Metal electronic package with reduced seal width

• US 5,399,805 A
• Filed: 09/27/1993
• Issued: 03/21/1995
• Est. Priority Date: 10/13/1992
• Status: Expired due to Fees

• Current Assignee: Advanced Technology Incubator Incorporated
• Original Assignee: OLIN Corporation
• Inventors: Braden, Jeffrey S., Pasqualoni, Anthony M., Mahulikar, Deepak, Tyler, Derek E., Hoffman, Paul R.
• Primary Examiner(s): LEDYNH, BOT L
• Application Number:
  US08/126,860
• Time in Patent Office: 540 Days
• Field of Search: 174/52.2, 174/52.4, 257/678, 257/680, 257/682, 257/690, 257/787, 257/788-794, 257/687, 257/692-696
• US Class Current: 174/529
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01052 : Tellurium [Te]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/163 : Connection portion, e.g. seal
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

There is provided an electronic package where the package components define a cavity. A semiconductor device and a portion of a leadframe occupy part of the cavity. Substantially the remainder of the cavity is filled with a compliant polymer, such as a silicone gel. Since the cavity is no longer susceptible to gross leak failure, the seal width of adhesives used to assemble the package may be reduced, thereby increasing the area available for mounting the semiconductor device.

Claims

1. An electronic package, comprising:

a base and a cover defining a cavity and a peripheral dimension of said electronic package;

a leadframe disposed between said base and said cover;

an adhesive having a reduced seal width bonding said leadframe both to said base and to said cover thereby providing an increased area cavity;

a semiconductor device electrically interconnected to said leadframe, wherein said semiconductor device and a portion of said leadframe occupy a portion of said cavity; and

a compliant polymer occupying substantially the remainder of said cavity.

2. The electronic package of claim 1 wherein said compliant polymer is selected from the group consisting of viscous liquids, gels and compliant plastics.

3. The electronic package of claim 2 wherein said compliant polymer is a gel.

4. The electronic package of claim 3 wherein said compliant polymer is a silicone gel.

5. The electronic package of claim 2 wherein said adhesive is selected from the group consisting of thermosetting polymers and thermoplastic polymers.

6. The electronic package of claim 5 wherein said adhesive is a thermoplastic polymer.

7. The electronic package of claim 6 wherein said base and cover are metallic.

8. The electronic package of claim 7 wherein said base and cover are anodized aluminum.

9. The electronic package of claim 8 wherein said compliant polymer is a gel.

10. The electronic package of claim 6 wherein said cover is a glass transparent to a desired electromagnetic radiation.

11. The electronic package of claim 10 wherein said base is anodized aluminum and said cover is silicon dioxide.

12. An electronic package, comprising:

a base and a cover defining a cavity and a peripheral dimension of said electronic package;

a leadframe disposed between said base and said cover and bonded to both;

a first adhesive having a reduced seal width bonding said leadframe both to said base and to said cover thereby providing an increased area cavity;

a thermoplastic second adhesive bonding said leadframe to said cover;

a semiconductor device electrically interconnected to said leadframe, wherein said semiconductor device and a portion said leadframe occupy a portion of said cavity; and

a compliant polymer occupying substantially the remainder of the cavity.

13. The electronic package of claim 12 wherein said compliant polymer is selected from the group consisting of viscous liquids, gels and compliant plastics.

14. The electronic package of claim 13 wherein said compliant polymer is a gel.

15. The electronic package of claim 14 wherein said compliant polymer is a silicone gel.

16. The electronic package of claim 15 wherein said first adhesive is selected from the group consisting of thermosetting polymers and thermoplastic polymers.

17. The electronic package of claim 13 wherein said base and cover are anodized aluminum.

18. The electronic package of claim 13 wherein said cover is a glass transparent to a desired electromagnetic radiation.

19. The electronic package of claim 18 wherein said base is anodized aluminum and said cover is silicon dioxide.