Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby
First Claim
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1. A method of forming a sputter target assembly comprising the steps of:
- (a) providing a backing plate;
(b) providing a powder composition;
(c) simultaneously pressure consolidating said powder composition to form a target portion and forming a bond between said backing plate and said target portion, said step (c) being performed in a hot isostatic press process wherein said backing plate and said powder composition are contained within a can subjected to a predetermined pressure and temperature to form a can assembly, said method further including the steps of heating said can assembly to a temperature no greater than said predetermined temperature and .pressing said can assembly in a platen press subsequent to step (c).
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Abstract
A method of producing a sputter target assembly including a tungsten-titanium target attached to a titanium backing plate. The method includes consolidating a tungsten-titanium powder composition to form a target while simultaneously bonding the powder composition to the titanium backing plate to form an interdiffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high temperature operating capability.
75 Citations
10 Claims
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1. A method of forming a sputter target assembly comprising the steps of:
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(a) providing a backing plate; (b) providing a powder composition; (c) simultaneously pressure consolidating said powder composition to form a target portion and forming a bond between said backing plate and said target portion, said step (c) being performed in a hot isostatic press process wherein said backing plate and said powder composition are contained within a can subjected to a predetermined pressure and temperature to form a can assembly, said method further including the steps of heating said can assembly to a temperature no greater than said predetermined temperature and .pressing said can assembly in a platen press subsequent to step (c). - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a tungsten-titanium sputter target assembly comprising the steps of:
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(a) placing a titanium plate within a can; (b) placing powders of titanium and tungsten on said plate; and (c) subjecting said can to a predetermined pressure and temperature whereby said powders of titanium and tungsten are compacted to form a target portion and are bonded to said plate, said step (c) being performed in a hot isostatic press process, evacuating said can prior to said step (c), and pressing said titanium and tungsten powders prior to said step (c) in a ram-type press until said powders are at least 50 percent dense. - View Dependent Claims (9, 10)
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Specification