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Hot melt adhesive compositions comprising low molecular weight ethylene copolymers

  • US 5,391,434 A
  • Filed: 05/12/1994
  • Issued: 02/21/1995
  • Est. Priority Date: 03/13/1992
  • Status: Expired due to Fees
First Claim
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1. A laminar structure comprising:

  • (I) a first substrate;

    (II) a second substrate; and

    (III) a hot melt adhesive comprising;

    (a) a base polymer constituent having a melt index of 0.2 to 3000g/10min as measured by ASTM D-1238;

    (b) a tackifying constituent;

    (c) optionally a wax constituent; and

    (d) a low molecular weight constituent having a melt index of greater than 3000g/10 min as measured by ASTM D-1238, said low molecular weight constituent being selected from the group consisting of;

    (i) random ethylene/carbon monoxide copolymers;

    (ii) random ethylene/vinyl alcohol copolymers consisting of less than about 10 mol percent vinyl alcohol;

    (iii) random ethylene/vinyl alcohol/vinyl acetate terpolymers consisting of less than about 10 mol percent vinyl alcohol;

    (iv) random polymers of (i), (ii), and (iii) with additional recurring monomeric units derived from monomers selepted from the group consisting of alkyl acrylates, acrylic acid, methacrylic acid, maleic anhydride, and vinyl acetate; and

    (v) at least partially oxidized said (i), (ii), (iii), and (iv)wherein said first substrate (I) and said second substrate (II) are joined by an intermediate layer of said hot melt adhesive (III) in interfacial contact therewith and said low molecular weight constituent (d) is present in an amount sufficient to provide greater adhesion to said substrates than a comparative composition in which said low molecular weight constituent is absent.

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