Detection of electron-beam scanning of a substrate

• US 5,391,909 A
• Filed: 10/13/1992
• Issued: 02/21/1995
• Est. Priority Date: 10/13/1992
• Status: Expired due to Term

• Current Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: Cottine, Richard B., Ozdemir, Faik S.
• Primary Examiner(s): Crane, Sara W.
• Application Number:
  US07/959,833
• Time in Patent Office: 861 Days
• Field of Search: 257/429, 257/917, 257/431, 257/443, 257/444, 257/447, 257/458, 365/118
• US Class Current: 257/429
• CPC Class Codes: G01R 31/307 of integrated circuits
• CPC Class Codes: Y10S 257/917 Plural dopants of same conductivity type in same region

Abstract

The scanning of an operating integrated circuit (IC) substrate by an electron (e)-beam is detected by providing conductive plates in the substrate, and triggering a charge-sensitive mechanism such as a field effect transistor (FET) when an e-beam has scanned over the plate. The plates can be fabricated at different levels within the substrate, with a lower plate preferably shaded from the e-beam by an upper plate and providing a reference for the upper plate. E-beam detection occurs either through the positive or negative charging of capacitances associated with the FETs, or from instantaneous negative or positive current flows from the detector plates; a latch is actuated to hold an instantaneously detected current level exceeding a predetermined threshold. The logic state of this latch can be used to modify the functional operation of the IC in real time.

Claims

1. An electrical circuit package, comprising:

a substrate with an integrated circuit (IC) thereon,

e-beam scan detecting means comprising at least one conductive member carried by the surface of said substrate for detecting the scanning of the substrate by an electron (e)-beam, said conductive member having a surface for receiving a scanning e-beam, at least one said conductive member being disposed below the surface of said substrate, and

means responsive to the detection of e-beam scanning for indicating that e-beam scanning has occurred.

2. The electrical circuit package of claim 1, said substrate including an upper passivation layer, at least some of said conductive members being disposed below said passivation layer.

3. The electrical circuit package of claim 2, wherein a plurality of said conductive members are disposed at different depths below said passivation layer.

4. An electrical circuit package, comprising:

a substrate with an integrated Circuit (IC) thereon,

a mutually spaced plurality of e-beam scan detector means carried by said substrate for detecting the scanning of the substrate by an electron (e)-beam, and

means responsive to the detection of e-beam scanning for indicating that e-beam scanning has occurred, wherein said means for producing an output is responsive to differences between the e-beam impacts detected by different scan detector means for producing said output, wherein said different detector means are located at different depths within said substrate.

5. The electrical circuit package of claim 4, wherein at least one of said different detector means is shaded from e-beam impacts by at least one other of said different detector means.

6. An electrical circuit package for detecting the scanning of a substrate by an electron (e)-beam, comprising:

a plurality of mutually spaced conductive plates carried by said substrate,

means for detecting charge applied to one or more of said plates from the scanning of said substrate by an e-beam in the vicinity of said plates, and

means responsive to said detected charge exceeding a threshold level for producing an indication that e-beam scanning has occurred,

said e-beam scan indicating means including a plurality of field effect transistors (FETs) having their source-drain circuits connected to initiate said indication, the gates of said FETs providing said charge detecting means by being connected to receive charge from respective plates in response to an e-beam being scanned over said plates, said e-beam scan indicating means including n-channel/p-channel FET pairs for respective pairs of plates, the gates of said FET pairs being connected together to receive charge from their respective plates, said FET pairs initiating an e-beam scan indication in response to the charge applied to their gates exceeding either a negative threshold associated with said p-channel FET or a positive threshold associated with said n-channel FET.

7. An electrical circuit package for detecting the scanning of a substrate by an electron (e)-beam, comprising:

a plurality of mutually spaced conductive plates carried by said substrate,

means for detecting charge applied to one or more of said plates from the scanning of said substrate by an e-beam in the vicinity of said plates, and

means responsive to said detected charge exceeding a threshold level for producing an indication by an e-beam scanning has occurred,

wherein different plates are located at different depths within said substrate, and differential amplifier means are provided for respective pairs of plates at different depths to provide an e-beam scanning indication in response to the charges acquired by their respective plates differing by more than a threshold differential amount.

8. The electrical circuit package of claim 7, wherein one plate of a pair of plates is positioned to shade the other plate of said pair from said e-beam scanning.