Charged particle beam exposure system and method of exposing a pattern on an object by such a charged particle beam exposure system
First Claim
1. A method for exposing a pattern on an object by means of a focused charged particle beam, comprising the steps of:
- forming a charged particle beam in a beam source such that said charged particle beam travels toward said object along an optical axis;
focusing said charged particle beam upon said object;
shaping said charged particle beam in a region between said beam source and said object to form a shaped charged particle beam, said step of shaping comprising a step of deflecting said charged particle beam away from said optical axis by energizing deflection means that includes a plurality of deflectors, such that said charged particle beam passes one of a plurality of apertures provided on a beam shaping mask;
deflecting back said shaped charged particle beam again upon said optical axis;
radiating said shaped charged particle beam along said optical axis upon a shielding plate that is formed with a pinhole having a size generally corresponding to a diameter of said charged particle beam, said shielding plate being provided on said optical axis at a location between said beam shaping mask and said object; and
selectively causing a turning off of said charged particle beam on said object by selectively deflecting said charged particle beam that has been radiated upon said shielding plate, away from said pinhole, said plurality of deflectors including first through fourth deflectors wherein said first and second deflectors are disposed at a side close to said beam source with respect to said beam shaping mask and such that said third and fourth deflectors are disposed at a side close to said object;
said method further comprising the steps of;
(a-1) energizing said first deflector forming said deflection means to cause a deflection of said charged particle beam to a plurality of calibration points that are located offset from said optical axis; and
energizing, in each of said calibration points, the remaining deflectors forming said deflection means;
(a-2) detecting an intensity of said charged particle beam arriving at said object while energizing said remaining deflectors in said step (a-1), for each of said calibration points; and
obtaining optimized energization of said remaining deflectors by optimizing energization of said remaining deflectors such that the charged particle beam, deflected in said step (a-1) and arriving at said object after passing through said pinhole, has a maximum intensity;
(a-3) obtaining a relativistic correction function that describes said optimized energization of said remaining deflectors obtained in said step (a-2) as a function of the energization of said first deflector;
(a-4) energizing said first deflector to cause a deflection of said charged particle beam such that said charged particle beam passes a selected aperture on said beam shaping mask;
energizing said remaining deflectors according to said relativistic correction function, simultaneously to said first deflector that is deflecting said charged particle beam to said selected aperture; and
obtaining optimized energization of said first deflector such that said charged particle beam, arriving at said object after passing through said pinhole, has a maximum intensity;
(a-5) obtaining an absolute correction function that describes said optimized energization of said first deflector obtained in said step (a-4), as a function of a position of said selected aperture on said beam shaping mask; and
(b) deflecting said charged particle beam by energizing said first deflector according to said absolute correction function and said remaining deflectors according to said relativistic correction function, based upon energization of said first deflector, such that said electron beam hits said selected aperture on said beam shaping mask;
said step (a-2) further comprising the steps of;
(a-2-1) obtaining optimized energization of said second deflector with respect to energization of said first deflector by energizing said first and second deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity; and
(a-2-2) obtaining optimized energization of said third deflector with respect to the energization of said fourth deflector by energizing said third and fourth deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity.
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Accused Products
Abstract
A method of exposing a pattern on a substrate by a charged particle beam includes the steps of energizing first and second mask deflectors provided at an upstream side of a stencil mask simultaneously to obtain a first relativistic relationship of energization between the first and second mask deflectors, energizing the first mask deflector and simultaneously the second mask deflector according to the first relativistic relationship so as to hit a selected aperture on the stencil mask, to obtain an absolute deflection of the charged particle beam as a function of the energization of the first mask deflector, energizing third and fourth mask deflectors provided at a downstream side of the stencil mask simultaneously to obtain a second relativistic relationship of energization between the third and fourth mask deflectors, and energizing the first through fourth mask deflectors according to the first and second relativistic relationship and further to the absolute relationship, such that the charged particle beam is deflected away from an optical axis and hit a selected aperture on the stencil mask while traveling parallel to the optical axis, and such that the charged particle beam passed through the stencil mask is deflected toward the optical axis and deflected again such that the charged particle beam travels toward the substrate in alignment with the optical axis.
