Production of silica "green" tape and co-fired silica substrates therefrom

• US 5,393,604 A
• Filed: 01/28/1988
• Issued: 02/28/1995
• Est. Priority Date: 01/28/1988
• Status: Expired due to Fees

• Current Assignee: California State University
• Original Assignee: Mcdonnell Douglas Corporation (The Boeing Co.)
• Inventors: Sanchez, Lloyd E.
• Primary Examiner(s): DERRINGTON, JAMES H
• Application Number:
  US07/149,357
• Time in Patent Office: 2,588 Days
• Field of Search: 264/63, 264/61, 264/166, 156/89, 428/325, 428/22 D, 428/430, 428/901, 428/446, 428/451, 428/452, 428/704, 428/336
• US Class Current: 428/325
• CPC Class Codes: C04B 35/14 based on silica
• CPC Class Codes: C04B 35/62218 obtaining ceramic films, e.g. by using temporary supports
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 3/4676 Single layer compositions
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/252 Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/31667 Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product

Abstract

Production of silica "green" tapes employed in fabrication of multilayer circuit boards, by mixing silica powder comprised of spherical substantially uniform particles ranging in size from 0.1 to 2 microns, e.g., 0.7 micron, with a liquid medium containing a vinyl acetate--acrylic copolymer emulsion as binder, polyethylene glycol as plasticizer and dispersant, and preferably also including a small amount of boron, in the form of boric acid or boric oxide. The resulting slip is cast on a substrate, such as a polyester tape and dried to produce a crack-free tape. The resulting silica " green" tape is cut into individual tapes, a predetermined circuit pattern is screened onto each tape, preferably employing gold or copper conductors, and the polyester backing is removed from the tapes. The screened silica "green" tapes are then collated and registered to form a stack of layers, and the layers are laminated under pressure and at elevated temperature into a monolithic unit. Such monolithic unit is then fired at a temperature of the order of about 1050° C. into a multilayer circuit board formed of silica having a low dielectric constant and capable of operating efficiently at high frequencies.

Claims

1. A process for preparing a silica tape which comprises:

providing an essentially amorphous silica powder in the form of substantially spherical particles having a diameter ranging from about 0.1 to about 2 microns,

mixing said silica powder with an aqueous medium containing an organosol, to form a slurry of said silica particles,

casting said slurry on a support, and

drying said slurry to form a silica tape on said support.

22. A process for producing a multilayer circuit board which comprises:

providing a silica tape by the process of claim 1,

cutting said silica tape on said support into a plurality of tapes on said support,

punching via and alignment holes into each of said plurality of tapes on said support,

screening a predetermined pattern of circuit metalization on each of said plurality of tapes, and filling said via holes with said metalization,

removing said plurality of tapes from their respective supports,

forming a plurality of said tapes into a registered stack of layers,

laminating the registered stack of silica tape layers, and

co-firing the laminated stack of layers of silica and circuit metalization to form a monolithic multilayer circuit board having a low dielectric constant and exhibiting substantially the same dimensional changes in X and Y directions after co-firing.

2. A process for preparing a silica tape which comprises:

providing a silica powder in the form of substantially spherical particles having a diameter ranging from about 0.1 to about 2 microns, said silica powder obtained by reaction of an alkyl silicate in aqueous alcoholic solution in the presence of ammonium hydroxide,

mixing said silica powder with an aqueous medium containing an organosol, to form a slurry of said silica particles,

casting said slurry on a support, and

drying said slurry to form a silica tape on said support.

3. The process of claim 2, said powder being produced by reacting a tetraalkyl orthosilicate in aqueous alcoholic solution at temperature ranging from about 15°

C. to about 50°

C. in the presence of ammonium hydroxide.

4. The process of claim 2, wherein said silica powder is essentially amorphous and said spherical silica particles are of substantially uniform size.

5. The process of claim 2, said organosol comprising a vinyl acetate-acrylic copolymer emulsion as binder.

6. The process of claim 5, said aqueous medium also containing polyethylene glycol as plasticizer, said polyethylene glycol having a molecular weight not in excess of about 10,000.

7. The process of claim 2, including adding a small amount of boron to said silica powder or to said aqueous medium, in the form of a boron-containing material selected from the group consisting of boric acid and boric oxide.

8. The process of claim 7, said boron-containing material being present in an amount providing about 1 to about 3% boron, by weight, based on the total weight of the silica powder and boron.

9. The process of claim 8, said organosol comprising a vinyl acetate-acrylic copolymer emulsion as binder, said aqueous medium also containing polyethylene glycol as plasticizer, said polyethylene glycol having a molecular weight ranging from about 4,000 to about 6,000.

10. The process of claim 2, said support for said cast slurry being a polyester or cellulose acetate substrate.

11. The process of claim 2, said casting being carried out employing a doctor blade, and said drying taking place at elevated temperature not exceeding about 60°

C.

12. The process of claim 2, including removing said tape from said support, said silica tape being flexible and free of cracking and having a dielectric constant of about 4 and a thickness ranging from about 0.002" to about 0.050".

16. A process for producing silica substrates which comprises:

producing a silica tape by the process of claim 2,

removing said tape from said support,

forming a plurality of said tapes into layers of a stack,

laminating the stack of silica tape layers, and

firing said laminated stack at elevated temperature to obtain a monolithic silica substrate having a low dielectric constant.

