Device for the 3D encapsulation of semiconductor chips

• US 5,400,218 A
• Filed: 03/08/1993
• Issued: 03/21/1995
• Est. Priority Date: 03/10/1992
• Status: Expired due to Term

• Current Assignee: Thomson-CSF
• Original Assignee: Thomson-CSF
• Inventors: Val, Christian
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US08/027,355
• Time in Patent Office: 743 Days
• Field of Search: 174/252, 174/52.2, 165/80.3, 165/185, 257/706, 257/712, 257/713, 257/724, 361/689, 361/690, 361/704, 361/707, 361/709, 361/716, 361/718, 361/719, 361/720, 361/721, 361/761, 361/764, 361/767, 361/768, 361/772, 361/774, 361/776, 361/777, 361/778 , 361/784
• US Class Current: 361/709
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06579 TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 2225/06596 Structural arrangements for testing testing or measuring during manufacture or treatment H01L22/00; testing electrical properties or locating electrical faults G01R31/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01084 : Polonium [Po]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits

Abstract

Disclosed is a 3D encapsulation of semiconductor chips, each chip containing for example an integrated circuit, this encapsulation being aimed at optimising heat dissipation by conduction. Connection means are associated with each chip, making it possible to extend the pads of chips towards three sides of the chip, thus leaving the fourth side free. The chips are stacked on one another and then can be connected to heat dissipation means by their fourth side.

Claims

1. A device for the encapsulation of semiconductor chips comprising a plurality of chips, each of said chips comprising connection pads;

connection means for each of the chips, said connection means comprising an insulating film and conductive tracks positioned on said film, said tracks being connected to the pads by means of conductors, said tracks and conductors making electrical connections extending from the pads of the chips towards at most three of four sides of the chips, the chips with the connection means being fixedly joined to each other by means of an electrically insulating material to form a stack, so that the conductors are flush with the faces of the stack except on at least the face which is located on the fourth side of the chips, electrical connection of the conductors to one another being achieved by connections on the faces of the stack.

2. A device according to claim 1, wherein said face of the stack located on the fourth side of the chips does not have conductors, said stack further comprising stack pads formed on one or more of its faces with the exception of said face, said stack pads being designed for the connection of the stack with external circuits, said connections further linking at least certain of the conductors with the stack pads.

3. A device according to claim 1, wherein said face of the stack which is located on the fourth face of the chips is connected to heat dissipation means.

4. A device according to claim 1 wherein the conductors are wires or strips.

5. A device according to claim 1, wherein said insulating film of said connection means has a surface area smaller than the surface area of said chip, and is positioned on the face of the chip that bears the pads.

6. A device to claim 1, wherein said insulating film of said connection means has dimensions greater than the dimensions of the chip and wherein it is positioned on the rear face of the chip, which does not bear pads.

7. A device according to claim 1, wherein a fourth side of the chip is flush with the face of the stack.

8. A device according to claim 1, wherein said connections comprise a conductive layer covering substantially all the faces of the stack, said conductive layer being etched so as to form said connections.

9. A device according to claim 1, wherein said connections comprise grooves made in the stack and a conductive layer positioned in the grooves.

10. A device according to claim 1, wherein said chips and connection means are embedded in said insulating material.

11. A device according to claim 2, wherein said insulating material is a resin.

12. A semiconductor stack comprising:

(a) a plurality of semiconductor chips each having two major faces and four side faces, a plurality of connection pads distributed on one major face near a periphery of said face close to four sides of said chip, said chip being positioned with the major faces parallel to each other;

(b) a plurality of first conductors extending from the pads on three of said peripherals outward from said chips and substantially parallel to said major faces;

(c) a plurality of central frames of dielectric material, one for each of said chips, and having a plurality of electrically conductive tracks thereon, each of said frames being positioned adjacent to one of said chips, each track having one end near said fourth side of said chip and the other end near one of the three other sides;

(d) a plurality of electrical connections extending between the pads on the fourth of said peripheries of said chips to said one end of said electrically conductive tracks;

(e) a plurality of second conductors extending from said other end of said tracks outward from said chips and frames and substantially parallel to said major surfaces;

(f) an insulating material between said chips and bonding said chips, frames, and conductors into a single stack with the conductors extending to three surfaces of said stack which correspond to said three sides of said chips.

13. A stack according to claim 12, further comprising a third plurality of conductors on said three sides of said stack connected to the first and second conductors at said surfaces.

14. A stack according to claim 12, further comprising a heat sink connected to a fourth surface of said stack which comprises said fourth side surface of said chips, and said heat sink being in good thermal contact with said fourth side of said chips.

15. A stack according to claim 12, wherein said fourth side surface of said chips is at a fourth surface of said stack.

16. A stack according to claim 15, further comprising means for conducting heat connected to said fourth side of said stack.

17. A stack according to claim 12, further comprising a plurality of thermally conductive layers, each of said layers being positioned adjacent said frames on a face of the frame opposite the chip to form a sandwich of chip-frame-layer, and with the sandwiches separated by said insulating material.

18. A stack according to claim 17, wherein said thermally conductive layers extend with edges to a fourth side of said stack, and said fourth side corresponds to a fourth side of said chips.