Single semiconductor wafer transfer method and plural processing station manufacturing system

• US 5,399,531 A
• Filed: 12/17/1990
• Issued: 03/21/1995
• Est. Priority Date: 12/17/1990
• Status: Expired due to Term

• Current Assignee: United Microelectronics Corporation
• Original Assignee: United Microelectronics Corporation
• Inventors: Wu, H. J.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/628,437
• Time in Patent Office: 1,555 Days
• Field of Search: 414/231, 414/232, 414/234, 414/235, 414/242, 414/243, 414/253, 414/262, 414/783, 414/936, 414/938, 414/937, 414/939, 414/940, 437/925, 437/205, 29/25.01
• US Class Current: 700/112
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/67724 by means of a cart or a vehicule
• CPC Class Codes: H01L 21/67727 using a general scheme of a conveying path within a factory
• CPC Class Codes: H01L 21/67736 Loading to or unloading from a conveyor
• CPC Class Codes: Y10S 414/136 including wafer orienting means
• CPC Class Codes: Y10S 414/137 including means for charging or discharging wafer cassette
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

A manufacturing system and method for processing semiconductor wafers through a plurality of processing stations that perform manufacturing operations on wafers includes a plurality of processing stations, each of which are capable of performing at least one processing operation on a wafer, each of the processing stations having a controlled environment for processing the wafers, and a branched tunnel joined and communicating with the controlled environment. A means is provided for maintaining a clean environment in the tunnel. Within the tunnel there are provided a plurality of guided transport vehicles adapted to travel between the process stations. A plurality of wafer carriers, each adapted to support a single wafer and be carried by the transport vehicles, are part of the system.

Claims

1. A manufacturing system for handling and individually processing semiconductor wafers through a plurality of processing stations that perform operations on the wafers in accordance with a wafer process sequence comprising:

a plurality of processing stations, each having a region of a controlled environment, each of said stations being capable of performing at least one processing operation in said region of controlled environment on each of said semiconductor wafers;

a branched tunnel having a top and a bottom connected to each of said regions of said controlled environment of said processing stations;

a means for maintaining a clean air environment in said branched tunnel;

a plurality of wafer carriers each adapted to support a single wafer;

a plurality of guided transport vehicles adapted to operate independently in said branched tunnel and move to any of said processing stations associated with said branched tunnel;

said transport vehicles adapted to convey at least a single wafer carrier between any of said processing stations;

each of said processing stations being provided with (1) a transport vehicle buffer having an unload zone and a load zone, (2) a wafer carrier buffer, (3) a wafer carrier handling means adapted to transfer wafer carriers between a transport vehicle at said transport vehicle buffer and said wafer carrier buffer, and (4) a wafer handling means to move wafers between the wafer carriers in said wafer carrier buffer and a wafer processing apparatus at said processing station;

a memory storage means on each of said wafer carriers capable of holding the desired wafer process sequence for the wafer associated with the said wafer carrier;

a means for directing said guided transport vehicles to move wafer carriers sequentially to each processing station in accordance with the wafer process sequence stored in each of said memory storage means on said wafer carriers; and

a vehicle station having a wafer carrier loading area where wafers are introduced into the system and a wafer carrier unload area where processed wafers are removed from the system.

2. The manufacturing system of claim 1 wherein said means for maintaining a clean air environment in the said tunnel includes a means to direct clean filtered air to the top of the tunnel and a means to withdraw air from the bottom of the tunnel to make the tunnel environment at least a Class 10.

3. The manufacturing system of claim 2 wherein said means to direct clean air to the top of the tunnel includes an air supply duct in the top of the tunnel and an air filter, said means to withdraw air includes a perforated tunnel floor with an underlying exhaust air duct, and a blower to circulate air.

4. The manufacturing system of claim 3 wherein said air filter is capable of removing particles greater than about 0.10 microns in size.

5. The manufacturing system of claim 1 wherein said branched tunnel has a width that is greater than two times the width of each said guide transport vehicle thereby making possible two-way vehicle traffic.

6. The manufacturing system of claim 5 wherein guiding tape is provided on said bottom of said branched tunnel to maintain orderly lines of vehicle traffic.

7. The manufacturing system of claim 1 wherein each of said guided transport vehicles is provided with a platform for receiving and holding during transport a single wafer carrier and its associated semiconductor wafer.

