Self-aligned trenched contact (satc) process
First Claim
1. The method of forming a self-aligned trenched contact in the fabrication of an integrated circuit comprising:
- forming semiconductor device regions in and on a semiconductor substrate wherein said semiconductor device regions include gate electrodes on the surface of said semiconductor substrate and source/drain regions within said semiconductor substrate;
forming spacers on the sidewalls of said gate electrodes;
depositing a layer of silicon oxide over the surface of said substrate wherein said silicon oxide layer contacts said source/drain regions within said substrate between said gate electrodes;
covering said substrate with a layer of photoresist and patterning said photoresist to provide an opening between said gate electrodes;
etching away said silicon oxide using said patterned photoresist and said sidewall spacers as a mask to provide an opening to said semiconductor substrate where said self-aligned trenched contact will be formed;
etching a trench into said semiconductor substrate within said opening using said sidewall spacers as a mask to form said self-aligned trenched opening wherein the depth of said trench within said semiconductor substrate is greater than about 0.25 microns and preferably greater than 0.5 microns; and
depositing a conducting layer within said trenched opening to complete said contact in the manufacture of said integrated circuit device.
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Abstract
A method of forming a self-aligned trenched contact in the fabrication of an integrated circuit is described. Semiconductor device regions are formed in and on a semiconductor substrate wherein the semiconductor device regions include gate electrodes on the surface of the semiconductor substrate and source/drain regions within the semiconductor substrate. Spacers are formed on the sidewalls of the gate electrodes. A layer of silicon oxide is deposited over the surface of the substrate wherein the silicon oxide contacts the source/drain regions within the substrate between the gate electrodes. The substrate is covered with a layer of photoresist which is patterned to provide an opening over the planned self-aligned trenched contact between the gate electrodes. The silicon oxide is etched away to provide an opening to the silicon substrate using the patterned photoresist and the sidewall spacers as a mask. A trench is etched into the silicon substrate within the opening using the photoresist and the sidewall spacers as a mask to form the self-aligned trenched contact opening. A conducting layer is deposited within the trenched opening to complete the contact in the manufacture of the integrated circuit device.
94 Citations
23 Claims
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1. The method of forming a self-aligned trenched contact in the fabrication of an integrated circuit comprising:
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forming semiconductor device regions in and on a semiconductor substrate wherein said semiconductor device regions include gate electrodes on the surface of said semiconductor substrate and source/drain regions within said semiconductor substrate; forming spacers on the sidewalls of said gate electrodes; depositing a layer of silicon oxide over the surface of said substrate wherein said silicon oxide layer contacts said source/drain regions within said substrate between said gate electrodes; covering said substrate with a layer of photoresist and patterning said photoresist to provide an opening between said gate electrodes; etching away said silicon oxide using said patterned photoresist and said sidewall spacers as a mask to provide an opening to said semiconductor substrate where said self-aligned trenched contact will be formed; etching a trench into said semiconductor substrate within said opening using said sidewall spacers as a mask to form said self-aligned trenched opening wherein the depth of said trench within said semiconductor substrate is greater than about 0.25 microns and preferably greater than 0.5 microns; and depositing a conducting layer within said trenched opening to complete said contact in the manufacture of said integrated circuit device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. The method of forming a self-aligned trenched contact in the fabrication of an integrated circuit comprising:
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forming semiconductor device regions in and on a semiconductor substrate wherein said semiconductor device regions include gate electrodes on the surface of said semiconductor substrate and source/drain regions within said semiconductor substrate; forming spacers on the sidewalls of said gate electrodes; depositing a layer of silicon oxide over the surface of said substrate wherein said silicon oxide layer contacts said source/drain regions within said substrate between said gate electrodes; covering said substrate with a layer of photoresist and patterning said photoresist to provide an opening between said gate electrodes; etching away said silicon oxide using said patterned photoresist and said sidewall spacers as a mask to provide an opening to said semiconductor substrate where said self-aligned trenched contact will be formed; etching a trench into said semiconductor substrate within said opening using said sidewall spacers as a mask to form said self-aligned trenched opening wherein the depth of said trench within said semiconductor substrate is greater than about 0.25 microns and preferably greater than 0.5 microns; and depositing a layer of polysilicon over the surface of said substrate and within said trenched opening wherein said polysilicon layer is ion implanted and wherein outdiffusion forms an N+ contact diffusion region surrounding said trench within said semiconductor substrate to complete said contact in the manufacture of said integrated circuit device. - View Dependent Claims (15, 16, 17)
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18. The method of forming a self-aligned trenched contact in the fabrication of an integrated circuit comprising:
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forming semiconductor device regions in and on a semiconductor substrate wherein said semiconductor device regions include gate electrodes on the surface of said semiconductor substrate and source/drain regions within said semiconductor substrate; forming spacers on the sidewalls of said gate electrodes; depositing a layer of silicon oxide over the surface of said substrate wherein said silicon oxide layer contacts said source/drain regions within said substrate between said gate electrodes; covering said substrate with a layer of photoresist and patterning said photoresist to provide an opening between said gate electrodes; etching away said silicon oxide using said patterned photoresist and said sidewall spacers as a mask to provide an opening to said semiconductor substrate where said self-aligned trenched contact will be formed; etching a trench into said semiconductor substrate within said opening using said sidewall spacers as a mask to form said self-aligned trenched opening wherein the depth of said trench within said semiconductor substrate is greater than about 0.25 microns and preferably greater than 0.5 microns; implanting ions into said trench and heating said substrate to drive said ions into the region within said substrate surrounding said trench; and depositing a metal layer over the surface of said substrate and within said trench to complete said contact in the manufacture of said integrated circuit device. - View Dependent Claims (19, 20, 21, 22, 23)
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Specification