17. A process for producing silica substrates which comprises:

producing a silica tape by the process of claim 7,

removing said tape from said support,

forming a plurality of said tapes into layers of a stack,

laminating the stack of silica tape layers, and

firing said laminated stack at about 1050°

C. to obtain a monolithic silica substrate having a low dielectric constant.

20. A process for producing a multilayer circuit board which comprises:

producing a silica substrate by the process of claim 16, and including the step of printing circuit metalization on each of said plurality of tapes prior to forming said plurality of tapes into a stack of layers, said firing of said laminated stack forming a monolithic multilayer circuit board on a silica substrate.

21. A process for producing a multilayer circuit board which comprises:

producing a silica substrate by the process of claim 17, and including the step of printing circuit metalization on each of said plurality of tapes prior to forming said plurality of tapes into a stack of layers, said firing of said laminated stack forming a monolithic multilayer circuit board on a silica substrate.

23. A process for producing a multilayer circuit board which comprises:

providing a silica tape by the process of claim 8,

cutting said silica tape on said support into a plurality of tapes on said support,

punching via and alignment holes into each of said plurality of tapes on said support,

screening a predetermined pattern of gold or copper circuit metalization on each of said plurality of tapes, and filling said via holes with said metalization,

removing said plurality of tapes from their respective supports,

forming a plurality of said tapes into a registered stack of layers,

laminating the registered stack of silica tape layers, and

co-firing at about 1050°

C. the laminated stack of layers of silica and circuit metalization to form a monolithic multilayer circuit board having a low dielectric constant and exhibiting substantially the same dimensional changes in X and Y directions after co-firing.

26. A silica tape produced by the process of claim 7, said tape having a low dielectric constant of about 4.

13. A process for preparing a silica tape which comprises:

providing an amorphous silica powder of substantially uniform size spherical particles having a diameter ranging from about 0.1 to about 2 microns, said silica powder obtained by reaction of a tetraalkyl orthosilicate in aqueous alcoholic solution in the presence of ammonium hydroxide,

mixing said silica powder with an aqueous medium containing an organosol comprising a vinyl acetate-acrylic copolymer emulsion as binder, the molecular weight of said copolymer ranging from about 2,000 to about 10,000, the amount of said binder employed ranging from about 15 to about 35%, by weight of said silica powder, said aqueous medium also containing polyethylene glycol as plasticizer, said polyethylene glycol having a molecular weight ranging from about 4,000 to about 6,000, the amount of said polyethylene glycol employed ranging from about 1% to about 5%, by weight of said binder, to form a slurry of said silica particles in said aqueous medium,

casting said slurry on a polyester film, employing a doctor blade, and

drying said slurry at elevated temperature not exceeding about 60°

C., to form a silica tape on said polyester film.

14. The process of claim 13, including adding a small amount of boron to said silica powder or to said aqueous medium, in the form of a boron-containing material selected from the group consisting of boric acid and boric oxide, said boron-containing material being present in an amount providing about 1 to about 3% boron, by weight, based on the total weight of the silica powder and boron, said silica tape being flexible and free of cracking and having a dielectric constant of about 4 and a thickness ranging .from about 0.002" to about 0.050", and including removing said tape from said polyester film.

15. The process of claim 13, said silica powder being produced by reacting tetraethyl orthosilicate with aqueous ammonium hydroxide at temperature ranging from about 15°

C. to about 50°

0 C., and precipitating said spherical particles of silica.

18. A process for producing silica substrates which comprises:

producing a silica tape by the process of claim 13,

removing said tape from said polyester film,

forming a plurality of said tapes into layers of a stack,

laminating the stack of silica tape layers, and

firing said laminated stack at elevated temperature to obtain a monolithic silica substrate having a low dielectric constant.

19. A process for producing silica substrates which comprises:

producing a silica tape by the process of claim 14,

removing said tape from said polyester film,

forming a plurality of said tapes into layers of a stack,

laminating the stack of silica tape layers, and

firing said laminated stack at about 1050°

C. to obtain a monolithic silica substrate having a low dielectric constant.

24. A process for producing a multilayer circuit board which comprises:

providing a silica tape by the process of claim 13,

cutting said silica tape on said polyester film into a plurality of tapes on said polyester film,

punching via and alignment holes into each of said plurality of tapes on said polyester film,

screening a predetermined pattern of circuit metalization on each of said plurality of tapes, and filling said via holes with said metalization,

removing said plurality of tapes from their respective polyester films,

forming a plurality of said tapes into a registered stack of layers,

laminating the registered stack of silica tape layers, and

co-firing the laminated stack of layers of silica and circuit metalization to form a monolithic multilayer circuit board having a low dielectric constant and exhibiting substantially the same dimensional changes in X and Y directions after co-firing.

27. A silica tape produced by the process of claim 14, said tape having a low dielectric constant of about 4.

25. A process for producing a multilayer circuit board which comprises:

14,

cutting said silica tape on said polyester film into a plurality of tapes on said polyester film,

punching via and alignment holes into each of said plurality of tapes on said polyester film,

screening a predetermined pattern of gold or copper circuit metalization on each of said plurality of tapes, and filling said via holes with said metallization,

removing said plurality of tapes from their respective polyester films,

forming a plurality of said tapes into a registered stack of layers,

laminating the registered stack of silica tape layers, and

co-firing at about 1050°

C. the laminated stack of layers of silica and circuit metalization to form a monolithic multilayer circuit board having a low dielectric constant and exhibiting substantially the same dimensional changes in X and Y directions after co-firing.