41 Citations
18 Claims
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1. A method for exposing a pattern on an object by means of a focused charged particle beam, comprising the steps of:
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forming a charged particle beam in a beam source such that said charged particle beam travels toward said object along an optical axis; focusing said charged particle beam upon said object; shaping said charged particle beam in a region between said beam source and said object to form a shaped charged particle beam, said step of shaping comprising a step of deflecting said charged particle beam away from said optical axis by energizing deflection means that includes a plurality of deflectors, such that said charged particle beam passes one of a plurality of apertures provided on a beam shaping mask; deflecting back said shaped charged particle beam again upon said optical axis; radiating said shaped charged particle beam along said optical axis upon a shielding plate that is formed with a pinhole having a size generally corresponding to a diameter of said charged particle beam, said shielding plate being provided on said optical axis at a location between said beam shaping mask and said object; and selectively causing a turning off of said charged particle beam on said object by selectively deflecting said charged particle beam that has been radiated upon said shielding plate, away from said pinhole, said plurality of deflectors including first through fourth deflectors wherein said first and second deflectors are disposed at a side close to said beam source with respect to said beam shaping mask and such that said third and fourth deflectors are disposed at a side close to said object; said method further comprising the steps of; (a-1) energizing said first deflector forming said deflection means to cause a deflection of said charged particle beam to a plurality of calibration points that are located offset from said optical axis; and
energizing, in each of said calibration points, the remaining deflectors forming said deflection means;(a-2) detecting an intensity of said charged particle beam arriving at said object while energizing said remaining deflectors in said step (a-1), for each of said calibration points; and
obtaining optimized energization of said remaining deflectors by optimizing energization of said remaining deflectors such that the charged particle beam, deflected in said step (a-1) and arriving at said object after passing through said pinhole, has a maximum intensity;(a-3) obtaining a relativistic correction function that describes said optimized energization of said remaining deflectors obtained in said step (a-2) as a function of the energization of said first deflector; (a-4) energizing said first deflector to cause a deflection of said charged particle beam such that said charged particle beam passes a selected aperture on said beam shaping mask;
energizing said remaining deflectors according to said relativistic correction function, simultaneously to said first deflector that is deflecting said charged particle beam to said selected aperture; and
obtaining optimized energization of said first deflector such that said charged particle beam, arriving at said object after passing through said pinhole, has a maximum intensity;(a-5) obtaining an absolute correction function that describes said optimized energization of said first deflector obtained in said step (a-4), as a function of a position of said selected aperture on said beam shaping mask; and (b) deflecting said charged particle beam by energizing said first deflector according to said absolute correction function and said remaining deflectors according to said relativistic correction function, based upon energization of said first deflector, such that said electron beam hits said selected aperture on said beam shaping mask; said step (a-2) further comprising the steps of; (a-2-1) obtaining optimized energization of said second deflector with respect to energization of said first deflector by energizing said first and second deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity; and (a-2-2) obtaining optimized energization of said third deflector with respect to the energization of said fourth deflector by energizing said third and fourth deflectors simultaneously, such that said charged particle beam arriving at said object has a maximum intensity. - View Dependent Claims (2, 3, 4, 5)
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6. A method for exposing a pattern on an object by means of a focused charged particle beam, comprising the steps of:
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forming a charged particle beam in a beam source such that said charged particle beam travels toward said object along an optical axis; focusing said charged particle beam upon said object; shaping said charged particle beam in a region between said beam source and said object to form a shaped charged particle beam, said step of shaping comprising a step of deflecting said charged particle beam away from said optical axis by energizing deflection means that includes a plurality of deflectors, such that said charged particle beam passes one of a plurality of apertures provided on a beam shaping mask; deflecting back said shaped charged particle beam again upon said optical axis; radiating said shaped charged particle beam along said optical axis upon a shielding plate that is formed with a pinhole having a size generally corresponding to a diameter of said charged particle beam, said shielding plate being provided on said optical axis at a location between said beam shaping mask and said object; and selectively causing a turning off of said charged particle beam on said object by selectively deflecting said charged particle beam that has been radiated upon said shielding plate, away from said pinhole; said method further comprising the steps of; (a-1) energizing a first deflector forming said deflection means to cause a deflection of said charged particle beam to a plurality of calibration points that are located offset from said optical axis; and
energizing, in each of said calibration points, the remaining deflectors forming said deflection means;(a-2) detecting an intensity of said charged particle beam arriving at said object while energizing said remaining deflectors in said step (a-1), for each of said calibration points; and
