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Charged particle beam exposure system and method of exposing a pattern on an object by such a charged particle beam exposure system

  • US 5,391,886 A
  • Filed: 10/05/1993
  • Issued: 02/21/1995
  • Est. Priority Date: 08/09/1991
  • Status: Expired due to Term
First Claim
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1. A method for exposing a pattern on an object by means of a focused charged particle beam, comprising the steps of:

  • forming a charged particle beam in a beam source such that said charged particle beam travels toward said object along an optical axis;

    focusing said charged particle beam upon said object;

    shaping said charged particle beam in a region between said beam source and said object to form a shaped charged particle beam, said step of shaping comprising a step of deflecting said charged particle beam away from said optical axis by energizing deflection means that includes a plurality of deflectors, such that said charged particle beam passes one of a plurality of apertures provided on a beam shaping mask;

    deflecting back said shaped charged particle beam again upon said optical axis;

    radiating said shaped charged particle beam along said optical axis upon a shielding plate that is formed with a pinhole having a size generally corresponding to a diameter of said charged particle beam, said shielding plate being provided on said optical axis at a location between said beam shaping mask and said object; and

    selectively causing a turning off of said charged particle beam on said object by selectively deflecting said charged particle beam that has been radiated upon said shielding plate, away from said pinhole, said plurality of deflectors including first through fourth deflectors wherein said first and second deflectors are disposed at a side close to said beam source with respect to said beam shaping mask and such that said third and fourth deflectors are disposed at a side close to said object;

    said method further comprising the steps of;

    (a-1) energizing said first deflector forming said deflection means to cause a deflection of said charged particle beam to a plurality of calibration points that are located offset from said optical axis; and

    energizing, in each of said calibration points, the remaining deflectors forming said deflection means;

    (a-2) detecting an intensity of said charged particle beam arriving at said object while energizing said remaining deflectors in said step (a-1), for each of said calibration points; and

    obtaining optimized energization of said remaining deflectors by optimizing energization of said remaining deflectors such that the charged particle beam, deflected in said step (a-1) and arriving at said object after passing through said pinhole, has a maximum intensity;

    (a-3) obtaining a relativistic correction function that describes said optimized energization of said remaining deflectors obtained in said step (a-2) as a function of the energization of said first deflector;

    (a-4) energizing said first deflector to cause a deflection of said charged particle beam such that said charged particle beam passes a selected aperture on said beam shaping mask;

    energizing said remaining deflectors according to said relativistic correction function, simultaneously to said first deflector that is deflecting said charged particle beam to said selected aperture; and

    obtaining optimized energization of said first deflector such that said charged particle beam, arriving at said object after passing through said pinhole, has a maximum intensity;

    (a-5) obtaining an absolute correction function that describes said optimized energization of said first deflector obtained in said step (a-4), as a function of a position of said selected aperture on said beam shaping mask; and

    (b) deflecting said charged particle beam by energizing said first deflector according to said absolute correction function and said remaining deflectors according to said relativistic correction function, based upon energization of said first deflector, such that said electron beam hits said selected aperture on said beam shaping mask;

    said step (a-2) further comprising the steps of;

    (a-2-1) obtaining optimized energization of said second deflector with respect to energization of said first deflector by energizing said first and second deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity; and

    (a-2-2) obtaining optimized energization of said third deflector with respect to the energization of said fourth deflector by energizing said third and fourth deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity.

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