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Semiconductor package capable of spreading heat

  • US 5,397,917 A
  • Filed: 04/26/1993
  • Issued: 03/14/1995
  • Est. Priority Date: 04/26/1993
  • Status: Expired due to Term
First Claim
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1. A semiconductor package capable of spreading heat, comprising:

  • a heat spreader having a first surface, a second surface, and a plurality of clearance holes extending therethrough, each clearance hole having a diameter;

    an adhesive material coating the first and second surfaces;

    a substrate layer, the substrate layer covering the adhesive material;

    a top-side conductive trace, the tope-side conductive trace over the first surface;

    a bottom-side conductive trace, the bottom-side conductive trace over the second surface;

    a plurality of signal vias, each of the plurality of signal vias within a corresponding clearance hole and spaced apart from edges of the corresponding clearance hole by the adhesive material;

    a conductive pad, the conductive pad over the second surface and electrically coupled to the top-side conductive trace via the bottom-side conductive trace and at least one of the plurality of signal vias;

    a cavity for receiving a semiconductor die, the cavity exposing the first surface of the heat spreader; and

    a material for covering the cavity for receiving the semiconductor die.

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