Method and apparatus for performing wafer level testing of integrated circuit dice
First Claim
1. A method for providing a semiconductor substrate comprising at least one tested integrated circuit data processor, the method comprising the steps of:
- providing the semiconductor substrate having at least one integrated circuit data processor formed thereon, the at least one integrated circuit data processor having a top surface;
forming a first conductor overlying the top surface of the at least one integrated circuit data processor, such that the first conductor is electrically coupled to the at least one integrated circuit data processor;
supplying a clock signal to the integrated circuit data processor by way of the first conductor;
performing a functional test of the at least one integrated circuit data processor by executing a plurality of data processor instructions;
using the clock signal in carrying out execution of the plurality of data processor instructions; and
removing at least a portion of the first conductor from the top surface of the at least one integrated circuit data processor.
15 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).
209 Citations
33 Claims
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1. A method for providing a semiconductor substrate comprising at least one tested integrated circuit data processor, the method comprising the steps of:
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providing the semiconductor substrate having at least one integrated circuit data processor formed thereon, the at least one integrated circuit data processor having a top surface; forming a first conductor overlying the top surface of the at least one integrated circuit data processor, such that the first conductor is electrically coupled to the at least one integrated circuit data processor; supplying a clock signal to the integrated circuit data processor by way of the first conductor; performing a functional test of the at least one integrated circuit data processor by executing a plurality of data processor instructions; using the clock signal in carrying out execution of the plurality of data processor instructions; and removing at least a portion of the first conductor from the top surface of the at least one integrated circuit data processor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of fabricating and testing a plurality of integrated circuits comprising the steps of:
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fabricating a plurality of integrated circuits on a first major surface of a semiconductor wafer, each of the integrated circuits having a plurality of connection points suited for making electrical contacts to each of the integrated circuits, the first major surface of the semiconductor wafer also including dicing lanes separating individual ones of the plurality of integrated circuits and a peripheral region adjacent to an edge of the semiconductor wafer; forming a layer of insulating material overlying the first major surface of the semiconductor wafer; patterning the layer of insulating material to open contact vias overlying a portion of the plurality of connection points on each of the plurality of integrated circuits; forming a plurality of conductors on a surface of the layer of insulating material, each of the plurality of conductors extends into at least one of the contact vias overlying each of the plurality of integrated circuits, each of the plurality of conductors extends into the peripheral region of the semiconductor wafer and a portion of at least one of the plurality of conductors overlies at least one of the plurality of integrated circuits; establishing electrical contact in the peripheral region of the semiconductor wafer between each of the plurality of conductors and an integrated circuit tester apparatus; operating the integrated circuit tester apparatus to test each of the plurality of integrated circuits using the plurality of conductors; producing a test result in response to said step of operating the integrated circuit tester apparatus; differentiating each of the plurality of integrated circuits such that each of the plurality of integrated circuits can be uniquely identified; and transferring the test result from each of the plurality of integrated circuits to the integrated circuit tester apparatus.
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22. A method for providing a semiconductor substrate comprising a plurality of tested integrated circuits, the method comprising the steps of:
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providing the semiconductor substrate having integrated circuits formed thereon, a total number of the integrated circuits being N integrated circuits, the N integrated circuits being separated by a first set of parallel dicing lanes and a second set of parallel dicing lanes, where the first set of parallel dicing lanes are perpedicular to the second set of parallel dicing lanes; forming a first wafer conductor overlying the semiconductor substrate, the first wafer conductor being electrically coupled to the N integrated circuits, the first wafer conductor having a first set of conductor portions which are parallel to the first set of parallel dicing lanes, the first wafer conductor having a second set of conductor portions which are parallel to the second set of parallel dicing lanes; and performing a functional test of the N integrated circuits using the first wafer conductor; and wherein the first set of conductor portions of the first wafer conductor overlies a first area of the semiconductor substrate such that more than half of the first area of the semiconductor substrate has integrated circuits formed thereon. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A method for providing a semiconductor substrate comprising a plurality of tested integrated circuits, the method comprising the steps of:
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providing the semiconductor substrate having a plurality of integrated circuits formed thereon, the plurality of integrated circuits being arranged in a plurality of rows and a plurality of columns, each of the plurality of integrated circuits having a length and a width, the plurality of integrated circuits being separated by a first set of parallel dicing lanes and a second set of parallel dicing lanes, where the first set of parallel dicing lanes are perpedicular to the second set of parallel dicing lanes; forming a first wafer conductor overlying the semiconductor substrate, the first wafer conductor being electrically coupled to the plurality of integrated circuits, the first wafer conductor having a first set of conductor portions which are parallel to the first set of parallel dicing lanes, the first wafer conductor having a second set of conductor portions which are parallel to the second set of parallel dicing lanes, a one of the first set of conductor portions overlying one of the length and width of one of the plurality of integrated circuits; and performing a functional test of the plurality of integrated circuits using the first wafer conductor. - View Dependent Claims (33)
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Specification