; and etching a desired electrical circuit pattern in the surface of said metallic material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of making a three dimensional printed circuit board blank:
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forming a three dimensional female predecessor tool; forming a three dimensional male mold tool using said three dimensional female predecessor tool; electroplating the surface of said male tool with a metallic material; coating said three dimensional male mold tool with a thin layer of an adhesion-promoting material; pressing said three dimensional male mold tool into a deformable plastic material to deform the plastic material into a substrate having a surface with a plurality of metallized grooves disposed therein; admitting to said plurality of metallized grooves an etch resistant material; and etching and removing unwanted conductive material from the substrate for removal purposes.
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Specification