8. The manufacturing system of claim 6 wherein each of said transport vehicle buffers includes a chamber adjacent to and accessible to said tunnel capable of simultaneously storing at least two transport vehicles.

9. The manufacturing system of claim 8 wherein guide tape is provided in each of said vehicle buffers, said guide tap including a branch off the guide tape in said tunnel to each of said vehicle unload zones and said vehicle load zones.

10. The manufacturing system of claim 9 wherein said wafer carrier buffer is located adjacent to and accessible to said vehicle buffer.

11. The manufacturing system of claim 10 wherein said carrier buffer includes at least one vertically movable stage provided with a plurality of platforms to receive and temporarily store a plurality of wafer carriers.

12. The manufacturing system of claim 11 wherein said wafer carrier handling means includes a first movable arm provided with a means to grip a wafer carrier and transfer it from a transport vehicle at the unload zone to said carrier buffer and a second movable arm provided with a means to grip a wafer carrier and transfer it from said carrier buffer to a transport vehicle.

13. The manufacturing system of claim 12 wherein said wafer carrier buffer includes a first storage means to store wafer carriers received from a transport vehicle at the said unload zone, and a second storage means to store wafer carriers received from the first storage means prior to loading onto a transport vehicle at the said load zone.

14. The manufacturing system of claim 13 wherein said wafer carrier buffer further includes a robot to transfer empty wafer carriers from said first storage means to said second storage means.

15. The manufacturing system of claim 14 wherein said first and said second means to store wafer carriers is each a vertically movable stage provided with a plurality of platforms to receive and temporarily store a plurality of wafer carriers.

16. The manufacturing system of claim 13 wherein said wafer handling means includes a first movable arm provided with a means to grip a wafer and transport it from said first storage means to the associated processing station and a second movable arm provided with a means to grip a wafer and transport it from the processing station to said second storage means.

17. The manufacturing system of claim 1 wherein said vehicle station further includes a first handling means to load an unprocessed wafer onto a wafer carrier and load the wafer carrier onto a transport vehicle, and a second handling means to remove wafer carriers holding processed wafers from transport vehicles, and subsequently remove the processed wafer from the wafer carrier.

18. The manufacturing system of claim 6 wherein said means for directing guided transport vehicles includes an interface to read said memory storage on a wafer carrier, distinct identifying machine readable indicia on said tunnel that identifies the locations of processing stations, an interface on said transport vehicle to read said identifying indicia, a computer means to (1) determine from said process sequence information in said memory storage on said wafer carrier the required next process step, and (2) means to direct the transport vehicle to the required processing station capable of performing the required process step in response to the said identifying indicia on said tunnel.

19. The manufacturing system of claim 18 wherein said identifying machine readable indicia is a bar code.

20. The manufacturing system of claim 19 wherein said identifying machine readable indicia includes a bar code adjacent to each branch of said branched tunnel that indicates the processing stations associated with each branch of the tunnel, and bar code within each branch adjacent each process station to indicate the specific processing station.

21. The manufacturing system of claim 20 wherein said computer means includes a means to direct the transport vehicle to follow said guiding tape in said tunnel that leads into a branch of the tunnel when the processing station is located off a branch of said tunnel.

22. The manufacturing system of claim 21 wherein each processing station has a branched guide tape that leads from the said guiding tape in the tunnel to the vehicle buffer station associated with the processing station.

23. The manufacturing system of claim 22 wherein said computer means has means to direct the transport vehicle to follow the guiding tape that leads to a buffer station associated with the processing station called for by the process sequence in said memory storage of said wafer carrier.

24. The manufacturing system of claim 23 wherein said computer means has means to direct said transport vehicle to said vehicle station upon completion of the process steps in said process sequence in said memory storage of said wafer carrier.

25. A method of manufacturing semiconductor devices in a production line having (a) a plurality of semiconductor wafer processing stations, (b) a tunnel associated with the processing stations, (c) a guided transport vehicle adapted to operate in the tunnel, (d) a plurality of wafer carriers each provided with a memory to accept a wafer process step sequence, (e) a means to maintain a clean environment in the tunnel, (f) handling means at each processing station to transfer a wafer carrier between a transport vehicle and the processing station, and (g) computer means, including interfaces to guide the transport vehicle in the tunnel, load and unload wafer carriers at the various processing stations, in response to instructions from the memories on the wafer carriers, and (h) a vehicle station the method comprised of the following steps:

loading a process sequence into the wafer carrier memory and a wafer onto the wafer carrier;

loading the said wafer carrier onto a transport vehicle;

moving the said transport vehicle to a processing station in response to the information contained in the process sequence stored in the wafer carrier memory;

unloading the wafer carrier at the designated processing station;

performing the designated process at the said processing station;

altering the process sequence of the wafer carrier to indicate the process step performed at the said processing station has been completed;

loading the wafer carrier onto a transport vehicle;

moving the said transport vehicle to the next processing station in response to the said altered process sequence in the said wafer carrier; and

repeating the method steps contained in the process sequence until the process sequence steps in the said wafer carrier are completed.

