Busbar conductor

• US 5,393,934 A
• Filed: 02/28/1994
• Issued: 02/28/1995
• Est. Priority Date: 02/28/1991
• Status: Expired due to Term

• Current Assignee: Yazaki Corporation
• Original Assignee: Yazaki Corporation
• Inventors: Suguro, Masahiro, Mori, Akio, Nakayama, Makota, Sato, Akiyoshi
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Figlin, Cheryl R.
• Application Number:
  US08/203,515
• Time in Patent Office: 365 Days
• Field of Search: 174/11 B, 174/99 B, 174/256, 174/257, 174/261, 361/748, 361/784
• US Class Current: 174/257
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/0391 Using different types of conductors
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 3/4676 Single layer compositions
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies

Abstract

In making busbar conductors, this invention saves the material of busbars that form the circuits on the boards to lower the cost, and improves the workability of the busbars to be punched. In busbar conductors each having a plurality of busbars of desired patterns arranged on an insulating substrate, the busbars are punched out selectively from two or more conductive materials with different conductivities.

Claims

1. A busbar conductor board comprising:

an insulating substrate;

a plurality of electrically separated busbars carried by the substrate, each busbar comprising a metallic strip of a respective material of a given conductivity; and

the material of at least one of the busbars having a conductivity different from the material of the other busbars.

2. The board as defined in claim 1 wherein each busbar is dimensioned in cross section according to the required current capacity and the conductivity of its respective material, whereby for a given current capacity higher conductivity materials afford smaller busbar cross sections than lower conductivity materials.

3. A stacked busbar conductor board assembly comprising a plurality of separate busbar conductor boards arranged in a stack, each busbar conductor board comprising:

an insulating substrate;

a plurality of electrically separated busbars carried by the substrate, each busbar comprising a conductive metallic strip, the metallic strips on a given substrate comprising the same material and the same conductivity; and

the busbars on at least one of the substrates having a different conductivity than on another substrate in the stack.

4. The assembly as defined in claim 3 wherein the busbars on each substrate comprise a material having a different conductivity than on each other substrate in the stack.

5. The assembly as defined in claim 3 wherein each busbar is dimensioned in cross section according to the required current capacity and the conductivity of its respective material, whereby for a given current capacity higher conductivity materials afford smaller busbar cross sections than lower conductivity materials.

6. A method of designing and manufacturing busbar conductor structures of the type having at least two busbar conductors having planar conductive body portions and end terminal portions, the body portions being of said at least two conductors being commonly disposed on the surface of a substrate having an area A, said method comprising the steps of:

A) determining the current load to be carried by each of said conductors;

B) determining the minimum conductor body portion width which is capable of carrying said current load using each of at least first and second alternative conductive materials of different conductivities and costs; and

thereafter,

C) applying to said substrate at least two spaced apart busbar conductors of a material and width which is chosen to minimize the busbar material cost while not exceeding the available area A of the substrate to be occupied by said busbar conductors.