obtaining optimized energization of said remaining deflectors by optimizing energization of said remaining deflectors such that the charged particle beam, deflected in said step (a-1) and arriving at said object after passing through said pinhole, becomes maximum;(a-3) obtaining a relativistic correction function that describes said optimized energization of said remaining deflectors obtained in said step (a-2) as a function of the energization of said first deflector; (a-4) energizing said first deflector to cause a deflection of said charged particle beam such that said charged particle beam passes a selected aperture on said beam shaping mask;
energizing said remaining deflectors according to said relativistic correction function, simultaneously to said first deflector that is deflecting said charged particle beam to said selected aperture; and
obtaining optimized energization of said first deflector such that said charged particle beam, arriving at said object after passing through said pinhole, has a maximum intensity;(a-5) obtaining an absolute correction function that describes said optimized energization of said first deflector obtained in said step (a-4), as a function of a position of said selected aperture on said beam shaping mask; (b-1) energizing said first deflector and simultaneously an astigmatic compensation coil provided along said optical axis at a side close to said beam source with respect to said shielding plate, said astigmatic compensation coil compensating for astigmatism upon energization; (b-2) obtaining optimized energization of said astigmatic compensation coil, by optimizing said energization of said astigmatic compensation coil such that said charged particle beam has a maximum intensity on said object, while simultaneously detecting said intensity of said charged particle beam on said object; (b-3) obtaining an astigmatic correction function describing said optimized energization of said astigmatic compensation coil as a function of the energization of said first deflector; (c-1) energizing said first deflector and simultaneously a focusing compensation coil provided along said optical axis at a side close to said beam source with respect to said shielding plate, said focusing compensation coil adjusting a focal point of said charged particle beam; (c-2) obtaining optimized energization of said focusing compensation coil, by optimizing said energization of said focusing compensation coil such that said charged particle beam has a maximum intensity on said object, while simultaneously detecting said intensity of said charged particle beam on said object; (c-3) obtaining a focusing correction function describing said optimized energization of said focusing compensation coil as a function of the energization of said first deflector; and (d) deflecting said charged particle beam to hit said selected aperture on said beam shaping mask by energizing said deflectors of the deflection means, said astigmatic compensation coil, and said focusing correction coil according to said absolute correction function, said relativistic correction function, said astigmatic correction function, and said focusing correction function respectively, based upon the energization of said first deflector such that said charged particle beam is shaped by said selected aperture. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A charged particle exposure system for exposing a pattern on an object, comprising:
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beam source means for producing a charged particle beam and emitting the same toward said object along an optical axis; focusing means provided on said optical axis for focusing said charged particle beam upon said object; a beam shaping mask provided on said optical axis between said object and said beam source means, said beam shaping mask carrying a plurality of apertures for shaping said charged particle beam; beam deflection/shaping means provided along said optical axis between said object and said beam source means for deflecting said charged particle beam away from said optical axis such that said charged particle beam passes a selected aperture on said beam shaping mask; a beam interruption plate provided on said optical axis between said object and said beam shaping mask for interrupting said charged particle beam, said beam interruption plate having a pinhole in correspondence to said optical axis for passing said charged particle beam; deflection means provided along said optical axis between said beam source means and beam interruption plate, for selectively causing an offset in said charged particle beam away from said optical axis upon energization, for causing a turning on and turning off of said charged particle beam on said object; astigmatic correction means provided along said optical axis between said beam interruption plate and said beam source means, for compensating for astigmatism of said charged particle beam when said charged particle beam is deflected away from said optical axis; and focusing correction means provided along said optical axis between said beam interruption plate and said beam source means, for adjusting a focal point of said charged particle beam such that said focal point coincides to said beam interruption means when said charged particle beam is deflected away from said optical axis; wherein said charged particle beam exposure system further comprises; pattern selection means supplied with exposure data corresponding to a pattern to be exposed on said object, for producing a positional selection signal that specifies the position of said selected aperture on said beam shaping mask; deflection signal outputting means supplied with said positional selection signal from said pattern selection means for producing a first driving signal for energizing said deflection/shaping means; astigmatic correction signal outputting means supplied with said first driving signal from said deflection signal outputting means for producing a second driving signal for energizing said astigmatic correction means; and focusing correction signal outputting means supplied with said first driving signal from said deflection signal outputting means for producing a third driving signal for energizing said focusing correction means; wherein said deflection signal outputting means storing therein a first function for converting said positional selection signal to said first driving signal for driving said deflection/shaping means; said astigmatic correction signal outputting means storing therein a second function for converting said positional selection signal to said second driving signal; and said focusing correction signal outputting means storing therein a third function for converting said positional selection signal to said third driving signal.
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Specification