26. The method of manufacturing semiconductor devices of claim 25 wherein a single wafer carrier is transported to each processing station and individually processed.

27. The method of manufacturing semiconductor devices of claim 26 wherein each of said process stations has a vehicle buffer zone with a transport vehicle unloading zone and a load zone, and wherein said transport vehicle is moved into the unloading zone at a process station, the wafer carrier unloaded, and the transport vehicle directed to a vacant load zone of a vehicle buffer zone of a process station.

28. The method of manufacturing semiconductor devices of claim 27 wherein the transport vehicle will transport the wafer carrier to a vehicle station upon completion of all the process steps in the process sequence for removal from the production line.

29. The method of manufacturing semiconductor devices of claim 27 wherein the wafer carriers at the vehicle buffer zone are transferred to and from a wafer buffer zone, and the wafer is removed from said wafer carrier for processing and returned to the same wafer carrier upon completion of processing at the wafer buffer zone.

30. The method of manufacturing semiconductor devices of claim 29 wherein said process sequence includes a priority indication for the wafer on said carrier, said wafer buffer zone has the capability of storing a plurality of wafer carriers, and wherein the said priority indication of the wafer on each wafer carrier is checked, and the wafer with the highest priority is selected for processing.

31. The method of manufacturing semiconductor devices of claim 30 therein the processing sequence of the wafer selected on the basis of priority is loaded into the processing station capable of performing the process step called for in the process sequence and the process step called for is performed on the wafer.

32. The method of manufacturing semiconductor devices of claim 26 wherein the tunnel has a plurality of branches with a plurality of processing stations located on each branch, wherein said guided transport vehicle locates the process station capable of providing the process step called for in the process sequence by reading indicia adjacent each branch that lists the various process stations on each branch, and upon entering the branch locates the specific processing station by reading indicia adjacent each processing station within the branch.

33. A manufacturing system for individually handling and processing semiconductor wafers through a plurality of processing stations that perform operations on the wafers in accordance with a wafer process sequence comprising:

a plurality of processing stations, each of said stations being capable of performing at least one processing operation on each of said wafers;

a branched track providing a support surface leading to each of said processing stations;

a plurality of wafer carriers, each adapted to support a single wafer;

a plurality of guided transport vehicles adapted to operate on said branched track and move to any of said processing stations associated with said branched track, said transport vehicles adapted to convey at least a single wafer carrier between any of said processing stations;

each of said processing stations being provided with (1) a transport vehicle buffer having an unload zone, and a load zone, (2) a wafer carrier buffer, (3) a wafer carrier handling means adapted to transfer at least a single wafer carrier between a transport vehicle and said wafer carrier buffer, (4) a wafer handling means to move wafers between the wafer carriers and a wafer processing apparatus at each of said processing stations;

a memory storage means on each of said wafer carriers capable of holding the wafer process sequence for the wafer associated with the supporting wafer carrier;

a means for directing said transport vehicles to move wafer carriers sequentially to each processing station in accordance with the wafer processing sequence;

a vehicle station having a wafer carrier loading area where wafers are introduced into the system, and a wafer carrier unload area where processed wafers are removed from the system.

34. The manufacturing system of claim 33, wherein said means for directing said transport vehicles is comprised of a (1) tape provided on said branched track, (2) an interface on each of said transport vehicles to read said memory storage means on said wafer carriers, (3) machine readable indices adjacent said branched track that identify the locations of processing stations, (4) a computer means to determine the process sequence in said memory storage means, and (5) a means to direct each of said transport vehicles to the process station capable of performing the process step called for in the process sequence.

35. The manufacturing system of claim 34 wherein said computer means has means to direct each of said transport vehicles to said vehicle station upon completion of the process steps in said process sequence in said memory storage of said wafer carrier.