PCMCIA standard memory card frame

• US 5,397,857 A
• Filed: 07/15/1993
• Issued: 03/14/1995
• Est. Priority Date: 07/15/1993
• Status: Expired due to Term

• Current Assignee: Methode Electronics Incorporated
• Original Assignee: DUAL Drive Systems Incorporated
• Inventors: Centofante, Charlie, Weibezahn, Brandt, Fajardo, Iggoni, Dorf, Ken, Farquhar, Jim
• Primary Examiner(s): Ball, Michael W.
• Assistant Examiner(s): CRISPINO, RICHARD D
• Application Number:
  US08/092,012
• Time in Patent Office: 607 Days
• Field of Search: 361/684, 361/737, 361/748, 361/753, 361/752, 361/757, 174/52.4, 174/52.5, 174/52.1, 428/76, 428/192, 428/542.8, 156/73.1, 264/248, 264/272.17
• US Class Current: 174/520
• CPC Class Codes: B29C 45/14336 Coating a portion of the article, e.g. the edge of the article B29C45/14573 and B29C45/14598 take precedence
• CPC Class Codes: B29C 65/08 using ultrasonic vibrations non-plastics element to plastics elements B29C65/645
• CPC Class Codes: B29C 66/1122 Single lap to lap joints, i.e. overlap joints B29C66/45, B29C66/472, B29C66/52272 take precedence
• CPC Class Codes: B29C 66/30223 said melt initiators being rib-like
• CPC Class Codes: B29C 66/54 Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: H05K 5/0269 Card housings therefor, e.g. covers, frames, PCB
• CPC Class Codes: Y10T 156/1002 with permanent bending or reshaping or surface deformation of self sustaining lamina

Abstract

A container for a memory card and the process by which the container is manufactured. The container comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The frame has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

Claims

1. A peripheral device PCB package comprising:

two stamped metal covers with a plastic frame element corresponding to each cover;

each cover having a first side and a second side with a plurality of fingers extending from said sides and wherein edges of the metal covers are bent to conform to the shape of the frame and said fingers are embedded in the plastic frame elements forming an integral unit, the plastic frame elements being injected molded around the fingers;

and wherein the plastic frame element extends beyond the plane of the metal cover so that a plastic perimeter surface is exposed, thereby facilitating bonding of the two covers.

2. The package as claimed in claim 1 wherein:

ejector pins on the plastic frames are provided to position a PCB.

3. The package as claimed in claim 1 wherein:

the plastic frame elements include a polarizing key.

4. The package as claimed in claim 1 wherein:

the plastic frame elements include energy directors.

5. The package as claimed in claim 1 wherein:

a grounding point is established by metal-to-metal contact of the covers.

6. The package as claimed in claim 1 wherein:

the interiors of the covers are coated with a thin layer of non-conductive material.